Abstract: An improved LED positioning structure includes a retaining holder and a cover; multiple slots being disposed on one side of the retaining holder; a slope externally extending beneath each slot gradually and externally extending a slope; a hole connecting through each slot being formed on the bottom of the slope; a positioning channel at the top of the retaining holder for LED pins to respectively penetrate each hole, thus each pin being placed in a slot; a bent part of each pin being formed by the curvature located between the slot and the positioning channel to position the LED mask in the positioning channel; and the cover being positioned at top of the slot to secure the LED in place.

Abstract: An LED chip capping construction to enhance luminance of the LED containing a condenser capping over a chip of the LED; a condensing part of the condenser protruding through a carrier and surrounded by multiple condensing aspects; the source light from the chip passing the condenser and consistently reflected to each condensing aspect due to the medium characteristics of the condenser.

Abstract: The present invention describes a light emitting diode illumination apparatus made of a light bulb base, a heat dissipating device, a plastic lid, a drive substrate, a metal substrate, a circular insulated base and a casing, and the heat dissipating device is in contact with the metal substrate in normal conditions, such that the heat source produced by each light emitting diode is conducted to the heat dissipating device through the metal substrate and then conducted from the heat dissipating device to the light bulb base for effectively dispersing the heat source and maintaining the light emitting efficiency of each light emitting diode.

Abstract: An LED packaging construction has a chip embedded on a recessed carrier on substrate; conduction circuits with different electrodes being disposed to the peripheral of the carrier; electrode layer of chip being connected to conduction circuits with golden plated wire; fluorescent powder being filled in the carrier before mounting the colloid on the powder layer; coverage of colloid extending to substrate to complete LED packaging; larger binding range between colloid and substrate yielding better strength and increased light-emitting angle of the chip through the colloid.

Abstract: An LED manufacturing process involves having a light emitting chip set in a preset loading pit on a carrier with an encapsulating material; conductive circuits with different electrodes being disposed of a substrate on the perimeter of the carrier; golden plated wire connecting the chip and the circuits; ;the carrier being them encapsulated using jet printing technique with a mixture of encapsulating material comprised of fluorescent powder and glue to achieve precise control of the range of jet printing for the encapsulating material to be consistently cover up in the carrier.

Abstract: A white multi-wavelength LED and its manufacturing process has bonded at the bottom of a light emitting chip in a given color a first non-conductive material containing phosphor in a corresponding color to that of the chip to become a die unit; the first non-conductive material functioning as the position where the die unit is bonded to a carrier; golden plated wire constituting the circuit connection of the chip; a second non-conductive material containing phosphor in a color corresponding to that of the chip being injected to cover up the top of the chip to emit the expected white light and effectively promote the luminance performance of the LED.

Abstract: An improved LED positioning structure includes a retaining holder and a cover; multiple slots being disposed on one side of the retaining holder; a slope externally extending beneath each slot gradually and externally extending a slope; a hole connecting through each slot being formed on the bottom of the slope; a positioning channel at the top of the retaining holder for LED pins to respectively penetrate each hole, thus each pin being placed in a slot; a bent part of each pin being formed by the curvature located between the slot and the positioning channel to position the LED mask in the positioning channel; and the cover being positioned at top of the slot to secure the LED in place.

Abstract: A multi-wavelength LED construction and its manufacturing process having respectively coated on the base layer and the position above the peripheral of the light emitting chip a fluorescent material of a specific wavelength to be excited to provide higher light emitting efficiency and expected light color without mutual interference when the chip is conducted so to facilitate quality control of the multi-wavelength LED.

Abstract: A light emitting chip carrier structure includes a basin with a predetermined height protruded from the surface of a substrate for containing a carrier of a light emitting chip, and a package material for packaging the light emitting chip and the basin, so as to greatly increase the light emitting angle of the light emitting chip, while increasing the contact area of the package material, enhancing the adhesion between the package material and the substrate, and improving the overall brightness performance and reliability of the light emitting diode.

Abstract: The present invention discloses a multiple-wavelength light emitting diode that includes a fluorescent layer with a predetermined wavelength disposed at the bottom of the light emitting diode, such that a light emitting chip can be fixed onto a carrier and connected in parallel with the circuit of the light emitting chip by a gold wire. The light emitting chip is packaged by a package material to constitute a light emitting diode capable of combining the light source of the light emitting chip with the wavelength of the fluorescent layer, so as to produces the desired light color.

