Abstract: A die includes a metal pad, a passivation layer, and a patterned buffer layer over the passivation layer. The patterned buffer layer includes a plurality of discrete portions separated from each other. An under-bump-metallurgy (UBM) is formed in an opening in the patterned buffer layer and an opening in the passivation layer. A metal bump is formed over and electrically coupled to the UBM.

Abstract: A die includes a metal pad, a passivation layer, and a patterned buffer layer over the passivation layer. The patterned buffer layer includes a plurality of discrete portions separated from each other. An under-bump-metallurgy (UBM) is formed in an opening in the patterned buffer layer and an opening in the passivation layer. A metal bump is formed over and electrically coupled to the UBM.

Abstract: A system allows the remote entry of pin data to manufacture a customized lock cylinder assembly. A remote computer communicates with a cylinder manufacturing system (or website) to upload user-selected pin data. The pin data may be stored for future reorders or additional orders. A pinning machine receives the pin data and automatically selects pins to manufacture a customized lock cylinder assembly. The lock cylinder assembly may be completed in seconds and shipped to the user thereby eliminating the need for manual lock customization. In addition, key code data may be provided to a key manufacturing system to automatically manufacture keys corresponding to the customized lock cylinder assembly.

Abstract: A whisk has a handle and a plurality of nested ring members in rotatable engagement with each other at an end portion of the handle. Each ring member has a recess defined in a first circumferential edge, and a projection extending from the circumferential edge to be received in and slidable along a corresponding recess of an adjacent ring member. A plurality of wire loops is secured to the plurality of ring members, each wire loop being secured to a corresponding ring member. Rotation of the ring members in a first direction moves the wire loops to an expanded configuration, and rotation of the ring members in a second direction moves the wire loops to a collapsed configuration. A multi-purpose food-preparing utensil and a method for blending and stir-frying of food are also disclosed.

Abstract: A lock and key mechanism reduces exposure to lock picking by including an extension into a key slot to receive and conceal tapered end portions of key pins. The only portions of key pins exposed in a key slot are cylindrical portions that are difficult to move from a resting position. A key includes a beveled leading edge and a spring-loaded pin activation element at the leading edge of the key. As the key is inserted into the key slot, the spring-loaded pin activation element is compressed to permit entry into the key slot. As the pin activation element reaches a pin, an aperture in the extension allows the spring-loaded pin activation element to move toward the key pin and move the key pin from its resting position. In this activated position, the tapered end portion of the key pin is exposed for further activation by the beveled leading edge of the key. The process is repeated until the pin activation element engages and activates each successive key pin and allows full insertion of the key.

Abstract: A computer readable storage medium includes executable instructions to extract a first language from a first target locale in response to failing to match the target locale to a list of supplied locales, where the list of supplied locales includes all supported locales for which locale-specific data is available. The computer readable storage medium further includes executable instructions to identify a substitute locale within the list of supplied locales based on a total ordering of all supported locales, where the substitute locale includes the first language if the list of supplied locales includes at least one locale within the first language.

Abstract: A circuit substrate includes the following elements. A conductive layer and a dielectric layer are disposed on an inner circuit structure in sequence, and a plurality of conductive blind vias are embedded in the dielectric layer and connected to a portion of the conductive layer. A plating seed layer is disposed between each of the first blind vias and the first conductive layer. Another conductive layer is disposed on the dielectric layer, wherein a portion of the another conductive layer is electrically connected to the conductive layer through the conductive blind vias. A third plating seed layer is disposed between the third conductive layer and each of the first blind vias and on the first dielectric layer.

Abstract: A semiconductor device includes a substrate having a circuit region and a seal ring region. The seal ring region surrounds the circuit region. A seal ring structure is disposed over the seal ring region. The seal ring structure has a first portion and a second portion above the first portion. The first portion has a width W1, and the second portion has a width W2. The width W1 is less than the width W2.

Abstract: A lock mechanism includes a cover plate positionable over a plurality of pin chambers in a cylinder housing wherein one or more of the pin chambers include an internal threaded portion. The lock mechanism includes one or more pin assembly caps that are operative to secure the cover plate to the cylinder housing of the lock by threadably engaging with threaded pin chambers. The pin assembly caps include an internal cavity sized to receive at least a portion of a pin assembly, such that threaded pin chambers and unthreaded pin chambers have substantially the same dimensions without substantially increasing the dimensions required for the lock mechanism. The pin assembly caps include a socket (e.g., a hex socket, a Phillips-type socket, or the like) that allow users to selectively remove and secure the cover plate to the cylinder housing common tools.

