Abstract: A health care device and a health care method are illustrated, the health care method is used to arrange the health care device at a predetermined location in front of a belly button of a user with a predetermined distance, and to emit the low-frequency wave with a predetermined frequency to the belly button by using a low-frequency wave emitter. The health care device is formed by the low-frequency wave emitter and a cone/pyramid part. The predetermined frequency is 1.27 Hz to 1.81 Hz, and the predetermined distance is 5 cm to 8 cm. The above health care device and method can increase contents of active T cells and B cells in blood and increase an ability of NK cell strains for poisoning cancer cell strains (K562). In short, the above health care device and method have health benefits without a risk of excessive energy causing harm.

Abstract: A light emitting device controls its mixed CCT by the configuration of at least one light emitter, at least one diode and at least two power distribution components. The present disclosure is mainly based on the hardware design of diode and jumper, which effectively replaces the resistors and manual switches of the conventional light emitting device with diodes, wherein the resistors and the manual switches of the conventional light emitting device cause voltage instability and other problems. The present disclosure can achieve the demand for miniaturization of the light emitting device by plugging the jumper into pins, and further can achieve the main advantages of stabilizing the voltage of the overall light emitting device, thereby stabilizing the luminous performance of the overall light emitting device, and emitting the mixed light with the required CCT. The present disclosure also illustrates a lamp assembly using the aforementioned light emitting device.

Abstract: A light emitting device controls its mixed CCT by the configuration of at least one light emitter, at least one diode and at least two power distribution components. The present disclosure is mainly based on the hardware design of diode and jumper, which effectively replaces the resistors and manual switches of the conventional light emitting device with diodes, wherein the resistors and the manual switches of the conventional light emitting device cause voltage instability and other problems. The present disclosure can achieve the demand for miniaturization of the light emitting device by plugging the jumper into pins, and further can achieve the main advantages of stabilizing the voltage of the overall light emitting device, thereby stabilizing the luminous performance of the overall light emitting device, and emitting the mixed light with the required CCT. The present disclosure also illustrates a lamp assembly using the aforementioned light emitting device.

Abstract: A health care device and health care method are illustrated. A health care device is used to emit a low-frequency wave of a predetermined frequency forward to an umbilicus of a user, wherein the low-frequency wave is emitted at a predetermined position, and the predetermined position is located in front of the umbilicus of the user with a predetermined distance. The health care device comprises the low-frequency wave emitter, a column and a cone. The predetermined frequency is within a range between 1.27 Hz and 1.81 Hz, and the predetermined distance D is within a range between 5 cm and 8 cm. The health care device and the health care method can increase the content of activated T cells in the blood, so as to achieve effects of convenient operation, accurate identification of the use position, non-invasive treatment, non-contact treatment, and no harm caused by excessive energy risk.

Abstract: A light emitting device controls its mixed CCT by the configuration of at least one light emitter, at least one diode and at least two power distribution components. The present disclosure is mainly based on the hardware design of diode and jumper, which effectively replaces the resistors and manual switches of the conventional light emitting device with diodes, wherein the resistors and the manual switches of the conventional light emitting device cause voltage instability and other problems. The present disclosure can achieve the demand for miniaturization of the light emitting device by plugging the jumper into pins, and further can achieve the main advantages of stabilizing the voltage of the overall light emitting device, thereby stabilizing the luminous performance of the overall light emitting device, and emitting the mixed light with the required CCT. The present disclosure also illustrates a lamp assembly using the aforementioned light emitting device.

Abstract: A control module and an electronic device having the same are disclosed. The control module includes a control panel, a return component, and a conductive element. The control panel includes a conductive port. The return component is disposed on the control panel. The return component includes a first end and a second end, and the return component is electrically contacted with the conductive port. The conductive element includes a first sidewall and a second sidewall. The conductive element is electrically contacted with the first end or the second end.

Abstract: A control module and an electronic device having the same are disclosed. The control module includes a control panel, a return component, and a conductive element. The control panel includes a conductive port. The return component is disposed on the control panel. The return component includes a first end and a second end, and the return component is electrically contacted with the conductive port. The conductive element includes a first sidewall and a second sidewall. The conductive element is electrically contacted with the first end or the second end.

Abstract: A lamp tube coupler is that an insulation terminal seat is respectively disposed to two ends of an expansible outer cylinder. A pair of electrode coupling members is disposed to each insulation terminal seat. The electrode coupling members corresponding to each other at the two ends of the expansible outer cylinder form a conduction mode through respective springs. While using every lamp tube coupler, the coupler is disposed between the two lamp tubes. The electrode coupling members at two ends are respectively inserted into the electrode sockets of the two lamp tubes to achieve the goal of cascading at least two lamp tubes.

Abstract: A heat dissipation device is that at least one rigidly heat-conducting material is disposed to a base of a heat dissipation fin set and extended among heat dissipation fins. At least one flexible superconductor passes through the heat dissipation fins. One end of the flexible superconductor is welded with the rigidly heat-conducting material. A fluid is filled within a flexible tube body of the flexible superconductor and can play a role of rapidly transporting mass of heat in a condition of unchanged temperature to improve the heat conduction efficiency of the heat dissipation fins.

