Patents by Inventor Ming Xiang

Ming Xiang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190306974
    Abstract: A printed circuit board deformable in both length and width includes a first conductive circuit layer, a second conductive circuit layer, an elastic film, and conductive via holes. The first conductive circuit layer includes first conductive circuits. First honeycomb holes are defined on the first conductive circuits. The second conductive circuit layer faces away from the first conductive circuit layer, the second conductive circuit layer comprises second conductive circuits, second honeycomb holes being defined on the second conductive circuits, each of the second honeycomb holes corresponds to one of the first honeycomb holes. The first conductive circuits are embedded in the elastic film. Each of the conductive via holes corresponds to one first honeycomb holes.
    Type: Application
    Filed: June 21, 2019
    Publication date: October 3, 2019
    Inventors: WEI-XIANG LI, MING-LIANG ZUO
  • Publication number: 20190278846
    Abstract: A semantic extraction method based on a natural language is provided. In a character library based on a single-character granularity, a character of an input natural language is queried, to obtain first semantic vectors representing semantic descriptions of the character. Candidate semantic intentions corresponding to second semantic vectors and weight vectors corresponding to the candidate semantic intentions are obtained, wherein the second semantic vectors are obtained by using a neural network and correspond to different permutations and combinations of the first semantic vectors. A candidate semantic intention is selected as a final semantic intention of the natural language based on a preset condition, and key information is obtained corresponding to the final semantic intention according to a weight vector corresponding to the final semantic intention.
    Type: Application
    Filed: May 30, 2019
    Publication date: September 12, 2019
    Applicant: TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED
    Inventors: Xiao ming XIANG, Fei WANG, Ling LIAO, Xiao bing FENG, Hao XU
  • Publication number: 20190145081
    Abstract: The present application discloses a dredging system for a pre-paved gravel foundation bed surface in open sea deep water, including a dredging mechanism, which includes a dredging suction head, a power component and a dredging pipeline, wherein the dredging suction head is connected with the dredging pipeline; the dredging pipeline is communicated with the power component; the dredging suction head includes at least one ridge surface suction port and at least one furrow suction port; the openings of all the furrow suction ports are lower than those of all the ridge surface suction ports; a lifting mechanism, which is connected with the dredging suction head and is used for lifting the dredging suction head to the gravel foundation bed surface; a moving mechanism, which is connected with the lifting mechanism and is used for driving the dredging suction head to move within a dredging range of the gravel foundation bed surface.
    Type: Application
    Filed: January 12, 2018
    Publication date: May 16, 2019
    Inventors: Ming LIN, Xuejun WANG, Gang YIN, Linlin Yuan, Faqiang SU, Hong XIANG, Bin XIE, Dejin LIU, Bo MENG, Wei XU, Zengjun LI, Jianjun ZHANG, Jinbao LIU, Xiangwei ZHANG, Xiangrong ZHOU, Mingxiang WANG, Hongbo WEI, Chunfeng ZHU, Ziyang BI, Jiangwei SONG, Zhenjie TAO, Ling ZHU
  • Patent number: 10169590
    Abstract: The disclosure discloses an apparatus for displaying a computer health index comprising: a memory having instructions stored thereon; a processor to execute the instructions to perform operations comprising: calculating at least one health sub-index, and calculating the computer health index based on the at least one health sub-index, wherein each health sub-index is associated with at least one computer state, and each health sub-index reflects a health degree of an associated computer state; and performing simple index display to display a small icon reflecting a value of the computer health index in a simple index display area.
    Type: Grant
    Filed: April 21, 2017
    Date of Patent: January 1, 2019
    Assignee: Beijing Qihoo Technology Company Limited
    Inventors: Ming Xiang, Sheng Ou, Ruiqi Wang, Hao Chen, Shengyi Shi, Jianhua Wu, Rixin Gao
  • Patent number: 9900446
    Abstract: An information processing method, an electronic apparatus, and a server are described.
    Type: Grant
    Filed: June 30, 2015
    Date of Patent: February 20, 2018
    Assignee: LENOVO (BEIJING) CO., LTD.
