Abstract: The disclosure discloses an apparatus for displaying a computer health index comprising: a memory having instructions stored thereon; a processor to execute the instructions to perform operations comprising: calculating at least one health sub-index, and calculating the computer health index based on the at least one health sub-index, wherein each health sub-index is associated with at least one computer state, and each health sub-index reflects a health degree of an associated computer state; and performing simple index display to display a small icon reflecting a value of the computer health index in a simple index display area.

Abstract: The disclosure discloses an apparatus for displaying a computer health index comprising: a health index calculator configured to calculate one or more health sub-indices, and calculate a computer health index based on the one or more health sub-indices, wherein each health sub-index is associated with one of one or more computer states, and reflects the health degree of the associated computer state; and a simple index display configured to receive the computer health index from the health index calculator, and displaying a small icon reflecting a value of said computer health index.

Abstract: A power supplier for generating a supply voltage is provided. The power supplier includes a PWM signal generator, a power conversion circuit, and first and second error amplifiers. The PWM signal generator generates at least one switching signal according to a voltage error signal. The power conversion circuit generates a switching voltage to an inductor according to the at least one switching signal so as to generate the supply voltage. The first error amplifier detects the difference between a positive voltage signal and a reference voltage. The second error amplifier detects the difference between a negative voltage signal and a ground voltage. Output terminals of the first and second error amplifiers are coupled to a first node. The voltage error signal is generated at the first node. The PWM signal generator modulates a duty cycle of the switching signal according to the variation of the voltage error signal.

Abstract: An interconnect structure and a method of forming the interconnect structure are provided. Two wafers (and/or dies) are bonded together. A multi-via interconnect structure is formed extending from a backside of a first substrate to interconnect structures in the metallization layers on the first integrated circuit and the second integrated circuit. The multi-via interconnect structure may be formed by thinning a first substrate of a first wafer and forming a first opening through the first substrate. A second opening extends from the first opening to a first interconnect structure on the first wafer, and a third opening extends from the first interconnect structure on the first wafer to a second interconnect structure on the second wafer. The first, second, and third openings are filled with a conductive material, thereby forming a multi-via interconnect structure.

Abstract: An information processing method, an electronic apparatus, and a server are described.

Abstract: The present invention discloses a method and a device for prompting information about an e-mail. The method comprises: extracting information from a currently opened e-mail; according to the extracted information, determining whether an unsafe webpage link is contained in content of the currently opened e-mail; and if yes, providing security prompting information to a user. By means of the present invention, security is ensured when a person uses an e-mail box.

Abstract: A MEMS device for use in some embodiments in a microphone or pressure sensor and method of making the same wherein a portion of the package surrounding the acoustic port is deformed either away from, towards, or both away from and towards the interior of the package. By providing this raised area proximate the acoustic port, external debris is less likely to enter the acoustic port and damage the fragile MEMS die. Further, internal attachment material holding the MEMS die to the inside of the package is prevented by flowing into and obscuring the acoustic port. The advantages of this design include longer operation lifetimes for the MEMS device, greater design freedom, and increases in production yield.

Abstract: A method for the manufacture of a package encasing a Micro-Electro-Mechanical Systems (MEMS) device provides a cover having a lid and sidewalls with a port extending through the lid. A first base component is bonded to the sidewalls defining an internal cavity. This first base component further includes an aperture extending therethrough. The MEMS device is inserted through the aperture and bonded to the lid with the MEMS device at least partially overlapping the port. Assembly is completed by bonding a second base component to the first base component to seal the aperture. The package so formed has a cover with a lid, sidewalls and a port extending through the lid. A MEMS device is bonded to the lid and electrically interconnected to electrically conductive features disposed on the first base component. A second base component is bonded to the first base component spanning the aperture.

Abstract: A method for the manufacture of a package encasing a Micro-Electro-Mechanical Systems (MEMS) device provides a cover having a lid and sidewalls with a port extending through the lid. A first base component is bonded to the sidewalls defining an internal cavity. This first base component further includes an aperture extending therethrough. The MEMS device is inserted through the aperture and bonded to the lid with the MEMS device at least partially overlapping the port. Assembly is completed by bonding a second base component to the first base component to seal the aperture. The package so formed has a cover with a lid, sidewalls and a port extending through the lid. A MEMS device is bonded to the lid and electrically interconnected to electrically conductive features disposed on the first base component. A second base component is bonded to the first base component spanning the aperture.

Abstract: The disclosure discloses an apparatus for displaying a computer health index comprising: a health index calculator configured to calculate one or more health sub-indices, and calculate a computer health index based on the one or more health sub-indices, wherein each health sub-index is associated with one of one or more computer states, and reflects the health degree of the associated computer state; and a simple index display configured to receive the computer health index from the health index calculator, and displaying a small icon reflecting a value of said computer health index.

Abstract: An interconnect structure and a method of forming the interconnect structure are provided. Two wafers (and/or dies) are bonded together. A multi-via interconnect structure is formed extending from a backside of a first substrate to interconnect structures in the metallization layers on the first integrated circuit and the second integrated circuit. The multi-via interconnect structure may be formed by thinning a first substrate of a first wafer and forming a first opening through the first substrate. A second opening extends from the first opening to a first interconnect structure on the first wafer, and a third opening extends from the first interconnect structure on the first wafer to a second interconnect structure on the second wafer. The first, second, and third openings are filled with a conductive material, thereby forming a multi-via interconnect structure.

