Abstract: A light emitting substrate is provided. The light emitting substrate includes a plurality of light emitting controlling units arranged in M rows and N columns, M is an integer equal to or greater than one, N is an integer equal to or greater than one. A respective column of the N columns of light emitting controlling units includes M number of groups of second voltage signal lines, a respective group of the M number of groups of second voltage signal lines connected to a respective one of the M number of light emitting controlling units, the respective group of the M number of groups of second voltage signal lines including k number of second voltage signal lines, k is an integer equal to or greater than one.

Abstract: A light emitting substrate is provided. The light emitting substrate includes at least one light emitting controlling unit. The at least one light emitting controlling unit includes a plurality of light emitting elements arranged in M rows and N columns and grouped into (PxQ) number of sub-units, M being an integer equal to or greater than one, N being an integer equal to or greater than one, P being an integer equal to or greater than one, and Q being an integer equal to or greater than one; P groups of first voltage signal lines; and Q groups of second voltage signal lines. The (PxQ) number of sub-units are arranged in P rows and Q columns. A respective sub-unit in a p-th row and a q-th column includes K columns of light emitting elements, K being an integer equal to or greater than one.

Abstract: A light emitting substrate is provided. The light emitting substrate includes a plurality of light emitting controlling units arranged in M rows and N columns, M is an integer equal to or greater than one, N is an integer equal to or greater than one, wherein a respective one of the plurality of light emitting controlling units includes a plurality of light emitting elements arranged in J rows and I columns, J being an integer equal to or greater than one, I being an integer equal to or greater than one, a i-th column of the I columns of light emitting elements includes J rows of light emitting elements, 1?i?I; (M×J) number of first voltage signal lines; and (M×J) number of groups of second voltage signal lines.

Abstract: Methods, systems, and devices for wireless communications are described. In a wireless communications system, a user equipment (UE) may determine a preference of the UE for a termination point between a core network and a radio access network (RAN), the core network and the RAN supporting communications for the UE via at least one or a first cell and a second cell each associated with a multi-connectivity mode of the UE. The UE may transmit, to a base station, an indication of the preference of the UE for the termination point. In some cases, the base station may determine the termination point based on receiving the indication of the preference of the UE, and the base station may transmit a message indicating a configuration for the multi-connectivity mode to the UE, the configuration indicating the determined termination point.

Abstract: A method includes illuminating a wafer by an X-ray, detecting a spatial domain pattern produced when illuminating the wafer by the X-ray, identifying at least one peak from the detected spatial domain pattern, and analyzing the at least one peak to obtain a morphology of a transistor structure of the wafer.

Abstract: A light emitting substrate, a method of driving a light emitting substrate, and a display device are provided. The light emitting substrate includes a plurality of light emitting units arranged in an array. Each light emitting unit includes a driving circuit, a plurality of light emitting elements, and a driving voltage terminal. The plurality of light emitting elements are sequentially connected in series and connected between the driving voltage terminal and the output terminal of the driving circuit. The driving circuit is configured to output a relay signal through the output terminal in a first period according to a first input signal received by the first input terminal and a second input signal received by the second input terminal, and supply a driving signal to the plurality of light emitting elements sequentially connected in series through the output terminal in a second period.

Abstract: Nanocrystals, compositions, and methods that aid particle transport in mucus are provided. In some embodiments, the compositions and methods involve making mucus-penetrating particles (MPP) without any polymeric carriers, or with minimal use of polymeric carriers. The compositions and methods may include, in some embodiments, modifying the surface coatings of particles formed of pharmaceutical agents that have a low water solubility. Such methods and compositions can be used to achieve efficient transport of particles of pharmaceutical agents though mucus barriers in the body for a wide spectrum of applications, including drug delivery, imaging, and diagnostic applications. In certain embodiments, a pharmaceutical composition including such particles is well-suited for administration routes involving the particles passing through a mucosal barrier.

Abstract: The present invention relates to anti-TIGIT antibodies that bind to “T cell immunoreceptor with Ig and ITIM domains (TIGIT)”, including multispecific anti-TIGIT antibodies with binding specificity for TIGIT and one or more additional antigen, and methods of using the same. In certain embodiments, the anti-TIGIT antibodies comprises a single domain antibody that binds to TIGIT.

Abstract: An electrode, a method of manufacturing the same, a light-emitting device, and a display device are provided, the electrode includes: a reflective layer; and two double-layer adjusting units stacked on the reflective layer, each including an insulating layer and a conductive layer sequentially arranged and directly contacted in a direction away from the reflective layer. For at least one unit, a via hole is provided in the insulating layer, an electrode lead formed integrally with the conductive layer is provided in the via hole, and electrically connected to the reflective layer through the electrode lead. In each unit, a difference between a thickness of the conductive layer and a thickness of the insulating layer does not exceed a set threshold configured to control the thickness of the insulating layer. The conductive layer farthest from the reflective layer locates on different levels in light-emitting regions of different types of light-emitting devices.

Abstract: Semiconductor structures and methods are provided. A semiconductor structure according to an embodiment includes a substrate having an n well abutting a p well along a boundary. The semiconductor structure also includes a continuous active region over the n well and the p well, a plurality of gate structures over channel regions of the continuous active region, and one gate structure of the plurality of gate structures is disposed directly over the boundary. A portion of the channel region directly under the one gate structure is in direct contact with both an n-type source/drain feature over the p well and a p-type source/drain feature over the n well.

