Abstract: According to the embodiments of the disclosure, a multimedia processing method, device, electronic device, and storage medium are provided by obtaining a first multimedia resource; determining an initial text content corresponding to the first multimedia resource by performing speech recognition on audio data of the first multimedia resource, the audio data of the first multimedia resource comprises speech data of the initial text content; determining an invalid text content in the initial text content, the invalid text content is semantically non-informative; determining a first playing position of speech data of the invalid text content in the first multimedia resource; and cropping the first multimedia resource based on the first playing position to obtain a second multimedia resource, wherein audio data of the second multimedia resource comprises speech data of a target text content but does not comprise the speech data of the invalid text content.

Abstract: A wireless communication method capable of supporting the multi-link operation mode includes establishing a data connection between a wireless access device and a wireless terminal device through a first link and a second link, identifying the first link and the second link, acquiring link status information of the first link and the second link, and allocating uplink transmission data, downlink transmission data, or a data link layer management flow to the first link and the second link by the wireless access device according to the link status information of the first link and the second link. The first link and the second link have different frequencies.

Abstract: Provided are an audio synthesis method and apparatus, an electronic device, and a readable storage medium. In the present solution, conversion from a text to an audio having a target timbre is achieved by means of a pre-trained voice synthesis model, the voice synthesis model comprising a first feature extraction sub-model and a second feature extraction sub-model, wherein the first feature extraction sub-model outputs, according to an inputted text to be processed, an acoustic feature comprising a bottleneck feature; the second feature extraction sub-model outputs, according to the inputted first acoustic features, a Mel spectrum feature corresponding to the text to be processed; according to the Mel spectrum feature corresponding to the text to be processed, the target audio corresponding to the text to be processed is obtained, and the target audio has the target timbre.

Abstract: A protection circuit applied in a hub chip including a power pin, a first data pin, and a second data pin is provided. A voltage generation circuit generates and adjusts output voltage according to the voltage of the power pin and the voltage of the first data pin. A PMOS transistor includes a first gate, a first electrode, a second electrode, and a first bulk. The first electrode is coupled to the power pin. The second electrode is coupled to the first data pin. The first bulk receives the output voltage. A detection circuit is coupled to the first gate and detects the voltage of the power pin. In response to the voltage of the power pin being equal to the first voltage, the detection circuit transmits the voltage of the first data pin to the first gate.

Abstract: A semiconductor package includes an encapsulated semiconductor device, a backside redistribution structure, and a front side redistribution structure. The encapsulated semiconductor device includes an encapsulating material and a semiconductor device encapsulated by the encapsulating material. The backside redistribution structure is disposed on a backside of the encapsulated semiconductor device and includes a redistribution circuit layer and a first patterned dielectric layer. The redistribution circuit layer has a circuit pattern and a dummy pattern electrically insulated from the circuit pattern. The dummy pattern is overlapped with the semiconductor device from a top view of the semiconductor package. The first patterned dielectric layer is disposed on the redistribution circuit layer and includes a marking pattern disposed on the dummy pattern and revealing a part of the dummy pattern.

Abstract: According to the embodiments of the disclosure, a multimedia processing method, device, electronic device, and storage medium are provided by obtaining a first multimedia resource; determining an initial text content corresponding to the first multimedia resource by performing speech recognition on audio data of the first multimedia resource, the audio data of the first multimedia resource comprises speech data of the initial text content; determining an invalid text content in the initial text content, the invalid text content is semantically non-informative; determining a first playing position of speech data of the invalid text content in the first multimedia resource; and cropping the first multimedia resource based on the first playing position to obtain a second multimedia resource, wherein audio data of the second multimedia resource comprises speech data of a target text content but does not comprise the speech data of the invalid text content.

Abstract: Embodiments provide a method and an apparatus for determining speech similarity, and a program product, which relate to speech technology. The method includes: playing exemplary audio, and acquiring evaluation audio of a user, where the exemplary audio is audio of specified content that is read by using a specified language; acquiring a standard pronunciation feature corresponding to the exemplary audio, and extracting, from the evaluation audio, an evaluation pronunciation feature corresponding to the standard pronunciation feature, where the standard pronunciation feature is used to reflect a specific pronunciation of the specified content in the specified language; and determining a feature difference between the standard pronunciation feature and the evaluation pronunciation feature, and determining similarity between the evaluation audio and the exemplary audio according to the feature difference.

Abstract: A method of manufacturing a semiconductor package includes the following steps. A backside redistribution structure is formed, wherein the backside redistribution structure comprises a first dielectric layer, and a redistribution metal layer over the first dielectric layer and comprising a dummy pattern. A semiconductor device is provided over the backside redistribution structure, wherein an active surface of the semiconductor device faces away from the backside redistribution structure, the semiconductor device is electrically insulated from the dummy pattern and overlapped with the dummy pattern from a top view of the semiconductor package. A front side redistribution structure is formed over the semiconductor device, wherein the front side redistribution structure is electrically connected to the semiconductor device. A patterning process is performed on the first dielectric layer to form a marking pattern opening exposing a part of the dummy pattern.

Abstract: The present disclosure provides a method of processing a semiconductor structure. The method includes: placing a first semiconductor structure inside a semiconductor processing apparatus; supplying a solution, wherein the solution is directed toward a surface of the first semiconductor structure, and the solution includes a solvent and a resist; rotating the first semiconductor structure to spread the solution over the surface of the first semiconductor structure; forming a resist layer on the surface of the first semiconductor structure using the resist in the solution; and removing a portion of the solvent from the solution by an exhaust fan disposed adjacent to a periphery of the first semiconductor structure.

