Abstract: The present disclosure provides a method of processing a semiconductor structure. The method includes: placing a first semiconductor structure inside a semiconductor processing apparatus; supplying a solution, wherein the solution is directed toward a surface of the first semiconductor structure, and the solution includes a solvent and a resist; rotating the first semiconductor structure to spread the solution over the surface of the first semiconductor structure; forming a resist layer on the surface of the first semiconductor structure using the resist in the solution; and removing a portion of the solvent from the solution by an exhaust fan disposed adjacent to a periphery of the first semiconductor structure.

Abstract: Various embodiments of the present application are directed towards an integrated chip structure. The integrated chip structure includes a bottom electrode over a substrate, a top electrode over the bottom electrode, and a capacitor insulator structure between the bottom electrode and the top electrode. The capacitor insulator structure includes a first dielectric layer, a second dielectric layer over the first dielectric layer, and a third dielectric layer over the second dielectric layer. The first dielectric layer includes a first dielectric material. The second dielectric layer includes a second dielectric material that is different than the first dielectric material. The second dielectric material is an amorphous solid. The third dielectric layer includes the first dielectric material.

Abstract: A semiconductor package includes an encapsulated semiconductor device, a backside redistribution structure, and a front side redistribution structure. The encapsulated semiconductor device includes an encapsulating material and a semiconductor device encapsulated by the encapsulating material. The backside redistribution structure is disposed on a backside of the encapsulated semiconductor device and includes a redistribution circuit layer and a first patterned dielectric layer. The redistribution circuit layer has a circuit pattern and a dummy pattern electrically insulated from the circuit pattern. The dummy pattern is overlapped with the semiconductor device from a top view of the semiconductor package. The first patterned dielectric layer is disposed on the redistribution circuit layer and includes a marking pattern disposed on the dummy pattern and revealing a part of the dummy pattern.

Abstract: The present disclosure describes techniques for voice-controlled content creation. The techniques comprise monitoring voice commands spoken by a creator. Recording of a content may be initiated in response to recognizing a first voice command spoken by the creator. Recording of the content may be stopped in response to recognizing a second voice command spoken by the creator. A timestamp associated with the second voice command may be created. A segment may be automatically deleted from the content based on the timestamp. The segment may comprise a recording of the second voice command.

Abstract: A phase change random access memory (PCRAM) device includes a memory cell overlying an inter-metal dielectric (IMD) layer, a protection coating, and a first sidewall spacer. The memory cell includes a bottom electrode, a top electrode and a phase change element between the top electrode and the bottom electrode. The protection coating is on an outer sidewall of the phase change element. The first sidewall spacer is on an outer sidewall of the protection coating. The first sidewall spacer has a greater nitrogen atomic concentration than the protection coating. The protection coating forms a first interface with the phase change element. The first interface has a first slope at a first position and a second slope at a second position higher than the first position, the second slope is different from the first slope.

Abstract: A display method and a display system for an anti-dizziness reference image are provided. The display system includes a display, a range extraction unit, an information analyzing unit, an object analyzing unit and an image setting unit. The display is used to display the anti-dizziness reference image. The range extraction unit is used to obtain a gaze background range of a user. The image setting unit is used to set an image hue, an image lightness, an image brightness, an image content or an ambient lighting display content of the anti-dizziness reference image according to a background hue information, a background lightness information, a background brightness information, or a road information of the gaze background range; or set an image ratio between the anti-dizziness reference image and a display area of the display according to an object distance or an object area of the watched object.

Abstract: An integrated circuit device includes a semiconductor layer, an oxide semiconductor layer, and a gate structure. The semiconductor layer is free of oxygen. The oxide semiconductor layer is over and spaced apart from the semiconductor layer. The gate structure wraps around a channel region of the semiconductor layer and a channel region of the oxide semiconductor layer.

Abstract: The present disclosure describes compositions and methods for preparing membrane protein nanosheets and two-dimensional crystals. In particular, the methods employ a solvent. A mixture of a polymer and a membrane protein is solubilized in the solvent, applied to a substrate, and subsequently dried to form the nanosheet or two-dimensional crystal. Applicants have surprisingly found that the membrane proteins maintain their structure when exposed to solvents during the short processing time utilized.

Abstract: A method of manufacturing a semiconductor device is provided. The method includes forming a first non-conductive layer over a top side a semiconductor die and patterning the first non-conductive layer to form a collar structure surrounding an opening exposing a top surface of a bond pad. A second non-conductive layer is formed over the first non-conductive layer and exposed portions of the top side of the semiconductor die. The second non-conductive layer is different from the first non-conductive layer. The second non-conductive layer is patterned to expose the top surface of the bond pad and inner sidewalls of the of the collar structure surrounding the opening such that the second non-conductive layer does not contact the bond pad. A metal redistribution layer is formed over the second non-conductive layer and exposed top surface of the bond pad.

Abstract: Provided is a display panel. The display panel includes a base substrate and a plurality of pixel circuits disposed on the base substrate. At least two pixel circuits in a same column are coupled with a same first initial power line, such that only a small quantity of signal lines need to be disposed on the base substrate.

Abstract: According to the embodiments of the disclosure, a multimedia processing method, device, electronic device, and storage medium are provided by obtaining a first multimedia resource; determining an initial text content corresponding to the first multimedia resource by performing speech recognition on audio data of the first multimedia resource, the audio data of the first multimedia resource comprises speech data of the initial text content; determining an invalid text content in the initial text content, the invalid text content is semantically non-informative; determining a first playing position of speech data of the invalid text content in the first multimedia resource; and cropping the first multimedia resource based on the first playing position to obtain a second multimedia resource, wherein audio data of the second multimedia resource comprises speech data of a target text content but does not comprise the speech data of the invalid text content.

