Abstract: A method includes placing a wafer on a rotation mechanism of a metrology device; illuminating, by using a light source of the metrology device, the wafer by an X-ray; rotating, by using the rotation mechanism, the wafer while illuminating the wafer by the X-ray; detecting, by using an image sensor of the metrology device, a transmission portion of the X-ray passing through the wafer while rotating the wafer; and obtaining, by using a processor of the metrology device, a top width and a bottom width of a structure over the wafer based on the transmission portion of the X-ray with different rotating angles of the rotation mechanism.

Abstract: A method of wireless communication by a user equipment (UE) includes receiving, from a serving cell, information to assist the UE with interference cancellation of at least one neighbor cell. The method also includes performing interference cancellation based on the information. A method of wireless communication by a network device includes obtaining information to enable interference cancellation of a neighbor cell. The method also includes transmitting the information to assist a user equipment (UE) with interference cancellation of the neighbor cell.

Abstract: This disclosure provides systems, methods and apparatus for wireless communication. In one aspect, a user equipment (UE) may generate an indication of a first doppler shift associated with the wireless communication device moving with reference to a first target base station (BS), obtain, from the serving BS, a handover command for conditional handover (CHO) (with the handover command including a first trigger for handover to the first target BS), and synchronize with the first target BS during CHO after the first trigger is met, wherein the first trigger is associated with the first doppler shift. In another aspect, a serving BS generates the handover command for CHO and provides the handover command to the UE. The UE is to synchronize with the first target BS during CHO after the first trigger associated with a first doppler shift is met.

Abstract: An immersion-type heat dissipation structure and a method for manufacturing the same are provided. The immersion-type heat dissipation structure includes a first heat dissipation member and a second heat dissipation member that has a plurality of heat dissipation columns and is disposed on the first heat dissipation member. The second heat dissipation member has a porous structure, the first heat dissipation member has a solid structure, and a thermal conductivity of the first heat dissipation member is greater than that of the second heat dissipation member. A shortest distance between two bottoms of any two adjacent ones of the heat dissipation columns is between 0.2 mm and 1.2 mm, a minimum diameter of a top surface of the heat dissipation column is between 0.2 mm and 1.2 mm, and a draft angle formed on a side surface of the heat dissipation column is between 1° and 5°.

Abstract: A composite solid base catalyst, a manufacturing method thereof and a manufacturing method of glycidol are provided. The composite solid base catalyst includes an aluminum carrier and a plurality of calcium particles. The plurality of calcium particles are supported by the aluminum carrier. Beta basic sites of the composite solid base catalyst are 0.58 mmol/g-3.89 mmol/g.

Abstract: A circuit board structure includes a circuit substrate having opposing first and second sides, a redistribution structure disposed at the first side, and a dielectric structure disposed at the second side. The circuit substrate includes a first circuit layer disposed at the first side and a second circuit layer disposed at the second side. The redistribution structure is electrically coupled to the circuit substrate and includes a first leveling dielectric layer covering the first circuit layer, a first thin-film dielectric layer disposed on the first leveling dielectric layer and having a material different from the first leveling dielectric layer, and a first redistributive layer disposed on the first thin-film dielectric layer and penetrating through the first thin-film dielectric layer and the first leveling dielectric layer to be in contact with the first circuit layer. The dielectric structure includes a second leveling dielectric layer disposed below the second circuit layer.

Abstract: A package structure includes at least one first redistribution layer, at least one second redistribution layer, a chip pad, a solder ball pad, a chip, a solder ball, and a molding compound. The first redistribution layer includes a first dielectric layer and a first redistribution circuit that fills a first opening and a second opening of the first dielectric layer. The first dielectric layer is aligned with the first redistribution circuit. The second redistribution layer includes a second and a third dielectric layers and a second redistribution circuit. The third dielectric layer is aligned with the second redistribution circuit. The chip pad and the solder ball pad are electrically connected to the first and the second redistribution circuits respectively. The chip and the solder ball are disposed on the chip pad and the solder ball pad respectively. The molding compound at least covers the chip and the chip pad.

Abstract: A surface modification and joint method for an automobile heat dissipation device and an automobile heat dissipation device having a modified surface are provided. The surface modification and joint method includes providing a metal heat dissipation device, forming a sputtered metal layer that is patterned on a surface of the metal heat dissipation device by sputtering to form a modification area of the metal heat dissipation device so as to modify the surface of the metal heat dissipation device, and jointing a surface of the sputtered metal layer to at least one automobile electronic module by sintering, so that the metal heat dissipation device is thermally coupled to the at least one automobile electronic module.

Abstract: A method for manufacturing a patterned surface coating of an automobile heat dissipation device and an automobile heat dissipation device having a patterned surface coating are provided. The method for manufacturing the patterned surface coating of the automobile heat dissipation device includes providing a metal heat dissipation device, and forming a sputtered metal layer that is patterned on an upper surface of the metal heat dissipation device by sputtering, allowing a thickness of the sputtered metal layer to be between 1 ?m and 3 ?m, and allowing the sputtered metal layer to cover an area less than 90% of an area of the upper surface of the metal heat dissipation device.

