Patents by Inventor Ming Wei

Ming Wei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11974191
    Abstract: A method (50) of, a node device (100) and a computer program product arranged for alerting node devices in a network of operatively interconnected node devices by transmitting an alerting message comprising a geographic location address of an originator node device (21) transmitting the alerting message and a moving direction (12) of an object (11) receiving service from the originator node device (21). When a receiving node device (24, 25) determines, based on its geographic location address, the geographic location address of the originator node device (21) and the moving direction (12), that the object (11) is approaching the receiving node device (24, 25), it transmits the alerting message comprising the geographic location address of the originator node device (21) and the moving direction (12).
    Type: Grant
    Filed: December 15, 2020
    Date of Patent: April 30, 2024
    Assignee: SIGNIFY HOLDING B.V.
    Inventors: Lei Feng, Chang Jie Wang, Gong Ming Wei
  • Patent number: 11969448
    Abstract: A probiotic composition for improving an effect of a chemotherapeutic drug of Gemcitabine on inhibiting pancreatic cancer is disclosed in the present disclosure. The probiotic composition comprises an effective amount of Lactobacillus paracasei GMNL-133, an effective amount of Lactobacillus reuteri GMNL-89, and a pharmaceutically acceptable carrier, wherein the Lactobacillus paracasei GMNL-133 was deposited in the China Center for Type Culture Collection on Sep. 26, 2011 under an accession number CCTCC NO. M 2011331, and the Lactobacillus reuteri GMNL-89 was deposited in the China Center for Type Culture Collection on Nov. 19, 2007 under an accession number CCTCC NO. M 207154. A method for improving the effect of the chemotherapeutic drug of Gemcitabine on inhibiting pancreatic cancer is further disclosed in the present disclosure.
    Type: Grant
    Filed: May 12, 2021
    Date of Patent: April 30, 2024
    Assignee: GENMONT BIOTECH INC.
    Inventors: Wan-Hua Tsai, I-ling Hsu, Shan-ju Hsu, Wen-ling Yeh, Ming-shiou Jan, Wee-wei Chieng, Li-jin Hsu, Ying-chun Lai
  • Publication number: 20240136226
    Abstract: An ammonium fluoride gas may be used to form a protection layer for one or more interlayer dielectric layers, one or more insulating caps, and/or one or more source/drain regions of a semiconductor device during a pre-clean etch process. The protection layer can be formed through an oversupply of nitrogen trifluoride during the pre-clean etch process. The oversupply of nitrogen trifluoride causes an increased formation of ammonium fluoride, which coats the interlayer dielectric layer(s), the insulating cap(s), and/or the source/drain region(s) with a thick protection layer. The protection layer protects the interlayer dielectric layer(s), the insulating cap(s), and/or the source/drain region(s) during the pre-clean process from being etched by fluorine ions formed during the pre-clean process.
    Type: Application
    Filed: January 2, 2024
    Publication date: April 25, 2024
    Inventors: Li-Wei CHU, Ying-Chi SU, Yu-Kai CHEN, Wei-Yip LOH, Hung-Hsu CHEN, Chih-Wei CHANG, Ming-Hsing TSAI
  • Publication number: 20240130276
    Abstract: A riding mowing device includes a seat used for a user to sit on and including a seat cushion and a backrest; a frame for supporting the seat; a cutting assembly including a cutting deck and a mowing element for mowing grass, where the mowing element is at least partially accommodated in the cutting deck, and the cutting assembly is mounted to the frame; a traveling assembly for driving the riding mowing device to travel; a control circuit board for controlling at least the cutting assembly and the traveling assembly; and a power supply assembly for supplying power to at least the cutting assembly and the traveling assembly. At least part of the control circuit board is disposed between the seat and the power supply assembly.
    Type: Application
    Filed: December 11, 2023
    Publication date: April 25, 2024
    Inventors: Li Li, Tianfang Wei, Fan Gao, Liang Chen, Haishen XU, Ming Gao, Min Zhang, Tao Zhang, Jiajun Huang, Yunfei Gao
  • Publication number: 20240131538
    Abstract: An annular airflow regulating apparatus includes a cup-shaped element and an adjustment element. The cup-shaped element has a bowl and a bottom, integrated to form a first chamber. The bottom has a tapered channel parallel to an axis and penetrating through the bottom. A ring-shaped groove is disposed between the tapered channel and the bottom. The ring-shaped groove has an annular plane perpendicular to the axis. The adjustment element, having a tapered portion and second holes, is movably disposed in the cup-shaped element. The tapered portion protrudes into the tapered channel A tapered annular gap is formed between the tapered portion and the tapered channel. When the adjustment element is moved with respect to the cup-shaped element, a width of the tapered annular gap is varied, and thereupon a flow rate and velocity of the process gas would be varied accordingly.
