Abstract: A detection device and a detection method of a RAN intelligent controller in open architecture are provided. The detection device includes a standard database, a communication unit, and a judgment unit. The standard database includes multiple pieces of standard specified information, each of which includes an E2 transmission command and E2 qualification data that match each other. The communication unit includes a sending module and a receiving module. The sending module can send the E2 transmission command to a near-real time radio access network intelligent controller, so that the near-real time radio access network intelligent controller can be connected to an evolved node B and a next generation node B through an E2 interface for sending E2 feedback data to the receiving module. The judgment unit selects a matching one of the E2 qualification data according to the E2 transmission command for comparison with the E2 feedback data.

Abstract: An LED and a light emitting device are provided, which includes an epitaxial structure, a transparent conductive layer, an insulating structure and a metal reflective layer. The epitaxial structure includes a first semiconductor layer, an active layer and a second semiconductor layer. The transparent conductive layer is disposed on the second semiconductor layer. The insulating structure is disposed on the transparent conductive layer, and an opening is defined in the insulating structure. The transparent conductive layer is exposed from the opening. A step portion is formed on a sidewall of the opening, and divides the opening into a first opening and a second opening. An opening width of the first opening is smaller than that of the second opening. The metal reflective layer is disposed on the insulating structure. The metal reflective layer fills the first opening and the second opening, and forms electrical contact with the second semiconductor layer.

Abstract: A semiconductor structure includes a substrate including a first surface; a dielectric layer disposed over the first surface of the substrate; a first conductive line surrounded by the dielectric layer and extended over the first surface of the substrate; a second conductive line disposed adjacent to the first conductive line, surrounded by the dielectric layer and extended parallel to the first conductive line; a conductive via disposed over the first conductive line and extended through the dielectric layer; and a cross section of the conductive via substantially parallel to the first surface of the substrate, wherein the cross section of the conductive via is at least partially protruded from the first conductive line towards the second conductive line. Further, a method of manufacturing the semiconductor structure is also disclosed.

Abstract: In an embodiment, a device includes: an integrated circuit die; an encapsulant at least partially surrounding the integrated circuit die, the encapsulant including fillers having an average diameter; a through via extending through the encapsulant, the through via having a lower portion of a constant width and an upper portion of a continuously decreasing width, a thickness of the upper portion being greater than the average diameter of the fillers; and a redistribution structure including: a dielectric layer on the through via, the encapsulant, and the integrated circuit die; and a metallization pattern having a via portion extending through the dielectric layer and a line portion extending along the dielectric layer, the metallization pattern being electrically coupled to the through via and the integrated circuit die.

Abstract: A non-volatile memory device includes at least one memory cell, and the memory cell includes a substrate, a select gate, a control gate, an erase gate, and a floating gate. The select gate is disposed on the substrate. The control gate is disposed on the substrate and laterally spaced apart from the select gate. The erase gate is disposed on the substrate and laterally spaced apart from the control gate, and the erase gate includes a concave corner. The floating gate is covered with the control gate and the erase gate. The floating gate includes a convex corner which faces the concave corner of the erase gate, and the vertex of the floating gate is lower than a top surface of the select gate.

Abstract: A chip structure is provided. The chip structure includes a substrate. The chip structure includes a conductive pad over the substrate. The chip structure includes a passivation layer covering the substrate and exposing the conductive pad. The chip structure includes a first etch stop layer over the passivation layer. The chip structure includes a first buffer layer over the first etch stop layer. The first etch stop layer and the first buffer layer are made of different materials. The chip structure includes a second etch stop layer over the first buffer layer. The second etch stop layer and the first buffer layer are made of different materials.

Abstract: A non-volatile memory device includes at least one memory cell, and the memory cell includes a substrate, a trench, an erase gate, a control gate, and a floating gate. The trench is disposed in the substrate. The erase gate is disposed in the trench and includes a concave corner. The control gate is disposed on the substrate, and a bottom surface of the control gate is higher than a bottom surface of the erase gate. The floating gate is disposed on the substrate, and the floating gate includes a lower tip pointing toward the concave corner of the erase gate and extending beyond a sidewall of the trench.

Abstract: A method of manufacturing a non-volatile memory includes the following steps. A stacked structure is formed on a substrate and includes a gate dielectric layer, an assist gate, an insulation layer, and a sacrificial layer stacked in order. A tunneling dielectric layer is formed at one side of the stacked structure. A floating gate is formed on the tunneling dielectric layer. The stacked structure is etched until an uppermost edge of the floating gate is higher than a top surface of the insulation layer. A dielectric material layer is formed to cover sidewalls of the floating gate. The dielectric material layer is etched to form an etched dielectric material layer and expose the uppermost edge of the floating gate. An upper gate structure is formed on the etched dielectric material layer, where a portion of the etched dielectric material layer is disposed between the upper gate structure and the substrate.

Abstract: A non-volatile memory device includes at least one memory cell, and the at least one memory cell includes a substrate, a stacked structure, a tunneling dielectric layer, a floating gate, a control gate structure, and an erase gate structure. The stacked structure is disposed on the substrate, and includes a gate dielectric layer, an assist gate, and an insulation layer stacked in order. The tunneling dielectric layer is disposed on the substrate at one side of the stacked structure. The floating gate is disposed on the tunneling dielectric layer and includes an uppermost edge and a curved sidewall. The control gate structure covers the curved sidewall of the floating gate. The erase gate structure covers the floating gate and the control gate structure, and the uppermost edge of the floating gate is embedded in the erase gate structure.