Abstract: A method of forming a pattern in a photoresist layer includes forming a photoresist layer over a substrate, and reducing moisture or oxygen absorption characteristics of the photoresist layer. The photoresist layer is selectively exposed to actinic radiation to form a latent pattern, and the latent pattern is developed by applying a developer to the selectively exposed photoresist layer to form a pattern.

Abstract: The present invention provides a probing system, which utilizes a suction nozzle to suck a wafer in probing. A relative distance between the suction nozzle and the probes can be adjusted according the conditions of the probing system, so the system extends the usage life.

Abstract: A method for calculating a bending moment resistance of an internal unbonded post-tensioned composite beam with corrugated steel webs (CSWs) and a double-concrete-filled steel tube (CFST)lower flange includes: determining a degradation law of sectional flexural rigidity of the internal unbonded post-tensioned composite beam with CSWs and a double-CFST lower flange based on numerical analysis, and establishing a sectional flexural rigidity degradation model of the composite beam. The method can include segmenting a bending moment diagram of the composite beam based on the sectional flexural rigidity degradation model, and establishing a segmented integral equation of IUPS strain increment. The method can include establishing an equilibrium equation of force and a bending moment by considering contributions of concrete, the steel tubes, the upper steel flange, the IUPSs, and reinforcement in the composite beam.

Abstract: A semiconductor device includes a plurality of intermediate waveguides. The plurality of intermediate waveguides are vertically disposed on top of one another, and vertically adjacent ones of the plurality of intermediate waveguides are laterally offset from each other. When viewed from the top, each of the plurality of intermediate waveguides essentially consists of a first portion and a second portion, the first portion has a first varying width that increases from a first end of the corresponding intermediate waveguide to a middle of the corresponding intermediate waveguide, and the second portion has a second varying width that decreases from the middle of the corresponding intermediate waveguide to a second end of the corresponding intermediate waveguide.

Abstract: The invention discloses a glass carrier having a protection structure, comprising a glass body and a protection layer. The glass body has a top surface, a bottom surface, and a lateral surface. The protection layer covers the lateral surface of the glass body. The protection layer is a hard material with a stiffness coefficient higher than a stiffness coefficient of the glass body. The invention further discloses a manufacturing method of a glass carrier having a protection structure, comprising the following steps: covering the protection layer around the lateral surface of the glass body, wherein the protection layer is the hard material with the stiffness coefficient higher than the stiffness coefficient of the glass body.

Abstract: The present disclosure provides methods for targeted insertion of an exogenous sequence at a genomic locus in a cell, wherein said insertion is induced by a sequence-specific endonuclease that has cleavage activity at said locus, at least 5 hours before the introduction into said cell of a DNA template comprising said exogenous sequence.

Abstract: A wafer polishing head is provided. The wafer polishing head includes a carrier head, a plurality of piezoelectric actuators disposed on the carrier head, and a membrane disposed over the plurality of piezoelectric actuators. The plurality of piezoelectric actuators is configured to provide mechanical forces on the membrane and generate an electrical charge when receiving counterforces of the mechanical forces through the membrane. A wafer polishing system and a method for polishing a substrate using the same are also provided.

Abstract: A light emitting substrate, a method of driving a light emitting substrate, and a display device are provided. The light emitting substrate includes a plurality of light emitting units arranged in an array. Each light emitting unit includes a driving circuit, a plurality of light emitting elements, and a driving voltage terminal. The plurality of light emitting elements are sequentially connected in series and connected between the driving voltage terminal and the output terminal of the driving circuit. The driving circuit is configured to output a relay signal through the output terminal in a first period according to a first input signal received by the first input terminal and a second input signal received by the second input terminal, and supply a driving signal to the plurality of light emitting elements sequentially connected in series through the output terminal in a second period.

Abstract: A light emitting substrate is provided. The light emitting substrate includes a plurality of light emitting controlling units arranged in M rows and N columns, M is an integer equal to or greater than one, N is an integer equal to or greater than one. A respective column of the N columns of light emitting controlling units includes M number of groups of second voltage signal lines, a respective group of the M number of groups of second voltage signal lines connected to a respective one of the M number of light emitting controlling units, the respective group of the M number of groups of second voltage signal lines including k number of second voltage signal lines, k is an integer equal to or greater than one.

Abstract: The present disclosure discloses a pixel drive circuit and a display panel. The pixel drive circuit includes a Micro-LED, a cathode of which is grounded; a light-emitting control circuit connected with an anode of the Micro-LED and configured to control an emission time of the Micro-LED; a current control circuit connected with the light-emitting control circuit and configured to output a preset current to the light-emitting control circuit to control the Micro-LED to work under a set current density, and luminance efficiency of the Micro-LED under the set current density is greater than a set threshold value.

Abstract: A pellicle for an extreme ultraviolet (EUV) reflective mask includes a pellicle frame and a main membrane attached to the pellicle frame. The main membrane includes a plurality of nanotubes, each of which includes a single nanotube or a co-axial nanotube, and the single nanotube or an outermost nanotube of the co-axial nanotube is a non-carbon based nanotube.