Abstract: The present disclosure describes techniques for voice-controlled content creation. The techniques comprise monitoring voice commands spoken by a creator. Recording of a content may be initiated in response to recognizing a first voice command spoken by the creator. Recording of the content may be stopped in response to recognizing a second voice command spoken by the creator. A timestamp associated with the second voice command may be created. A segment may be automatically deleted from the content based on the timestamp. The segment may comprise a recording of the second voice command.

Abstract: Present disclosure provides a semiconductor structure and a method for fabricating a semiconductor structure. The semiconductor structure includes a substrate, a conductive layer in the substrate, a conductive bump over the substrate and electrically coupled to the conductive layer, and a dielectric stack, including a polymer layer laterally surrounding the conductive bump and including a portion spaced from a nearest outer edge of the conductive bump with a gap, wherein a first thickness of the polymer layer in a first region is greater than a second thickness of the polymer layer in a second region adjacent to the first region, a first bottom surface of the polymer layer in the first region is leveled with a second bottom surface of the polymer layer in the second region, and a dielectric layer underneath the polymer layer.

Abstract: A method of making a semiconductor device, includes: forming a first molding layer on a substrate; forming a first plurality of vias in the first molding layer; forming a first conductive line over the first molding layer, wherein the first conductive line is laterally disposed over the first molding layer and a first end of the conductive line aligns with and is electrically coupled to a first via of the first plurality of vias; forming a second molding layer above the first molding layer; and forming a second plurality of vias in the second molding layer, wherein a second via of the second plurality of vias aligns with and is electrically coupled to a second end of the conductive line, and wherein the second plurality of vias, the conductive line, and the first plurality of vias are electrically coupled to one another.

Abstract: A method of making a semiconductor device, includes: forming a first molding layer on a substrate; forming a first plurality of vias in the first molding layer; forming a first conductive line over the first molding layer, wherein the first conductive line is laterally disposed over the first molding layer and a first end of the conductive line aligns with and is electrically coupled to a first via of the first plurality of vias; forming a second molding layer above the first molding layer; and forming a second plurality of vias in the second molding layer, wherein a second via of the second plurality of vias aligns with and is electrically coupled to a second end of the conductive line, and wherein the second plurality of vias, the conductive line, and the first plurality of vias are electrically coupled to one another.

Abstract: The present disclosure relates to a sequenced data processing method and device, and a text processing method and device, and relates to the field of data processing.

Abstract: Provided are an epitaxial structure and a semiconductor chip applying same. The epitaxial structure comprises a quantum well structure, a P-type contact layer, and an electrode layer, which are stacked in sequence; the P-type contact layer comprises a first step part and a second step part that are disposed in a step shape, the second step part being closer to the quantum well structure relative to the first step part; the first step part and the second step part are filled with a first insulation part. By means of the described method, the anti-catastrophic optical mirror damage value of a semiconductor chip can be effectively improved.

Abstract: This invention relates to an innovative hair claw clip, which includes at least a first body, a second bod, an automatic opening device and at least four sets of snap-fit structures as main components combined together. Said snap-fit structures are respectively arranged on the adjacent positions of the corresponding first rib of said first body and the second rib of said second body, said snap-fit structures can improve the service life and stability of the hair claw clip during the clamping operation and the opening operation. Moreover, through the new anti-slip structure design, the present invention can be held more firmly by the user, and the hair claw clip sandwiched on the hair will not be easily slipped from the hair even if the hair is not clamped tightly.

Abstract: A control method is provided and used to place a target object on a test platform in a cabin of a testing device, to sense the temperature of the target object by a temperature response structure, and then to receive temperature signals of the temperature response structure by a controller, where the controller can regulate the pressure inside the cabin to control the air pressure of the cabin, so that the target object can still maintain good heat dissipation under high power consumption.

Abstract: The present invention discloses a data transmission method having data reuse mechanism that includes the steps outlined below. A driver corresponding to a communication circuit is operated as a transmission terminal to analyze under-transmitted data to generate reuse setting information, indication information and packets having a complete packet and incomplete packets so as to be transmitted by the transmission terminal through a transmission interface to be received by the communication circuit as a receiving terminal. The receiving terminal identifies the complete packet and the incomplete packets according to the indication information. A data location that a reusable data section corresponds to is determined according to the reuse information. The complete packet is outputted. A non-reusable data section of each of the incomplete packets and the reusable data section of the complete packet are reconstructed to output reconstructed packets according to the data location.

Abstract: A protection circuit applied in a hub chip including a power pin, a first data pin, and a second data pin is provided. A voltage generation circuit generates and adjusts output voltage according to the voltage of the power pin and the voltage of the first data pin. A PMOS transistor includes a first gate, a first electrode, a second electrode, and a first bulk. The first electrode is coupled to the power pin. The second electrode is coupled to the first data pin. The first bulk receives the output voltage. A detection circuit is coupled to the first gate and detects the voltage of the power pin. In response to the voltage of the power pin being equal to the first voltage, the detection circuit transmits the voltage of the first data pin to the first gate.

Abstract: A semiconductor device includes a substrate includes a first layer and a second layer over the first layer, a bump disposed over the second layer, a molding disposed over the second layer and surrounding the bump, and a retainer disposed over the second layer, wherein the retainer is disposed between the molding and a periphery of the substrate. Further, a method of manufacturing a semiconductor device includes providing a substrate, disposing several bumps on the substrate, disposing a retainer on the substrate and surrounding the bumps, and disposing a molding between the bumps and the retainer.