    Type: Application
    Filed: December 8, 2022
    Publication date: April 25, 2024
    Inventors: CHEN-CHUNG DU, Ming-Jyh Chang, Chang-Yi Chen, Ming-Hau Tsai, Ko-Chieh chao, Yi-Wei Lin
  • Publication number: 20240135187
    Abstract: Provided are computing systems, methods, and platforms that train query processing models, such as large language models, to perform query intent classification tasks by using retrieval augmentation and multi-stage distillation. Unlabeled training examples of queries may be obtained, and a set of the training examples may be augmented with additional feature annotations to generate augmented training examples. A first query processing model may annotate the retrieval augmented queries to generate inferred labels for the augmented training examples. A second query processing model may be trained on the inferred labels, distilling the query processing model that was trained with retrieval augmentation into a non-retrieval augmented query processing model. The second query processing model may annotate the entire set of unlabeled training examples. Another stage of distillation may train a third query processing model using the entire set of unlabeled training examples without retrieval augmentation.
    Type: Application
    Filed: October 22, 2023
    Publication date: April 25, 2024
    Inventors: Krishna Pragash Srinivasan, Michael Bendersky, Anupam Samanta, Lingrui Liao, Luca Bertelli, Ming-Wei Chang, Iftekhar Naim, Siddhartha Brahma, Siamak Shakeri, Hongkun Yu, John Nham, Karthik Raman, Raphael Dominik Hoffmann
  • Publication number: 20240136420
    Abstract: A thin film transistor includes a substrate, a semiconductor layer, a gate insulating layer, a gate, a source and a drain. The semiconductor layer is located above the substrate. The gate insulating layer is located above the semiconductor layer. The gate is located above the gate insulating layer and overlapping with the semiconductor layer. The gate includes a first portion, a second portion and a third portion. The first portion is extending along the surface of the gate insulating layer and directly in contact with the gate insulating layer. The second portion is separated from the gate insulating layer. Taking the surface of the gate insulating layer as a reference, the top surface of the second portion is higher than the top surface of the first portion. The third portion connects the first portion to the second portion. The source and the drain are electrically connected to the semiconductor layer.
    Type: Application
    Filed: December 1, 2022
    Publication date: April 25, 2024
    Applicant: AUO Corporation
    Inventors: Kuo-Jui Chang, Wen-Tai Chen, Chi-Sheng Chiang, Yu-Chuan Liao, Chien-Sen Weng, Ming-Wei Sun
  • Publication number: 20240134167
    Abstract: An optical path folding element includes a main body, a light absorption film layer and a matte structure. The main body has optical surface including an incident surface, a reflective surface and an emitting surface. A light enters into the optical folding element through the incident surface. The reflective surface reflects the light so as to change a traveling direction thereof. The light exits the optical folding element through the emitting surface. The light absorbing film layer is configured to reduce reflectance and provided adjacent to at least part of the optical surface, and the light absorbing film layer is in physical contact with the main body. The matte structure is disposed adjacent to at least part of the optical surface. The matte structure provides an undulating profile on a surface of the optical path folding element, and the matte structure is formed in one-piece with the main body.
    Type: Application
    Filed: September 24, 2023
    Publication date: April 25, 2024
    Applicant: LARGAN PRECISION CO., LTD.
    Inventors: Ssu-Hsin LIU, Chen Wei FAN, Chien-Hsun WU, Wen-Yu TSAI, Ming-Ta CHOU
  • Patent number: 11964243
    Abstract: An atomization generator and a special high-pressure atomization generation device for increasing oil and gas field recovery are provided. The special high-pressure atomization generation device for increasing oil and gas field recovery includes an agent pot assembly, a gear pump, a metering pump, an atomization generator and pipelines. The gear pump is connected with the agent pot assembly through an agent pot liquid inlet pipe. The metering pump is arranged between the agent pot assembly and the atomization generator which are connected through the low-pressure manifold pipeline and the high-pressure liquid inlet pipeline. The high-pressure liquid inlet pipeline is connected with the liquid inlet pipe. The liquid inlet pipes are connected with the metering pump. The gas inlet pipe is connected with the high-pressure gas source through the high-pressure gas inlet pipe. The gas inlet cap is provided with a gas inlet pipe.
