Abstract: A monitoring system based on a digital converter station includes a first monitoring terminal deployed at a first-level monitoring side, a second monitoring terminal deployed at a second-level monitoring side, and a third monitoring terminal deployed at a third-level monitoring side; the monitoring terminal at each level includes a communication module, a human-machine interaction module, a device status monitoring module, a device alarm management module, a video fusion processing module, and a data transmission adjustment and control module.

Abstract: The present disclosure relates, in part, to non-terrestrial communication systems, and in some embodiments to the integration of terrestrial and non-terrestrial communication systems. Non-terrestrial communication systems can provide a more flexible communication system with extended wireless coverage range and enhanced service quality compared to conventional communication systems. A method representative of aspects of the present application includes receiving, by an apparatus connected in a first sub-system, from a radio access network, configuration information for performing a channel condition measurement on a second sub-system, reporting, by the apparatus to the radio access network, channel condition measurement of a downlink reference signal received from the second sub-system, transmitting, by the apparatus, a wireless transmission to the second sub-system responsive to the channel condition measurement meeting a predefined condition.

Abstract: The present application discloses a semiconductor package which includes a processor die powered by either a front-side or a backside power delivery network, a plurality of memory dies and control dies stacked over the processor die, a plurality of high-thermal-conductivity (HTC) interconnects formed on, located between and/or placed side-by-side with the dies, a HTC substrate carrying all the dies, a HTC structural member, and a HTC heat spreader/heatsink with the dies and the HTC heat spreader thermally coupled to other HTC components in the semiconductor package. The semiconductor components can be configured to go beyond the traditional single-sided interconnection and cooling topologies to enable dual-or multi-sided cooling, power supply, and signaling.

Abstract: A semiconductor package includes a first integrated circuit (IC) structure. The first IC structure includes: a first body having a first primary surface and a first secondary surface, the first primary surface being substantially perpendicular to the first secondary surface; and an interconnect structure. The interconnect structure includes a primary redistribution layer (RDL) over the first primary surface, the primary RDL having a second secondary surface that is aligned with the first secondary surface of the first body, wherein the first secondary surface and the second secondary surface jointly form a secondary plane. The primary RDL further comprises a first conductive element exposed through the second secondary surface of the primary RDL; and a secondary RDL over the secondary plane, wherein the secondary RDL is electrically connected to the first conductive element of the primary RDL and other conductive elements of the first body exposed through the first secondary plane.

Abstract: A semiconductor package is provided, which includes a processor die powered by either a front-side or a backside power delivery network, a plurality of memory dies and control dies stacked over the processor die, a plurality of high-thermal-conductivity interconnects located between and/or placed side-by-side with the dies, a substrate carrying all the dies with the substrate having a first cavity allowing a liquid to pass through, and a cold plate disposed over and in direct thermal contact with the top dies with the cold plate having a second cavity configured to connect to the first cavity and allowing the liquid to flow between the first and second cavities. This semiconductor package can be configured to go beyond the traditional single-sided interconnection and cooling topologies to enable dual- or multi-sided cooling, power supply, and signaling.

Abstract: A method and system of automatically estimating a ball carrier in team sports.

Abstract: A method and system are provided for scheduling data transmission in a Multiple-Input Multiple-Output (MIMO) system. The MIMO system may comprise at least one MIMO transmitter and at least one MIMO receiver. Feedback from one or more receivers may be used by a transmitter to improve quality, capacity, and scheduling in MIMO communication systems. The method may include generating or receiving information pertaining to a MIMO channel metric and information pertaining to a Channel Quality Indicator (CQI) in respect of a transmitted signal; and sending a next transmission to a receiver using a MIMO mode selected in accordance with the information pertaining to the MIMO channel metric, and an adaptive coding and modulation selected in accordance with the information pertaining to the CQI.

Abstract: Current radio frame structures in Long-Term Evolution (LTE) and New Radio (NR) have some restrictions. A frame structure is disclosed herein that aims to provide more flexibility. Embodiments of the flexible frame structure include different parameters that are flexible, i.e. that are configurable. A non-exhaustive list of parameters that may be configurable include: length of the frame; length of a subframe (if a subframe is even defined); length of a slot and/or number of symbol blocks in a slot (if a slot is even defined); length of the CP and/or data portion in a symbol block, or ratio of CP to data portion, which may vary between symbol blocks; downlink/uplink switching gap length, etc.

Abstract: Methods and devices utilizing artificial intelligence (AI) or machine learning (ML) for customization of a device specific air interface configuration in a wireless communication network are provided. An over the air information exchange to facilitate the training of one or more AI/ML modules involves the exchange of AI/ML capability information identifying whether a device supports AI/ML for optimization of the air interface.

Abstract: A communication apparatus includes a receiver and a transmitter. The receiver, in operation, receives from a neighboring cell a reference signal mapped to at least one first resource element. No signal is received from a serving cell on the at least one first resource element. The transmitter, in operation, transmits to a base station measurement information obtained based on the reference signal.