Abstract: An IC includes a first standard cell (SC1) having a first circuit area (CA1) and a first transition area (TA1) placed on an edge of the CA1; and a SC2 having a CA2 and a TA2 placed on an edge of CA2?. CA1 includes a first and a second active region (AR1 and AR2) longitudinally oriented along a first direction (D1), and a first gate stack (G1) along a D2?D1 and extending over AR1 and AR2. G1 includes a first gate segment (GS1) contacting AR1 and a GS2 contacting AR2. GS1 and GS2 are different in composition. GS1 and GS2 are associated with a pFET and a nFET, respectively. TA1 includes a G2 longitudinally oriented along D2 and spans between opposite cell edges of the SC1. G2 is a lengthwise uniform gate stack. SC2 is placed in abutment with the SC1 such that TA1 and TA2 share a common edge.

Abstract: A display panel and a manufacturing method thereof, and a display device. The display panel includes: a base substrate including a display area including a first and a second display area; a first group of light-emitting devices located at the first display area; a first group of pixel driving circuits located at the second display area, configured to drive at least one first light-emitting device; a second group of light-emitting devices located at the second display area; and a second group of pixel driving circuits located at the second display area, and including a plurality of second pixel driving circuits configured to drive the plurality of second light-emitting devices. In a direction perpendicular to the base substrate, one group of pixel driving circuits of the first and second group of pixel driving circuits is located between the other group of pixel driving circuits and the base substrate.

Abstract: A manufacturing method of a chip package structure includes the following steps. A plurality of chips is disposed on a first insulating layer. The back surface of each of the chips is in direct contact with the first insulating layer. A stress buffer layer is formed to extend and cover the active surface and the peripheral surface of each of the chips, and a bottom surface of the stress buffer layer is aligned with the back surface of each of the chips. The stress buffer layer has an opening exposing a part of the active surface of each of the chips, and the redistribution layer is electrically connected to each of the chips through the opening. A plurality of solder balls is electrically connected to the redistribution layer exposed by the blind holes. A singularizing process is performed to form a plurality of chip package structures separated from each other.

Abstract: An immersion heat dissipation structure having a macroscopic fin structure and an immersion heat dissipation structure having a fin structure are provided. The immersion heat dissipation structure having a macroscopic fin structure includes a surface having at least two contact angles. At least one part of the surface has one of the at least two contact angles between an immersion cooling liquid that is greater than 90 degrees, and at least another part of the surface has another one of the at least two contact angles between the immersion cooling liquid that is from 0 degrees to 90 degrees.

Abstract: A light-emitting housing including a housing body, a conductive structure, and a light-emitting element is provided. The housing body has an outer surface and an inner surface. The conductive structure is embedded in the housing body and penetrates the outer surface and the inner surface. A decorative film is attached to the outer surface of the housing body. The light-emitting element is disposed on the outer surface of the housing body. The light-emitting element has two wires coupled to the conductive structure. The electric structure is adapted to transmit a current to the two wires, so that the light-emitting element emits light.

Abstract: A kind of plastic is provided. With a total of 100 parts by weight, the plastic includes the following components in parts by weight: 25 to 90 parts of matrix resin; 1 to 60 parts of laser reflecting agent; and 0 to 70 parts of inorganic filler, where the inorganic filler is capable of being chemically corroded. When the matrix resin includes a resin component capable of being chemically corroded, parts by weight of the inorganic filler are greater than or equal to 0 parts; or when the matrix resin is fully a resin component incapable of being chemically corroded, parts by weight of the inorganic filler are greater than 0 parts. For the plastic, a low roughness surface can be obtained through chemical roughening, to form a desirable coating binding surface, and help implement metallization.

Abstract: A method for forming resistance on circuit board is provided and includes the following steps. First, a substrate is provided. Next, a second metal layer is provided on the substrate, and the first metal layer is covered by the second metal layer. Then, a resistance is formed on the second metal layer, and the resistance is directly above the first metal layer. Thereafter, the second metal layer is cut so that the edge of the second metal layer is aligned with that of the first metal layer. The second metal layer is separated from the first metal layer. Next, the second metal layer is pressed with a circuit board, and the resistance is attached to a dielectric layer of the circuit board. Then, the second metal layer is etched to form a circuit pattern on the resistance.

Abstract: Disclosed are a pixel circuit and a driving method thereof, an array substrate and a display apparatus. The pixel circuit includes a pixel sub-circuit. The pixel sub-circuit includes a first adjusting circuit and a second adjusting circuit. The first adjusting circuit is configured to receive a first data signal and a light emitting control signal to control a magnitude of a driving current used for driving a light emitting element to emit light; the second adjusting circuit is configured to receive a second data signal and a time control signal to control a time duration in which the driving current is applied to the light emitting element; and the time control signal changes within a time period during which the light emitting control signal allows the driving current to be generated.

Abstract: A mechanical arm system includes at least two links, at least two control devices and at least two motor devices. Each of the control devices includes a first control unit, a mechanical arm control unit and a driving unit. The first control unit receives an end-position command to output a first torque signal. The mechanical arm control unit includes a rigid mechanical unit and a mechanical model unit. The rigid mechanical unit receives the first torque signal to obtain a rigid mechanical torque, and the mechanical model unit receives the rigid mechanical torque and operates the flexible mechanical model to establish the mechanical arm model for obtaining the target torque, and the target position signal is output according to the target torque. The driving unit generates a driving signal according to the target position signal to adjust a rotation angle of the corresponding motor device.

Abstract: A user equipment and a buffer status report (BSR) cancellation method are provided. In the method, the data duplication is activated on at least one data unit of packet data convergence protocol (PDCP). The data duplication works such that, in the carrier aggregation (CA), one data unit corresponds to at least two component carriers provided by a base station supporting integrated access and backhaul (IAB) mechanism. For each data unit, at least two BSRs are triggered, and each BSR corresponds to one logical channel. Then, at least one BSR is canceled according to a canceling condition. Accordingly, the IAB network can be applied with multiple BSR cancellation.