Abstract: A method for detecting and compensating CNC tools being implemented in an electronic device, receives from a detector first parameters and second parameters in respect of a first tool. Such first parameters include at least one of service life, blade break information, and blade chipping information of the first tool, and such second parameters include at least one of length extension information, length wear information, radial wear information, and blade thickness wear information of the first tool. Based on the first parameters, instructions to process the workpiece are transmitted or not. Upon receiving the second parameters, instructions to adjust operation of the first tool are transmitted, to compensate for deterioration in normal use.

Abstract: A method includes attaching a package component to a package substrate, the package component includes: an interposer disposed over the package substrate; a first die disposed along the interposer; and a second die disposed along the interposer, the second die being laterally adjacent the first die; attaching a first thermal interface material to the first die, the first thermal interface material being composed of a first material; attaching a second thermal interface material to the second die, the second thermal interface material being composed of a second material different from the first material; and attaching a lid assembly to the package substrate, the lid assembly being further attached to the first thermal interface material and the second thermal interface material.

Abstract: A semiconductor device includes a plurality of channel layers vertically separated from one another. The semiconductor device also includes an active gate structure comprising a lower portion and an upper portion. The lower portion wraps around each of the plurality of channel layers. The semiconductor device further includes a gate spacer extending along a sidewall of the upper portion of the active gate structure. The gate spacer has a bottom surface. Moreover, a dummy gate dielectric layer is disposed between the gate spacer and a topmost channel layer of plurality of channel layers. The dummy gate dielectric layer is in contact with a top surface of the topmost channel layer, the bottom surface of the gate spacer, and the sidewall of the gate structure.

Abstract: A semiconductor device includes a substrate. The semiconductor device includes a fin that is formed over the substrate and extends along a first direction. The semiconductor device includes a gate structure that straddles the fin and extends along a second direction perpendicular to the first direction. The semiconductor device includes a first source/drain structure coupled to a first end of the fin along the first direction. The gate structure includes a first portion protruding toward the first source/drain structure along the first direction. A tip edge of the first protruded portion is vertically above a bottom surface of the gate structure.

Abstract: A package structure is provided. The package structure includes a first conductive pad in a first insulating layer, a conductive via in a second insulating layer directly under the first conductive pad, and a first under bump metallurgy structure directly under the first conductive via. In a first horizontal direction, the conductive via is narrower than the first under bump metallurgy structure, and the first under bump metallurgy structure is narrower than the first conductive pad.

Abstract: A method for forming a chip package structure. The method includes bonding first connectors over a front surface of a semiconductor wafer. The method also includes dicing the semiconductor wafer from a rear surface of the semiconductor wafer to form semiconductor dies and mounting first and second semiconductor dies in the semiconductor dies over a top surface of the interposer substrate. The method further forming an encapsulating layer over the top surface of the interposer substrate to cover the first semiconductor die and the second semiconductor die. A first sidewall of the first semiconductor die faces a second sidewall of the second semiconductor die, and upper portions of the first sidewall and the second sidewall have a tapered contour, to define a top die-to-die distance and a bottom die-to-die distance that is less than the top die-to-die distance.

Abstract: A circulation member positioning structure for a ball screw includes a nut and a circulation member. The nut has a threaded channel, a socket, and a positioning notch. The socket is provided on a wall of the threaded channel and the positioning notch is provided on a wall of socket. The circulation member has a circulation portion, a circulation track, and a positioning protrusion. The circulation portion is provided in the socket of the nut. The circulation track is distributed over one lateral of the circulation portion and connects with the threaded channel of the nut. The positioning protrusion is provided on an opposite lateral of the circulation portion for being engaged with the positioning notch of the nut. Thereby, the circulation member positioning structure helps to simplify the assembling work of the circulation member and to remain the nut small despite the insertion of the circulation member.

Abstract: An external circulation ball screw includes an elongate shaft having has an outer circumferential surface formed with a helical rolling groove; a nut having a through hole formed therein for receiving extension of the elongate shaft therethrough, the through hole having an inner circumferential surface formed with a rolling channel corresponding to the rolling groove, the rolling groove and the rolling channel collectively defining a loading passage, the nut having an outer surface, which includes, formed therein, two through apertures that are spaced from each other and in communication with the through hole and a cavity in communication with the two through apertures; rolling elements arranged in the loading passage and having a diameter between 0.3-1 mm; and a circulator having a U-shape and is arranged in the cavity and the through apertures and formed with a return passage connected to the loading passage to collectively define a circulation channel.