Abstract: A wireless communication method capable of supporting the multi-link operation mode includes establishing a data connection between a wireless access device and a wireless terminal device through a first link and a second link, identifying the first link and the second link, acquiring link status information of the first link and the second link, and allocating uplink transmission data, downlink transmission data, or a data link layer management flow to the first link and the second link by the wireless access device according to the link status information of the first link and the second link. The first link and the second link have different frequencies.

Abstract: Provided are an audio synthesis method and apparatus, an electronic device, and a readable storage medium. In the present solution, conversion from a text to an audio having a target timbre is achieved by means of a pre-trained voice synthesis model, the voice synthesis model comprising a first feature extraction sub-model and a second feature extraction sub-model, wherein the first feature extraction sub-model outputs, according to an inputted text to be processed, an acoustic feature comprising a bottleneck feature; the second feature extraction sub-model outputs, according to the inputted first acoustic features, a Mel spectrum feature corresponding to the text to be processed; according to the Mel spectrum feature corresponding to the text to be processed, the target audio corresponding to the text to be processed is obtained, and the target audio has the target timbre.

Abstract: A protection circuit applied in a hub chip including a power pin, a first data pin, and a second data pin is provided. A voltage generation circuit generates and adjusts output voltage according to the voltage of the power pin and the voltage of the first data pin. A PMOS transistor includes a first gate, a first electrode, a second electrode, and a first bulk. The first electrode is coupled to the power pin. The second electrode is coupled to the first data pin. The first bulk receives the output voltage. A detection circuit is coupled to the first gate and detects the voltage of the power pin. In response to the voltage of the power pin being equal to the first voltage, the detection circuit transmits the voltage of the first data pin to the first gate.

Abstract: A semiconductor package includes an encapsulated semiconductor device, a backside redistribution structure, and a front side redistribution structure. The encapsulated semiconductor device includes an encapsulating material and a semiconductor device encapsulated by the encapsulating material. The backside redistribution structure is disposed on a backside of the encapsulated semiconductor device and includes a redistribution circuit layer and a first patterned dielectric layer. The redistribution circuit layer has a circuit pattern and a dummy pattern electrically insulated from the circuit pattern. The dummy pattern is overlapped with the semiconductor device from a top view of the semiconductor package. The first patterned dielectric layer is disposed on the redistribution circuit layer and includes a marking pattern disposed on the dummy pattern and revealing a part of the dummy pattern.

Abstract: According to the embodiments of the disclosure, a multimedia processing method, device, electronic device, and storage medium are provided by obtaining a first multimedia resource; determining an initial text content corresponding to the first multimedia resource by performing speech recognition on audio data of the first multimedia resource, the audio data of the first multimedia resource comprises speech data of the initial text content; determining an invalid text content in the initial text content, the invalid text content is semantically non-informative; determining a first playing position of speech data of the invalid text content in the first multimedia resource; and cropping the first multimedia resource based on the first playing position to obtain a second multimedia resource, wherein audio data of the second multimedia resource comprises speech data of a target text content but does not comprise the speech data of the invalid text content.

Abstract: Embodiments provide a method and an apparatus for determining speech similarity, and a program product, which relate to speech technology. The method includes: playing exemplary audio, and acquiring evaluation audio of a user, where the exemplary audio is audio of specified content that is read by using a specified language; acquiring a standard pronunciation feature corresponding to the exemplary audio, and extracting, from the evaluation audio, an evaluation pronunciation feature corresponding to the standard pronunciation feature, where the standard pronunciation feature is used to reflect a specific pronunciation of the specified content in the specified language; and determining a feature difference between the standard pronunciation feature and the evaluation pronunciation feature, and determining similarity between the evaluation audio and the exemplary audio according to the feature difference.

Abstract: A method of manufacturing a semiconductor package includes the following steps. A backside redistribution structure is formed, wherein the backside redistribution structure comprises a first dielectric layer, and a redistribution metal layer over the first dielectric layer and comprising a dummy pattern. A semiconductor device is provided over the backside redistribution structure, wherein an active surface of the semiconductor device faces away from the backside redistribution structure, the semiconductor device is electrically insulated from the dummy pattern and overlapped with the dummy pattern from a top view of the semiconductor package. A front side redistribution structure is formed over the semiconductor device, wherein the front side redistribution structure is electrically connected to the semiconductor device. A patterning process is performed on the first dielectric layer to form a marking pattern opening exposing a part of the dummy pattern.

Abstract: The present disclosure provides a method of processing a semiconductor structure. The method includes: placing a first semiconductor structure inside a semiconductor processing apparatus; supplying a solution, wherein the solution is directed toward a surface of the first semiconductor structure, and the solution includes a solvent and a resist; rotating the first semiconductor structure to spread the solution over the surface of the first semiconductor structure; forming a resist layer on the surface of the first semiconductor structure using the resist in the solution; and removing a portion of the solvent from the solution by an exhaust fan disposed adjacent to a periphery of the first semiconductor structure.

Abstract: The present disclosure describes techniques for voice-controlled content creation. The techniques comprise monitoring voice commands spoken by a creator. Recording of a content may be initiated in response to recognizing a first voice command spoken by the creator. Recording of the content may be stopped in response to recognizing a second voice command spoken by the creator. A timestamp associated with the second voice command may be created. A segment may be automatically deleted from the content based on the timestamp. The segment may comprise a recording of the second voice command.