    Inventors: Zhuangzhuang Hao, Daliang Sun, Chenggui Wu, Ming Xiang, Meng Liu
  • Patent number: 9847719
    Abstract: A power supplier for generating a supply voltage includes a PWM signal generator, a power conversion circuit, and first and second error amplifiers. The PWM signal generator generates at least one switching signal according to a voltage error signal. The power conversion circuit generates a switching voltage to an inductor according to the at least one switching signal so as to generate the supply voltage. The first error amplifier detects the difference between a positive voltage signal and a reference voltage. The second error amplifier detects the difference between a negative voltage signal and a ground voltage. Output terminals of the first and second error amplifiers are coupled to a first node. The voltage error signal is generated at the first node. The PWM signal generator modulates a duty cycle of the switching signal according to the variation of the voltage error signal.
    Type: Grant
    Filed: August 18, 2015
    Date of Patent: December 19, 2017
    Assignee: INTEL CORPORATION
    Inventor: Ming-Xiang Lu
  • Patent number: 9783412
    Abstract: A MEMS device for use in some embodiments in a microphone or pressure sensor and method of making the same wherein a portion of the package surrounding the acoustic port is deformed either away from, towards, or both away from and towards the interior of the package. By providing this raised area proximate the acoustic port, external debris is less likely to enter the acoustic port and damage the fragile MEMS die. Further, internal attachment material holding the MEMS die to the inside of the package is prevented by flowing into and obscuring the acoustic port. The advantages of this design include longer operation lifetimes for the MEMS device, greater design freedom, and increases in production yield.
    Type: Grant
    Filed: January 29, 2015
    Date of Patent: October 10, 2017
    Assignee: Unisem (M) Berhad
    Inventors: Junhua Guan, Ming Xiang Tang, Alan Evans
  • Publication number: 20170228545
    Abstract: The disclosure discloses an apparatus for displaying a computer health index comprising: a memory having instructions stored thereon; a processor to execute the instructions to perform operations comprising: calculating at least one health sub-index, and calculating the computer health index based on the at least one health sub-index, wherein each health sub-index is associated with at least one computer state, and each health sub-index reflects a health degree of an associated computer state; and performing simple index display to display a small icon reflecting a value of the computer health index in a simple index display area.
    Type: Application
    Filed: April 21, 2017
    Publication date: August 10, 2017
    Inventors: MING XIANG, SHENG OU, RUIQI WANG, HAO CHEN, SHENGYI SHI, JIANHUA WU, RIXIN GAO
  • Patent number: 9633208
    Abstract: The disclosure discloses an apparatus for displaying a computer health index comprising: a health index calculator configured to calculate one or more health sub-indices, and calculate a computer health index based on the one or more health sub-indices, wherein each health sub-index is associated with one of one or more computer states, and reflects the health degree of the associated computer state; and a simple index display configured to receive the computer health index from the health index calculator, and displaying a small icon reflecting a value of said computer health index.
    Type: Grant
    Filed: May 30, 2013
    Date of Patent: April 25, 2017
    Assignee: Beijing Qihoo Technology Company Limited
    Inventors: Ming Xiang, Sheng Ou, Ruiqi Wang, Hao Chen, Shengyi Shi, Jianhua Wu, Rixin Gao
  • Publication number: 20160373007
    Abstract: A power supplier for generating a supply voltage is provided. The power supplier includes a PWM signal generator, a power conversion circuit, and first and second error amplifiers. The PWM signal generator generates at least one switching signal according to a voltage error signal. The power conversion circuit generates a switching voltage to an inductor according to the at least one switching signal so as to generate the supply voltage. The first error amplifier detects the difference between a positive voltage signal and a reference voltage. The second error amplifier detects the difference between a negative voltage signal and a ground voltage. Output terminals of the first and second error amplifiers are coupled to a first node. The voltage error signal is generated at the first node. The PWM signal generator modulates a duty cycle of the switching signal according to the variation of the voltage error signal.