Abstract: A method for the manufacture of a package encasing a Micro-Electro-Mechanical Systems (MEMS) device provides a cover having a lid and sidewalls with a port extending through the lid. A first base component is bonded to the sidewalls defining an internal cavity. This first base component further includes an aperture extending therethrough. The MEMS device is inserted through the aperture and bonded to the lid with the MEMS device at least partially overlapping the port. Assembly is completed by bonding a second base component to the first base component to seal the aperture. The package so formed has a cover with a lid, sidewalls and a port extending through the lid. A MEMS device is bonded to the lid and electrically interconnected to electrically conductive features disposed on the first base component. A second base component is bonded to the first base component spanning the aperture.

Abstract: A method for the manufacture of a package encasing a Micro-Electro-Mechanical Systems (MEMS) device provides a cover having a lid and sidewalls with a port extending through the lid. A first base component is bonded to the sidewalls defining an internal cavity. This first base component further includes an aperture extending therethrough. The MEMS device is inserted through the aperture and bonded said to the lid with the MEMS device at least partially overlapping the port. Assembly is completed by bonding a second base component to the first base component to seal the aperture. The package so formed has a cover with a lid, sidewalls and a port extending through the lid. A MEMS device is bonded to the lid and electrically interconnected to electrically conductive features disposed on the first base component. A second base component is bonded to the first base component spanning the aperture.

Abstract: The present invention discloses a method and a device for prompting information about an e-mail. The method comprises: extracting information from a currently opened e-mail; according to the extracted information, determining whether an unsafe webpage link is contained in content of the currently opened e-mail; and if yes, providing security prompting information to a user. By means of the present invention, security is ensured when a person uses an e-mail box.

Abstract: An electronic device is connected to an Inter-Integrated Circuit (I2C) expander using an I2C controller of the electronic device. The I2C expander is connected to the servers. Each of the servers corresponds to an identification number. Method of controlling baseboard management controller (BMC) of servers using the electronic device includes receiving identification numbers and determining an operation mode corresponding to each of the identification numbers. According to the identification numbers, each of the identification numbers corresponding to a determined server, servers are determined. The electronic device is controlled to connect to the determined servers. A restart server group comprising one or more determined servers whose operation modes are to restart BMC is determined. A restart signal is transmitted to the restart server group. A BMC of each of the one or more determined servers in the restart server group are controlled to restart according to the restart signal.

Abstract: A method for the manufacture of a package encasing a Micro-Electro-Mechanical Systems (MEMS) device provides a cover having a lid and sidewalls with a port extending through the lid. A first base component is bonded to the sidewalls defining an internal cavity. This first base component further includes an aperture extending therethrough. The MEMS device is inserted through the aperture and bonded said to the lid with the MEMS device at least partially overlapping the port. Assembly is completed by bonding a second base component to the first base component to seal the aperture. The package so formed has a cover with a lid, sidewalls and a port extending through the lid. A MEMS device is bonded to the lid and electrically interconnected to electrically conductive features disposed on the first base component. A second base component is bonded to the first base component spanning the aperture.

Abstract: A method for the manufacture of a package encasing a Micro-Electro-Mechanical Systems (MEMS) device provides a cover having a lid and sidewalls with a port extending through the lid. A first base component is bonded to the sidewalls defining an internal cavity. This first base component further includes an aperture extending therethrough. The MEMS device is inserted through the aperture and bonded to the lid with the MEMS device at least partially overlapping the port. Assembly is completed by bonding a second base component to the first base component to seal the aperture. The package so formed has a cover with a lid, sidewalls and a port extending through the lid. A MEMS device is bonded to the lid and electrically interconnected to electrically conductive features disposed on the first base component. A second base component is bonded to the first base component spanning the aperture.

Abstract: In a method for adjusting display parameters of a monitor of a computing device, the computing device electronically or wirelessly connects to a mouse that includes a primary button, a secondary button, a scroll wheel, a function button and a microcontroller. The microcontroller detects whether the function button is pressed, clicking of the primary button or the secondary button, motions of the scroll wheel, and motions of the mouse. An adjustment mode of the monitor is predefined. The monitor is controlled into the adjustment mode by pressing the function button. The display parameters can be adjusted with the primary button, the secondary button or the scroll wheel when the monitor is in the adjustment mode.

Abstract: In a screen protection system and method, a first operation temperature of an electronic device is detected from each of one or more first temperature sensors, and a first ambient temperature is detected from a second temperature sensor, when a display screen is activated. Once there is no operation on the electronic device, a timer is started timing. Once the electronic device is being operated, a duration is temporarily stored and the timer is reset. If the duration is equal to a screensaver time, a second operation temperature of the electronic device is detected from each of the first temperature sensors, and a second ambient temperature is detected from a second temperature sensor. The method further determines whether the electronic device is currently being held by a hand of a user, according to the above-mentioned temperatures. If the electronic device is not being held by a hand of the user, the display screen is controlled to be in an inactive state.

Abstract: In a system and method for testing a serial port of a computing device, the serial port electronically connects to a test fixture. Test data is sent to a receive data (RXD) pin by a transmit data (TXD) pin. A test result is received from the serial port by the RXD pin. The TXD pin and the RXD pin work normally if the test data is identical to the test result. When voltages of a request to send (RTS) pin and a data terminal ready (DTR) pin are set at high level, the RTS pin, a data carrier detect (DCD) pin, the DTR pin, a ring indicator (RI) pin, a data send ready (DSR) pin and a clear to send (CTS) pin work normally, upon the condition that status values of the serial port indicate the voltages of the above six pins are at high level.