Abstract: A wafer defines a plurality of chips arranged in array manner. Each chip includes at least one aluminum pad and a middle material. The middle material covers the aluminum pad and is mounted on the aluminum pad.

Abstract: A die includes a metal pad, a passivation layer, and a patterned buffer layer over the passivation layer. The patterned buffer layer includes a plurality of discrete portions separated from each other. An under-bump-metallurgy (UBM) is formed in an opening in the patterned buffer layer and an opening in the passivation layer. A metal bump is formed over and electrically coupled to the UBM.

Abstract: A wire bonding structure includes a chip and a bonding wire. The chip includes a base material, at least one first metallic pad, a re-distribution layer and at least one second metallic pad. The first metallic pad is disposed on the base material. The re-distribution layer has a first end and a second end, and the first end is electrically connected to the first metallic pad. The second metallic pad is electrically connected to the second end of the re-distribution layer. The bonding wire is bonded to the second metallic pad.

Abstract: A manufacturing process for a thermally enhanced package is disclosed. First, a substrate strip including at least a substrate is provided. Next, at least a chip is disposed on an upper surface of the substrate, and the chip is electrically connected to the substrate. Then, a prepreg and a heat dissipating metal layer are provided, and the heat dissipating metal layer is disposed on a first surface of the prepreg and a second surface of the prepreg faces toward the chip. Finally, the prepreg covers the chip by laminating the prepreg and the substrate.

Abstract: A copper bonding wire includes a line portion and a non-spherical block portion. The non-spherical block portion is physically connected to the line portion, and the cross-sectional area of the non-spherical block portion is bigger than that of the line portion.

Abstract: A lock mechanism includes a cover plate positionable over a plurality of pin chambers in a cylinder housing wherein one or more of the pin chambers include an internal threaded portion. The lock mechanism includes one or more pin assembly caps that are operative to secure the cover plate to the cylinder housing of the lock by threadably engaging with threaded pin chambers. The pin assembly caps include an internal cavity sized to receive at least a portion of a pin assembly, such that threaded pin chambers and unthreaded pin chambers have substantially the same dimensions without substantially increasing the dimensions required for the lock mechanism. The pin assembly caps include a socket (e.g., a hex socket, a Phillips-type socket, or the like) that allow users to selectively remove and secure the cover plate to the cylinder housing common tools.

Abstract: A wire bonding structure of a semiconductor package includes a bonding wire, a pad and a non-conductive adhesive material. The bonding wire includes a line portion and a block portion, wherein the block portion is physically connected to the line portion, and the sectional area of the block portion is bigger than that of the line portion. The pad is bonded to the block portion. The non-conductive adhesive material covers the pad and seals the whole block portion of the bonding wire.

Abstract: A lock and key mechanism reduces exposure to lock picking by including an extension into a key slot to receive and conceal tapered end portions of key pins. The only portions of key pins exposed in a key slot are cylindrical portions that are difficult to move from a resting position. A key includes a beveled leading edge and a spring-loaded pin activation element at the leading edge of the key. As the key is inserted into the key slot, the spring-loaded pin activation element is compressed to permit entry into the key slot. As the pin activation element reaches a pin, an aperture in the extension allows the spring-loaded pin activation element to move toward the key pin and move the key pin from its resting position. In this activated position, the tapered end portion of the key pin is exposed for further activation by the beveled leading edge of the key. The process is repeated until the pin activation element engages and activates each successive key pin and allows full insertion of the key.

Abstract: A wafer defines a plurality of chips arranged in array manner. Each chip includes at least one aluminum pad and a middle material. The middle material covers the aluminum pad and is mounted on the aluminum pad.

Abstract: A wire bonding structure of a semiconductor package includes a bonding wire, a pad and a non-conductive adhesive material. The bonding wire includes a line portion and a block portion, wherein the block portion is physically connected to the line portion, and the sectional area of the block portion is bigger than that of the line portion. The pad is bonded to the block portion. The non-conductive adhesive material covers the pad and seals the whole block portion of the bonding wire.

Abstract: A wire bonding structure includes a chip and a bonding wire. The chip includes a base material, at least one first metallic pad, a re-distribution layer and at least one second metallic pad. The first metallic pad is disposed on the base material. The re-distribution layer has a first end and a second end, and the first end is electrically connected to the first metallic pad. The second metallic pad is electrically connected to the second end of the re-distribution layer. The bonding wire is bonded to the second metallic pad.