    Type: Application
    Filed: August 18, 2015
    Publication date: December 22, 2016
    Inventor: Ming-Xiang LU
  • Patent number: 9425150
    Abstract: An interconnect structure and a method of forming the interconnect structure are provided. Two wafers (and/or dies) are bonded together. A multi-via interconnect structure is formed extending from a backside of a first substrate to interconnect structures in the metallization layers on the first integrated circuit and the second integrated circuit. The multi-via interconnect structure may be formed by thinning a first substrate of a first wafer and forming a first opening through the first substrate. A second opening extends from the first opening to a first interconnect structure on the first wafer, and a third opening extends from the first interconnect structure on the first wafer to a second interconnect structure on the second wafer. The first, second, and third openings are filled with a conductive material, thereby forming a multi-via interconnect structure.
    Type: Grant
    Filed: April 21, 2014
    Date of Patent: August 23, 2016
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yu-Fei Huang, Ming Xiang Li, Edward Wan, Jacob Chen, Dun-Nian Yaung, Cheng-Eng Daniel Chen
  • Publication number: 20160241722
    Abstract: An information processing method, an electronic apparatus, and a server are described.
    Type: Application
    Filed: June 30, 2015
    Publication date: August 18, 2016
    Applicant: Lenovo (Beijing) Co., Ltd.
    Inventors: Zhuangzhuang Hao, Daliang Sun, Chenggui Wu, Ming Xiang, Meng Liu
  • Patent number: 9419987
    Abstract: The present invention discloses a method and a device for prompting information about an e-mail. The method comprises: extracting information from a currently opened e-mail; according to the extracted information, determining whether an unsafe webpage link is contained in content of the currently opened e-mail; and if yes, providing security prompting information to a user. By means of the present invention, security is ensured when a person uses an e-mail box.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: August 16, 2016
    Assignee: BEIJING QIHOO TECHNOLOGY COMPANY LIMITED
    Inventors: Rui Xiao, Peng Xiao, Ming Xiang, Gan Ning
  • Publication number: 20160221821
    Abstract: A MEMS device for use in some embodiments in a microphone or pressure sensor and method of making the same wherein a portion of the package surrounding the acoustic port is deformed either away from, towards, or both away from and towards the interior of the package. By providing this raised area proximate the acoustic port, external debris is less likely to enter the acoustic port and damage the fragile MEMS die. Further, internal attachment material holding the MEMS die to the inside of the package is prevented by flowing into and obscuring the acoustic port. The advantages of this design include longer operation lifetimes for the MEMS device, greater design freedom, and increases in production yield.
    Type: Application
    Filed: January 29, 2015
    Publication date: August 4, 2016
    Inventors: Junhua Guan, Ming Xiang Tang, Alan Evans
  • Patent number: 9337354
    Abstract: A method for the manufacture of a package encasing a Micro-Electro-Mechanical Systems (MEMS) device provides a cover having a lid and sidewalls with a port extending through the lid. A first base component is bonded to the sidewalls defining an internal cavity. This first base component further includes an aperture extending therethrough. The MEMS device is inserted through the aperture and bonded to the lid with the MEMS device at least partially overlapping the port. Assembly is completed by bonding a second base component to the first base component to seal the aperture. The package so formed has a cover with a lid, sidewalls and a port extending through the lid. A MEMS device is bonded to the lid and electrically interconnected to electrically conductive features disposed on the first base component. A second base component is bonded to the first base component spanning the aperture.
    Type: Grant
    Filed: July 13, 2015
    Date of Patent: May 10, 2016
    Assignee: Unisem (M) Berhad
    Inventors: Rob Protheroe, Alan Evans, Timothy Leung, Tang Ming Xiang, Guan JunHua
  • Publication number: 20150315014
    Abstract: A method for the manufacture of a package encasing a Micro-Electro-Mechanical Systems (MEMS) device provides a cover having a lid and sidewalls with a port extending through the lid. A first base component is bonded to the sidewalls defining an internal cavity. This first base component further includes an aperture extending therethrough. The MEMS device is inserted through the aperture and bonded to the lid with the MEMS device at least partially overlapping the port. Assembly is completed by bonding a second base component to the first base component to seal the aperture. The package so formed has a cover with a lid, sidewalls and a port extending through the lid. A MEMS device is bonded to the lid and electrically interconnected to electrically conductive features disposed on the first base component. A second base component is bonded to the first base component spanning the aperture.
