Abstract: A light emitting device and the method for producing the same are disclosed. The light emitting device has at least a light emitting unit with a first electrode and a second electrode for generating a light source when powered on, a conductive element electrically coupled to the first electrode of the light emitting unit and a substrate having a carrier portion for carrying the light emitting unit and a heat dissipating portion extending from the carrier portion and electrically coupled to the second electrode of the light emitting unit, in which the conductive element is disposed on a side of a planar face of the heat dissipating portion, thereby allowing large contact area to be established between the heat dissipating portion and a sub-heat-dissipating system or air so as to achieve good heat dissipation.

Abstract: A light emitting device including a carrying element having two electric conductors connectable to a power source, a light emitting element disposed on the carrying element and electrically connected to the two electric conductors, and at least one correction element electrically connected to the light emitting element, wherein the light emitting element is adapted to provide a light source upon connection of the two electric conductors with the power source, and the at least one correction element allows the light emitting element to have functions of temperature compensation, voltage correction, or surge absorption.

Abstract: A light emitting device and the fabrication method includes forming one or more light emitting modules on a substrate. The light emitting module receives an alternating current input and has at least two micro diodes. Each micro diode has at least two active layers and is electrically connected by a conductive structure so as to allow the active layers of the micro diodes to alternately emit light during positive and negative cycles of the alternating-current input.

Abstract: A light-emitting diode packaging apparatus is disclosed, which is used for a supporting member having a plurality of supporting pieces to be inserted therein for the subsequent molding and packaging operations, including a mold base for a plurality of supporting pieces of a supporting member to be inserted therein, and a controller for inserting into the mold base and positioning the supporting member. This invention features forming a positioning foot at the periphery of at least one electrode pin of each of the supporting pieces, and also forming a corresponding first positioning aperture on the mold cup of the mold base for the positioning of the supporting pieces. The present invention also provides a mold base and supporting pieces for use with the light-emitting diode packaging apparatus.

Abstract: A light emitting device and the method for producing the same are disclosed. The light emitting device has at least a light emitting unit with a first electrode and a second electrode for generating a light source when powered on, a conductive element electrically coupled to the first electrode of the light emitting unit and a substrate having a carrier portion for carrying the light emitting unit and a heat dissipating portion extending from the carrier portion and electrically coupled to the second electrode of the light emitting unit, in which the conductive element is disposed on a side of a planar face of the heat dissipating portion, thereby allowing large contact area to be established between the heat dissipating portion and a sub-heat-dissipating system or air so as to achieve good heat dissipation.

Abstract: A backlight structure is disclosed, which is constituted of a series of backlight devices connecting with one another to form a large-scale backlight area, the backlight device at least being composed of an emitting portion and a light-guiding portion, wherein the emitting portion provides a light source, mixes the light of the light source and provides the mixed light into the light-guiding portion, which then guides the mixed light out. The emitting portion connects with the light-guiding portion to form a fault structure for connecting with another light-guiding portion, thereby forming a large-scale backlight structure by connecting a sequence of the light-guiding portions using the fault structures without size constraints.

Abstract: The present invention relates to a combined light emitting diode (LED) package structure and a fabricating method for fabricating the same. The combined LED package structure includes an LED chip, a conductive structure and an encapsulant. The encapsulant encapsulates the LED chip and a portion of the conductive structure. The conductive structure has a thick metal member and a thin metal member. The thick metal member is used for carrying the LED chip, provide heat absorbing and heat dissipating paths to the LED chip, the bottom and a portion of the lateral side thereof are exposed to the outside of the encapsulant to increase heat dissipating area. The thin metal member is electrically connected to the LED chip via at least two conductive leads which are extended to a region outside of the encapsulant to serve as outside electrodes of the LED package structure.

Abstract: An alternating current light-emitting device and the fabrication method thereof is disclosed. The alternating current light-emitting device includes at least one alternating current micro-die light-emitting module formed on a substrate and composed of at least two micro-dies connected to one another. The micro-dies, each includes at least two active layers, are electrically connected by a conductive structure, such that the active layers of the micro-dies take turns emitting light during positive and negative half cycles of alternating current, thereby providing a full-scale light-emitting area for all-time light emission.

Abstract: A light emitting device is proposed, which emits light while connected to the power. The light emitting device includes a light emitting element having at least two electrodes disposed at the side of the light output surface thereof; and a base member having a recess and lead portions corresponding to the electrodes, the light emitting element being mounted on the base member and received in the recess, wherein the light output surface faces toward opening of the recess that becomes smaller while approaching the light output surface, and the electrodes are respectively in electrical connection with the lead portions that extend from the connection positions to outer edge of the base member for power connection. The light emitting device of the present invention has advantages of short current path, low series thermal resistance and low cost. In addition, the depth of the recess can further be increased to improve light collecting efficiency.

Abstract: An alternating current light emitting device and the fabrication method includes forming one or more alternating current micro diode light emitting modules on a substrate, wherein the alternating current micro diode light emitting module has two micro diodes connected to one another, and each micro diode has at least two active layers and is electrically connected by a conductive structure, such that the active layers of each micro diode can take turns emitting light during the positive/negative half cycles of alternating current. A continuous and full-scale light emitting effect is thereby achieved.

Abstract: A light emitting diode (LED) package includes at least one LED chip, a carrier, a light reflection element and at least one outside connection electrode. The LED chip is disposed on the carrier and a conductive line or a flip chip method is used to connect the electrodes of the LED chip to the external connection electrodes. A transparent material is used for fixing the light reflection element and carrier, and forming a lens.

Abstract: A flip chip structure for light emitting diode includes a silicon substrate having a surface on which a number of conductors are mounted in an equally spaced manner with an open space formed between adjacent conductors and a number of chips each forming, on the same surface, positive terminal and negative terminal. The chips are mounted to the surface of the substrate in a flip chip fashion with the positive and negative terminals thereof engaging corresponding ones of the conductors of the substrate to form electrical connection therebetween whereby opposite ends of each conductor form positive and negative electrodes for the chips connected thereto. Ends of the conductors that are not engaged by the chips function as external terminals for connection with an external power source.

Abstract: A light emitting diode (LED) packaging structure with built-in rectification circuit is disclosed. The LED packaging structure includes an LED and a rectification circuit is formed inside the LED. Thus, the LED packaging structure is capable to receive an alternate current from an electrical main by the rectification circuit which converts the alternate current into a direct current for the LED whereby the LED can be directly connected to the electrical main and powered thereby without use of additional and external rectification device.

Abstract: A method for mounting an external heat dissipater to a light emitting diode is disclosed. The heat dissipater is comprised of at least one heat dissipation board. A long metal strip is conveyed through a working platform and is punched to form a number of heat dissipation boards connected thereto by connection sections. Light emitting diodes are positioned on the heat dissipation boards and the heat dissipation boards are cut and separated from the metal strip to form finished products of light emitting diodes to which a heat dissipater comprised of the heat dissipation board is mounted.

Abstract: A method of manufacturing power light emitting diodes mainly includes the steps of cutting a rolled dual-thickness sheet material into a plurality of continuous conductive frames in a roll form; cutting the rolled continuous conductive frames into segments, the number of conductive frames included in each segment depending on the molds designed for each packaging of the conductive frames with epoxy resin or silicon material; positioning chips, marking lines, and applying bonding agent on the conductive frames; packaging the conductive frames to obtain continuous half-finished products; and cutting apart the continuous half-finished products and cutting off legs to obtain finished products. The above-described method is developed based on conventional power transistor manufacturing process and enables automated mass-production of power light emitting diodes.