Abstract: Embodiments are generally directed to methods and apparatuses for determining a frontal body orientation. An embodiment of a method for determining a three-dimensional (3D) orientation of frontal body of a player comprises: detecting each of a plurality of players in each of a plurality of frames captured by a plurality of cameras; for each of the plurality of cameras, tracking each of the plurality of players between continuous frames captured by the camera; and associating the plurality of frames captured by the plurality of cameras to generate the 3D orientation of each of the plurality of players.

Abstract: There are provided a wireless communication method of configuring a measurement resource and a wireless communication device therefor. The method comprises determining a measurement resource to be disregarded when the number of measurement resources configured in one subframe exceeds the maximum number of measurement resources that a user equipment is able to measure in one subframe, wherein the measurement resource with lower priority is determined to be disregarded, and the measurement resource is not disregarded A times within the duration of N subframes, where A is an integer larger than 1, N corresponds to one plus B*periodicity of the measurement resource, and B is an integer equal to or larger than 1.

Abstract: A semiconductor structure includes a substrate and a first circuit containing composite block over the substrate. The first circuit containing composite block includes a through via therein and a re-distribution layer thereon. The first circuit containing composite block includes a semiconductor block and a diamond block.

Abstract: A semiconductor device includes a first semiconductor substrate and a second semiconductor substrate. The first semiconductor substrate includes a first base, a first bonding layer and a first conductive contact. The first bonding layer has a first through via. The first conductive contact is formed within the first through via. The second semiconductor substrate includes a second base, a second bonding layer and a second conductive contact. The second bonding layer has a second through via. The second conductive contact is formed within the second through via. The first conductive contact is electrically connected to the second conductive contact, and the first bonding layer and the second bonding layer are in direct contact with each other.

Abstract: A method to form a first diamond composite wafer, a second diamond composite wafer or a third diamond composite wafer with a predetermined diameter includes the following steps: preparing a plurality of diamond blocks, wherein each diamond block has a dimension smaller than the predetermined diameter; attaching the plurality of diamond blocks to a first semiconductor substrate with the predetermined diameter to form a first temporary composite wafer, wherein a thermal conductivity of the first semiconductor substrate is smaller than that of the diamond block; and filling gaps among the plurality of diamond blocks of the first temporary composite wafer to form the first diamond composite wafer; or attaching the first diamond composite wafer to a second semiconductor substrate with the predetermined diameter to form the second diamond composite wafer, or removing the first semiconductor substrate from the first diamond composite wafer to form the third diamond composite wafer.

Abstract: A method to process a diamond composite wafer includes the following steps: (a). forming a plurality of through vias in the diamond composite wafer and a first re-distribution layer on a firs side of the diamond composite wafer; (b). attaching a temporary carrier to the first re-distribution layer, and forming a second re-distribution layer on a second side of the diamond composite wafer; and (c). releasing the temporary carrier to form a circuit containing diamond composite wafer.

Abstract: A probe card system is provided. The probe card system, including a tester assembly, a probe head body configured to couple with the tester assembly, a first interconnection structure on a first side of the probe head body, and a probe layer structure on the first interconnection structure on the first side of the probe head body which is configured to engage with a wafer under test (WUT). The probe layer structure includes a sacrificial layer in connection with the first interconnection structure, a bonding layer in connection with the sacrificial layer, and a plurality of probe tips each in connection with respective conductive patterns exposed from the bonding layer and electrically coupled to the first interconnection structure. The sacrificial layer allows removal of the bonding layer and the plurality of probe tips via an etching operation. A method of manufacturing a probe card system is also provided.

Abstract: A semiconductor package is provided. The semiconductor package includes an integrated circuit (IC) block and a first substrate. The IC block has a first interconnect layer. The first substrate carries the IC block. The first substrate includes a second interconnect layer facing the first interconnect layer and a third interconnect layer opposite to the second interconnect layer. Furthermore, at least one of the second interconnect layer or the third interconnect layer is composed of a dielectric material and a conductive material substantially identical to a corresponding dielectric material and a corresponding conductive material of the first interconnect layer.

Abstract: An illustrative embodiment disclosed herein is a non-transitory computer readable medium. In some embodiments, the medium includes instructions for providing a mobile user monitoring solution that, when executed by a processor, cause the processor to capture a first message transmitted over a packet forwarding control protocol (PFCP) interface, extract a permanent ID and a first user plane tunnel endpoint identifier (TEID) from the first message, store the permanent ID and the first user plane TEID in a PFCP protocol data unit (PDU) session record, store the permanent ID in a session details record, capture a second message transmitted over a user plane interface after the first message is transmitted, extract a second user plane TEID from the second message, wherein the second user plane TEID matches the first user plane TEID, and retrieve the session details record using the second user plane TEID.

Abstract: A semiconductor device is provided. The semiconductor device includes a core, a first build-up structure and an input/output conductive structure. The core has a first surface and a second surface. The first build-up structure is formed on the first surface and/or the second surface and includes a plurality of first build-up conductive portions. The input/output conductive structure is formed above the first build-up structure and includes a plurality of input/output conductive portions. An input/output line width/line spacing (L/S) of the input/output conductive portions is different from a first L/S of the first build-up conductive portions.