Abstract: A lamp tube coupler is that an insulation terminal seat is respectively disposed to two ends of an expansible outer cylinder. A pair of electrode coupling members is disposed to each insulation terminal seat. The electrode coupling members corresponding to each other at the two ends of the expansible outer cylinder form a conduction mode through respective springs. While using every lamp tube coupler, the coupler is disposed between the two lamp tubes. The electrode coupling members at two ends are respectively inserted into the electrode sockets of the two lamp tubes to achieve the goal of cascading at least two lamp tubes.

Abstract: A chip packaging overflow proof device includes a chip disposed on a substrate; a circuit connected to the chip being provided to each of both sides of the substrate; both of the substrate and the chip being placed in a packaging base; a socket being each provided on both sides of the packaging base to receive insertion by a lid; a first cable-terminating hole being provided between the socket and the lid to permit the circuit to penetrate through; one or a plurality of retaining wall being disposed on the packaging base at where closer to the socket; a second cable-terminating hole being provided on the retaining hole; an overflow space being defined between the retaining wall and the socket; the overflow space being disposed at a level lower than that of the second cable-terminating hole; and the overflow space accepts any squeeze-out from a chip packaging colloid.

Abstract: A multi-wavelength LED construction and its manufacturing process having respectively coated on the base layer and the position above the peripheral of the light emitting chip a fluorescent material of a specific wavelength to be excited to provide higher light emitting efficiency and expected light color without mutual interference when the chip is conducted so to facilitate quality control of the multi-wavelength LED.

Abstract: An LED packaging construction has a chip embedded on a recessed carrier on substrate; conduction circuits with different electrodes being disposed to the peripheral of the carrier; electrode layer of chip being connected to conduction circuits with golden plated wire; fluorescent powder being filled in the carrier before mounting the colloid on the powder layer; coverage of colloid extending to substrate to complete LED packaging; larger binding range between colloid and substrate yielding better strength and increased light-emitting angle of the chip through the colloid.

Abstract: A white multi-wavelength LED and its manufacturing process has bonded at the bottom of a light emitting chip in a given color a first non-conductive material containing phosphor in a corresponding color to that of the chip to become a die unit; the first non-conductive material functioning as the position where the die unit is bonded to a carrier; golden plated wire constituting the circuit connection of the chip; a second non-conductive material containing phosphor in a color corresponding to that of the chip being injected to cover up the top of the chip to emit the expected white light and effectively promote the luminance performance of the LED.

Abstract: A method for manufacturing LED devices is disclosed to manufacture vertical LED devices without removing nonconductive substrates. A conductive substrate is formed on the LED epitaxial layer of the nonconductive substrate to form a LED wafer by bonding or electroplating, which is further cut into a plurality of LED sticks with each space layer bonded between every two LED sticks. Secondly, the plurality of LED sticks and space layers are fixed by a fixture while type I semiconductor layer and active layer of the LED epitaxial layer of each LED stick are covered by each space layer. A transparent conductive layer is further formed thereon whereby to electrically connect with the type II semiconductor layer contrary to type I and are further formed with a plurality of electrodes thereon. Finally the said LED sticks are cut to a plurality of LED devices.

Abstract: A method for forming LED array is disclosed herein. First, a LED wafer, a substrate having a LED epitaxial layer thereon, is cut into a plurality of LED sticks. Then, each space layer is bonded between every two LED sticks to form a LED array.

Abstract: A pad manufacturing process applied in LED epiwafer and a new construction thereof comprising of a means to increase interfacial bonding strength being provided first to the surface of the epiwafer; followed with a metal deposition means provided to the surface of the epiwafer by having the surface processed with plasma to improve adhesion between pad and epiwafer; and plating conditions being controlled to obtain finer and more uniform grains to correct the problem of pad surface roughness in order to improve the bonding strength between pad and bonding wire. Furthermore, a new construction of epiwafer and a pad is comprised of an epiwafer containing a substrate, an epitaxial layer, and a first metal layer covering the top of the epitaxial layer; an adhesion layer covering the top of the first metal layer; and a pad covering the top of the adhesion layer in sequence.

Abstract: A multi-wavelength LED construction and its manufacturing process having respectively coated on the base layer and the position above the peripheral of the light emitting chip a fluorescent material of a specific wavelength to be excited to provide higher light emitting efficiency and expected light color without mutual interference when the chip is conducted so to facilitate quality control of the multi-wavelength LED.

Abstract: A chip packaging overflow proof device includes a chip disposed on a substrate; a circuit connected to the chip being provided to each of both sides of the substrate; both of the substrate and the chip being placed in a packaging base; a socket being each provided on both sides of the packaging base to receive insertion by a lid; a first cable-terminating hole being provided between the socket and the lid to permit the circuit to penetrate through; one or a plurality of retaining wall being disposed on the packaging base at where closer to the socket; a second cable-terminating hole being provided on the retaining hole; an overflow space being defined between the retaining wall and the socket; the overflow space being disposed at a level lower than that of the second cable-terminating hole; and the overflow space accepts any squeeze-out from a chip packaging colloid.