    Type: Grant
    Filed: August 6, 2021
    Date of Patent: April 23, 2024
    Assignee: Shandong Ruiheng Xingyu Petroleum Technology Development Co., Ltd.
    Inventors: Dayong Li, Tongwu An, Xuegang Liu, Yonglin Zhong, Qiaoling Meng, Jiabu Wang, Jiankui Li, Mingqian Shen, Yuxin Dong, Dongsheng Zhang, Fulin Zheng, Ming Wei
  • Publication number: 20240124437
    Abstract: The present disclosure relates to an injectable lurasidone suspension and a preparation method thereof, and in particular to an irregular form of a lurasidone solid and a pharmaceutical composition thereof. The present disclosure also relates to a preparation method for the solid and the pharmaceutical composition thereof, and an application thereof in the treatment of mental diseases. According to the present disclosure, the lurasidone solid prepared has controllable particle size and has Dv5O particle size of 6 ?m to 110 ?m. The good particle size stability can also he maintained in the pharmaceutical composition. The lurasidone suspension preparation obtained by the method is fast-acting, has a long sustained release period, and can effectively reduce the risk caused by poor patient compliance.
    Type: Application
    Filed: March 21, 2022
    Publication date: April 18, 2024
    Inventors: Ming LI, Xiangyong LIANG, Zhengxing SU, Dan LI, Duo KE, Cong YI, Wei WEI, Guifu DENG, Ya PENG, Dong ZHAO, Jingyi WANG
  • Publication number: 20240128211
    Abstract: Some implementations described herein provide techniques and apparatuses for a stacked semiconductor die package. The stacked semiconductor die package may include an upper semiconductor die package above a lower semiconductor die package. The stacked semiconductor die package includes one or more rows of pad structures located within a footprint of a semiconductor die of the lower semiconductor die package. The one or more rows of pad structures may be used to mount the upper semiconductor die package above the lower semiconductor die package. Relative to another stacked semiconductor die package including a row of dummy connection structures adjacent to the semiconductor die that may be used to mount the upper semiconductor die package, a size of the stacked semiconductor die package may be reduced.
    Type: Application
    Filed: April 27, 2023
    Publication date: April 18, 2024
    Inventors: Chih-Wei WU, An-Jhih SU, Hua-Wei TSENG, Ying-Ching SHIH, Wen-Chih CHIOU, Chun-Wei CHEN, Ming Shih YEH, Wei-Cheng WU, Der-Chyang YEH
  • Publication number: 20240125713
    Abstract: A method includes directing light at a first side of a semiconductor structure; detecting a first light intensity at a second side of the semiconductor structure, wherein the first light intensity corresponds to the light that penetrated the semiconductor structure from the first side to the second side; and comparing the first light intensity to a second light intensity, wherein the second light intensity corresponds to an expected intensity of light.
    Type: Application
    Filed: January 10, 2023
    Publication date: April 18, 2024
    Inventors: Hao Chun Yang, Ming-Da Cheng, Pei-Wei Lee, Mirng-Ji Lii
  • Publication number: 20240126327
    Abstract: The present disclosure provides an electronic wearable device. The electronic wearable device includes a first module having a first contact and a second module having a second contact. The first contact is configured to keep electrical connection with the second contact in moving with respect to each other during a wearing period.
    Type: Application
    Filed: October 14, 2022
    Publication date: April 18, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chao Wei LIU, Wei-Hao CHANG, Yung-I YEH, Jen-Chieh KAO, Tun-Ching PI, Ming-Hung CHEN, Hui-Ping JIAN, Shang-Lin WU
  • Publication number: 20240126003
    Abstract: A light source module and a display device are provided. The light source module includes a light source, a light guide plate, and an optical film set including multiple first optical microstructures having a first surface, multiple second optical microstructures having a second surface, and multiple third optical microstructures having a third surface. Each of the multiple first optical microstructures has a first vertex angle, each of the multiple second optical microstructures has a second vertex angle, and each of the multiple third optical microstructures has a third vertex angle. The third vertex angle is less than the first vertex angle, and the first vertex angle is less than or equal to the second vertex angle. By configuring the aforementioned optical microstructures, the light source module of the disclosure may greatly improve the collimation of light and has favorable luminance.