Abstract: A light-emitting device includes a semiconductor epitaxial structure including a first semiconductor layer, an active layer, and a second semiconductor layer sequentially stacked in such order in a stacking direction, and including a plurality of through holes. The through holes extend downwardly in a direction from the second semiconductor layer to the first semiconductor layer. The through holes expose a portion of a surface of the first semiconductor layer. The light-emitting device has an ampacity. Each of the through holes has a first radius. A ratio of the first radius to the ampacity ranges from 0.1 to 0.4. A light-emitting apparatus including the light-emitting device is also provided.

Abstract: a combination socket comprises a socket surface that can accommodate multiple different specifications of IEC plugs. This socket surface has recessed grooves, socket cores, and socket holes; the surface of the socket core is equipped with live wire socket holes, neutral wire socket holes, and ground wire socket holes; the grooves include a wide groove located in front of the socket core and a narrow groove located behind the socket core.

Abstract: A detachable antenna and an electronic device are provided. The detachable antenna includes a connector, an antenna module, and a light-emitting module. The light-emitting module includes a light-emitting unit and a bias circuit. The bias circuit includes an input end, a first output end, and a second output end. The input end of the bias circuit receives a mixed signal from the connector. The mixed signal includes a communication signal and a drive signal. The first output end of the bias circuit outputs the communication signal to the antenna module. The second output end of the bias circuit outputs the drive signal to the light-emitting unit. The detachable antenna of the disclosure is integrated with the light-emitting module and receives the mixed signal from a single input end to implement communication and light emitting functions simultaneously.

Abstract: A method includes receiving a pattern layout for a mask, shrinking the pattern layout to form a shrunk pattern, determining centerlines for each of a plurality of features within the shrunk pattern, and snapping the centerline for each of the plurality of features to a grid. The grid represents a minimum resolution size of a mask fabrication tool. The method further includes, after snapping the centerline for each of the plurality of features to the grid, fabricating the mask with the shrunk pattern.

Abstract: A method and apparatus for inter prediction in video coding system are disclosed. According to the method, one or more model parameters of one or more cross-color models for the second-color block are determined. Then, cross-color predictors for the second-color block are determined, wherein one cross-color predictor value for the second-color block is generated for each second-color pixel of the second-color block by applying said one or more cross-color models to corresponding reconstructed or predicted first-color pixels. The input data associated with the second-color block is encoded using prediction data comprising the cross-color predictors for the second-color block at the encoder side, or the input data associated with the second-color block is decoded using the prediction data comprising the cross-color predictors for the second-color block at the decoder side.

Abstract: Embodiments of the present disclosure generally relate to lithography systems. More particularly, embodiments of the present disclosure relate to a method, a system, and a software application for a lithography process to control transmittance rate of write beams and write gray tone patterns in a single exposure operation. In one embodiment, a plurality of shots are provided by an image projection system in a lithography system to a photoresist layer. The plurality of shots exposes the photoresist layer to an intensity of light emitted from the image projection system. The local transmittance rate of the plurality of shots within an exposure area is varied to form varying step heights in the exposure area of the photoresist layer.

Abstract: A method and apparatus for video coding are disclosed. According to the method for the decoder side, encoded data associated with a current block comprising a first-colour block and a second-colour block are received. An inherited model parameter set is determined from a previously coded block coded in a first CCLM related mode, wherein the inherited model parameter set comprises a first scaling parameter associated with the first CCLM related mode. A final inherited model parameter set is derived if an update value for the inherited model parameter set is determined, where the final inherited model parameter set is determined based on the first scaling parameter and the update value. Then, the encoded data associated with the second-colour block are decoded using prediction data based on an updated CCLM related model associated with the final inherited model parameter set. A method and apparatus for the encoder side are also disclosed.

Abstract: A method and apparatus for video coding are disclosed. According to the method for the decoder side, a first syntax, related to whether the current block is coded in a CCLM related mode, is parsed from a bitstream comprising the encoded data for the current block. If the first syntax indicates the current block being coded in the CCLM related mode, a second syntax is parsed from the bitstream, wherein the second syntax is related to whether a multiple model CCLM mode is used or whether one or more model parameters are explicitly signalled or implicitly derived. The model parameters for the second-colour block are determined if the first syntax indicates the current block being coded in a CCLM related mode. The encoded data associated with the second-colour block is then decoded using prediction data comprising the cross-colour predictor for the second-colour block.

Abstract: A method and apparatus for inter prediction in video coding system are disclosed. According to the method, input data associated with a current block comprising at least one colour block are received. A blending predictor is determined according to a weighted sum of at least two candidate predictions generated based on one or more first hypotheses of prediction, one or more second hypotheses of prediction, or both. The first hypotheses of prediction are generated based on one or more intra prediction modes comprising a DC mode, a planar mode or at least one angular modes. The second hypotheses of prediction are generated based on one or more cross-component modes and a collocated block of said at least one colour block. The input data associated with the colour block is encoded or decoded using the blending predictor.

Abstract: A device includes a fin extending from a semiconductor substrate, a gate stack over and along a sidewall of the fin, an isolation region surrounding the gate stack, an epitaxial source/drain region in the fin and adjacent the gate stack, and a source/drain contact extending through the isolation region, including a first silicide region in the epitaxial source/drain region, the first silicide region including NiSi2, a second silicide region on the first silicide region, the second silicide region including TiSix, and a conductive material on the second silicide region.

Abstract: A semiconductor device includes a first conductive layer, a second conductive layer, a third conductive layer, a first organic layer, a first inorganic layer and a first silicon-containing layer. The third conductive layer is disposed between and electrically isolated from the first conductive layer and the second conductive layer. The first organic layer continuously covers the first conductive layer and the third conductive layer. The first inorganic layer is disposed over the first organic layer. The first silicon-containing layer is inserted between the first organic layer and the first inorganic layer, wherein the second conductive layer is disposed on and disposed in the first organic layer, the first silicon-containing layer and the first inorganic layer, to electrically connect to the first conductive layer.