Abstract: The present invention describes a light emitting diode illumination apparatus made of a light bulb base, a heat dissipating device, a plastic lid, a drive substrate, a metal substrate, a circular insulated base and a casing, and the heat dissipating device is in contact with the metal substrate in normal conditions, such that the heat source produced by each light emitting diode is conducted to the heat dissipating device through the metal substrate and then conducted from the heat dissipating device to the light bulb base for effectively dispersing the heat source and maintaining the light emitting efficiency of each light emitting diode.

Abstract: One or multiple drainage being provided to the edge of an opening on the back of a display panel for each glue-filling gateway in each light emission area of a display to provide a ducking space for glue or gas in the course of glue filling to effectively prevent overflowing glue and air bulbs to further eliminate any protrusion or pit on the back of the display panel for securing a proper binding between the display panel and a substrate.

Abstract: A construction to enhance luminance of a light emitting diode having a plate luminance-enhancing device provided on the surface of electric circuit of the LED; a recess to permit penetration by the LED, wall of the recess facing the reflective wall expanding at a certain inclination in the direction of the dome of the LED to reflect the light source at the position of the peripheral of the LED in the direction of towards the dome of the LED to significantly upgrade the luminance performance of the LED.

Abstract: A LED circuit board construction having the circuit board provided with a pit carrier on a baseboard; multiple conduction circuits of different polarities being provided on the peripheral of the carrier; one end of the conduction circuit facing the carrier related to a chip conductor maintaining a fixed spacing from the carrier; the other end of the conduction circuit related to a service assembly end extending to the edge of the circuit board; a chip being disposed in the carrier; and a golden plated wire connecting an electrode layer of the chip and the chip conductor of the conduction circuit.

Abstract: A construction to enhance luminance of a light emitting diode having a bowl reflector disposed to a carrier of the LED; a chip as the light source being disposed at the center of the bottom of the reflector; multiple reflection blocks surrounding the inner layer of the bowl reflector; each reflection block comprised of multiple transitional reflection surfaces from the bottom towards the top edge of the bowl reflector; and each transitional reflection surface focusing light source from each part of the chip to project the light into the area above the chip to enhance the LED luminance.

Abstract: A chip capping construction for a light emitting diode having capped a transparent transitional layer on the top of the chip; a convex functional layer mixed with fluorescent material being capped on the top of the transparent transitional layer; the thickness at where the functional layer in relation to the top layer of the chip being greater than that of the functional layer in relation to the peripheral of the chip; and the greater thickness balancing the wavelength incorporation of the fluorescent material respectively with the top layer and the peripheral layer of the chip to effectively inhibit the creation of diaphragm of strange color.

Abstract: An LED chip capping construction to enhance luminance of the LED containing a condenser capping over a chip of the LED; a condensing part of the condenser protruding through a carrier and surrounded by multiple condensing aspects; the source light from the chip passing the condenser and consistently reflected to each condensing aspect due to the medium characteristics of the condenser.

Abstract: A high illumination light emitting diode includes a transparent insulator containing conducting ends of different polarities and a carrier; a chip being fixed to the carrier, fluorescent material being applied to the peripheral of the chip; a gold plated wire connecting the electrode and those conducting ends; a reflector being fixed to the carrier on the side attached with the chip; and the light emitted from the chip being projected toward the exterior of the transparent insulator due to the reflection of the reflector to effectively increase the illumination of the light emitting diode.

Abstract: A white-light light emitting diode (LED) and a method for regulating the generated light color of the LED, wherein the LED has at least one InGaN chip and at least one AlGaInP chip. When forward bias voltages are applied on the InGaN chip or AlGaInP chip, blue light and green-yellow light are generated and further mixed to create white light. By adjusting an external impedance value applied on the LED to regulate the forward bias voltages, pure white light is able to be derived based on the regulated brightness strength of the blue light and green-yellow light.

Abstract: A device for generating white light using two types of diode chips includes first, second and third pins that each have a first end and a second end. An illuminant unit has a first diode chip to emit blue light and a second diode chip to emit greenish yellow light. The first diode chip is electrically connected between the first ends of the first and second pins, and the second diode chip is electrically connected between the first ends of the second and third pins. In addition, a packing of white resin is used to enclose the diode chips and the first ends of the pins.