    Type: Application
    Filed: October 16, 2023
    Publication date: April 18, 2024
    Applicant: Nano Precision Taiwan Limited
    Inventors: Hsin-Wei Chen, Wen-Yen Chiu, Chao-Hung Weng, Ming-Dah Liu
  • Patent number: 11961944
    Abstract: A semiconductor device and a manufacturing method thereof are provided. The semiconductor device includes a semiconductor substrate, active devices and transparent conductive patterns. The active devices are formed on the semiconductor substrate. The transparent conductive patterns are formed over the active devices and electrically connected to the active devices. The transparent conductive patterns are made of a metal oxide material. The metal oxide material has a first crystalline phase with a prefer growth plane rich in oxygen vacancy, and has a second crystalline phase with a prefer growth plane poor in oxygen vacancy.
    Type: Grant
    Filed: January 31, 2023
    Date of Patent: April 16, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chen-En Yen, Ming-Da Cheng, Mirng-Ji Lii, Wen-Hsiung Lu, Cheng-Jen Lin, Chin-Wei Kang, Chang-Jung Hsueh
  • Patent number: 11961796
    Abstract: A package comprises at least one first device die, and a redistribution line (RDL) structure having the at least one first device die bonded thereto. The RDL structure comprises a plurality of dielectric layers, and a plurality of RDLs formed through the plurality of dielectric layers. A trench is defined proximate to axial edges of the RDL structure through each of the plurality of dielectric layers. The trench prevents damage to portions of the RDL structure located axially inwards of the trench.
    Type: Grant
    Filed: August 30, 2021
    Date of Patent: April 16, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yueh-Ting Lin, Hua-Wei Tseng, Ming Shih Yeh, Der-Chyang Yeh
  • Patent number: 11960127
    Abstract: A semiconductor package includes a semiconductor die, a device layer, an insulator layer, a buffer layer, and connective terminals. The device layer is stacked over the semiconductor die. The device layer includes an edge coupler located at an edge of the semiconductor package and a waveguide connected to the edge coupler. The insulator layer is stacked over the device layer and includes a first dielectric material. The buffer layer is stacked over the insulator layer. The buffer layer includes a second dielectric material. The connective terminals are disposed on the buffer layer and reach the insulator layer through contact openings of the buffer layer.
    Type: Grant
    Filed: February 10, 2023
    Date of Patent: April 16, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hsien-Wei Chen, Jie Chen, Ming-Fa Chen
  • Patent number: 11961791
    Abstract: A device includes a redistribution line, and a polymer region molded over the redistribution line. The polymer region includes a first flat top surface. A conductive region is disposed in the polymer region and electrically coupled to the redistribution line. The conductive region includes a second flat top surface not higher than the first flat top surface.
    Type: Grant
    Filed: May 18, 2022
    Date of Patent: April 16, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ching-Wen Hsiao, Ming-Da Cheng, Chih-Wei Lin, Chen-Shien Chen, Chih-Hua Chen, Chen-Cheng Kuo
  • Patent number: 11961919
    Abstract: A method of forming a semiconductor device includes: forming a fin protruding above a substrate, where a top portion of the fin comprises a layer stack that includes alternating layers of a first semiconductor material and a second semiconductor material; forming a dummy gate structure over the fin; forming openings in the fin on opposing sides of the dummy gate structure; forming source/drain regions in the openings; removing the dummy gate structure to expose the first semiconductor material and the second semiconductor material under the dummy gate structure; performing a first etching process to selectively remove the exposed first semiconductor material, where after the first etching process, the exposed second semiconductor material form nanostructures, where each of the nanostructures has a first shape; and after the first etching process, performing a second etching process to reshape each of the nanostructures into a second shape different from the first shape.
    Type: Grant
    Filed: March 21, 2022
    Date of Patent: April 16, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Cheng-Chung Chang, Hsiu-Hao Tsao, Ming-Jhe Sie, Shun-Hui Yang, Chen-Huang Huang, An Chyi Wei, Ryan Chia-Jen Chen
  • Patent number: D1023135
    Type: Grant
    Filed: April 25, 2023
    Date of Patent: April 16, 2024
    Assignee: Novium Taiwan Inc.
    Inventors: Kuo-Hung Liang, Ming-Wei Kuo