    Type: Application
    Filed: July 13, 2015
    Publication date: November 5, 2015
    Applicant: UNISEM (M) BERHAD
    Inventors: Rob Protheroe, Alan Evans, Timothy Leung, Tang Ming Xiang, Guan JunHua
  • Publication number: 20150310216
    Abstract: The disclosure discloses an apparatus for displaying a computer health index comprising: a health index calculator configured to calculate one or more health sub-indices, and calculate a computer health index based on the one or more health sub-indices, wherein each health sub-index is associated with one of one or more computer states, and reflects the health degree of the associated computer state; and a simple index display configured to receive the computer health index from the health index calculator, and displaying a small icon reflecting a value of said computer health index.
    Type: Application
    Filed: May 30, 2013
    Publication date: October 29, 2015
    Inventors: MING XIANG, SHENG OU, RUIQI WANG, HAO CHEN, SHENGYI SHI, JIANHUA WU, RIXIN GAO
  • Publication number: 20150228584
    Abstract: An interconnect structure and a method of forming the interconnect structure are provided. Two wafers (and/or dies) are bonded together. A multi-via interconnect structure is formed extending from a backside of a first substrate to interconnect structures in the metallization layers on the first integrated circuit and the second integrated circuit. The multi-via interconnect structure may be formed by thinning a first substrate of a first wafer and forming a first opening through the first substrate. A second opening extends from the first opening to a first interconnect structure on the first wafer, and a third opening extends from the first interconnect structure on the first wafer to a second interconnect structure on the second wafer. The first, second, and third openings are filled with a conductive material, thereby forming a multi-via interconnect structure.
    Type: Application
    Filed: April 21, 2014
    Publication date: August 13, 2015
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yu-Fei Huang, Ming Xiang Li, Edward Wan, Jacob Chen, Dun-Nian Yaung, Cheng-Eng Daniel Chen
  • Patent number: 9082883
    Abstract: A method for the manufacture of a package encasing a Micro-Electro-Mechanical Systems (MEMS) device provides a cover having a lid and sidewalls with a port extending through the lid. A first base component is bonded to the sidewalls defining an internal cavity. This first base component further includes an aperture extending therethrough. The MEMS device is inserted through the aperture and bonded to the lid with the MEMS device at least partially overlapping the port. Assembly is completed by bonding a second base component to the first base component to seal the aperture. The package so formed has a cover with a lid, sidewalls and a port extending through the lid. A MEMS device is bonded to the lid and electrically interconnected to electrically conductive features disposed on the first base component. A second base component is bonded to the first base component spanning the aperture.
    Type: Grant
    Filed: December 27, 2013
    Date of Patent: July 14, 2015
    Assignee: Unisem (M) Berhad
    Inventors: Rob Protheroe, Alan Evans, Timothy Leung, Tang Ming Xiang, Guan JunHua
  • Patent number: 8999757
    Abstract: A method for the manufacture of a package encasing a Micro-Electro-Mechanical Systems (MEMS) device provides a cover having a lid and sidewalls with a port extending through the lid. A first base component is bonded to the sidewalls defining an internal cavity. This first base component further includes an aperture extending therethrough. The MEMS device is inserted through the aperture and bonded said to the lid with the MEMS device at least partially overlapping the port. Assembly is completed by bonding a second base component to the first base component to seal the aperture. The package so formed has a cover with a lid, sidewalls and a port extending through the lid. A MEMS device is bonded to the lid and electrically interconnected to electrically conductive features disposed on the first base component. A second base component is bonded to the first base component spanning the aperture.
    Type: Grant
    Filed: March 4, 2013
    Date of Patent: April 7, 2015
    Assignee: Unisem (M) Berhad
    Inventors: Rob Protheroe, Alan Evans, Timothy Leung, Ming Xiang Tang, JunHua Guan