Abstract: A low profile LED lamp bulb with high efficient heat dissipation is disclosed. Each of the lead frame unit has a top-down tapered metal section on bottom end adaptive for being bent inwards to form a lead frame bottom cup suitable for fitting in the low profile LED lamp. A modification embodiment is that a heat sink independent from electrode is attached to a backside of the lead frame with nonconductive adhesive material, heat and electricity are independent from with each other, so that no interference between heat and electricity, and heat can be dissipated mainly from the heat sink.

Abstract: A low profile LED lamp with high efficient heat dissipation is disclosed. Each of the lead frame unit has a left top metal section, left middle metal section, right top metal section, and a top-down tapered metal section. The top-down tapered metal section is bent inwards to form a lead frame bottom cup which is suitable for fitting in the low profile LED lamp.

Abstract: A low profile LED lamp bulb with high efficient heat dissipation is disclosed. Each of the lead frame unit has a top-down tapered metal section on bottom end adaptive for being bent inwards to form a lead frame bottom cup suitable for fitting in the low profile LED lamp. A modification embodiment is that a heat sink independent from electrode is attached to a backside of the lead frame with nonconductive adhesive material, heat and electricity are independent from with each other, so that no interference between heat and electricity, and heat can be dissipated mainly from the heat sink.

Abstract: A low profile LED lamp with high efficient heat dissipation is disclosed. Each of the lead frame unit has a left top metal section, left middle metal section, right top metal section, and a top-down tapered metal section. The top-down tapered metal section is bent inwards to form a lead frame bottom cup which is suitable for fitting in the low profile LED lamp.

Abstract: A circulation member positioning structure for a ball screw includes a nut and a circulation member. The nut has a threaded channel, a socket, and a positioning notch. The socket is provided on a wall of the threaded channel and the positioning notch is provided on a wall of socket. The circulation member has a circulation portion, a circulation track a positioning protrusion. The circulation portion is provided in the socket of the nut. The circulation track is distributed over one lateral of the circulation portion and connects with the threaded channel of the nut. The positioning protrusion is provided on an opposite lateral of the circulation portion for being engaged with the positioning notch of the nut. Thereby, the circulation member positioning structure helps to simplify the assembling work of the circulation member and to remain the nut small. despite the insertion of the circulation member.

Abstract: An air-cooled lamp bulb includes a central tube and a circular light wall. The circular light wall is formed by a plurality of light units surrounding the central tube and emitting light beams in a direction away from the central tube. A top frame supports the circular light wall on top. A top opening is formed in the top frame. A bottom gap is formed between a bottom of the central tube and a bottom of the circular light wall. An air passage is formed between the central tube and the circular light wall. The air passage connects the top opening and the bottom gap for allowing air flow through the air-cooled lamp bulb.

Abstract: The invention provides an external circulation type ball screw device comprising screw shaft and nut having first and second screw grooves. A circulation member comprises first leg, second leg and connection portion. The first leg comprises a first end surface having first inner and outer points, and the second leg comprises a second end surface having second inner and outer points; first and second entrances formed on the first and second end surfaces of circulation passage; first and second thickness respectively provided between the first entrance and the first inner and outer points thereof; the second thickness being greater than the first; the third and fourth thickness respectively provided between the second entrance and the second inner and outer points thereof; the fourth thickness being greater than the third. The groove wall of the second screw groove occupied and the occurrence of broken teeth of the nut are reduced.

Abstract: A circulating element for ball screw includes a first surface defining a circulating passage that extends from one lateral side of the first surface to the other lateral side of the first surface and has a coupling mouth located on each of the two opposite ends thereof, and a second surface defining a coupling groove between the two coupling mouths of the circulating passage and two guide blocks respectively protruding out of the coupling mouths of the circulating passage. Thus, the circulating element has the advantages of low processing cost, ease of installation, high alignment accuracy, and excellent running smoothness.

Abstract: An air-cooled lamp bulb includes a central tube, a circuit board disposed inside the central tube, a circular light wall surrounding the central tube, a transparent dome surrounding a top end of the circular light wall and having a top central opening, and a first air passage formed between the central tube and the circular light wall. The circular light wall is formed by a plurality of light units arranged side by side. Each of the light units has a light source mounted adjacent a top end of the central tube. The transparent dome is arranged for modifying light emitted by the light sources. The first air passage allows air flow through the air-cooled lamp bulb.

Abstract: A LED lamp is disclosed which has a plurality of light unit, each of the light unit has at least one flat metal lead for heat dissipation and the lower part of the metal lead is mounted on a heat sink for a further heat dissipation.

Abstract: An air cooling LED lamp is disclosed. The lamp has air passages for natural air flow for cooling the lamp without using any electric fan to reduce electric energy consumption. The air passages still work for natural air cooling for the lamp when the lamp is configured either in a top down position or in a lateral position.