Patents by Inventor Ming-Yi Wang
Ming-Yi Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240145389Abstract: A semiconductor chip includes a first intellectual property block. There are a second intellectual property block and a third intellectual property block around the first intellectual property block. There is a multiple metal layer stack over the first intellectual property block, the second intellectual property block, and the third intellectual property block. An interconnect structure is situated in the upper portion of the multiple metal layer stack. The interconnect structure is configured for connecting the first intellectual property block and the second intellectual property block. In addition, at least a part of the interconnect structure extends across and over the third intellectual property block.Type: ApplicationFiled: July 28, 2023Publication date: May 2, 2024Inventors: Li-Chiu WENG, Yew Teck TIEO, Ming-Hsuan WANG, Chia-Cheng CHEN, Wei-Yi CHANG, Jen-Hang YANG, Chien-Hsiung HSU
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Publication number: 20240145421Abstract: Provided are a passivation layer for forming a semiconductor bonding structure, a sputtering target making the same, a semiconductor bonding structure and a semiconductor bonding process. The passivation layer is formed on a bonding substrate by sputtering the sputtering target; the passivation layer and the sputtering target comprise a first metal, a second metal or a combination thereof. The bonding substrate comprises a third metal. Based on a total atom number of the surface of the passivation layer, O content of the surface of the passivation layer is less than 30 at %; the third metal content of the surface of the passivation layer is less than or equal to 10 at %. The passivation layer has a polycrystalline structure. The semiconductor bonding structure sequentially comprises a first bonding substrate, a bonding layer and a second bonding substrate: the bonding layer is mainly formed by the passivation layer and the third metal.Type: ApplicationFiled: October 27, 2023Publication date: May 2, 2024Inventors: Kuan-Neng CHEN, Zhong-Jie HONG, Chih-I CHO, Ming-Wei WENG, Chih-Han CHEN, Chiao-Yen WANG, Ying-Chan HUNG, Hong-Yi WU, CHENG-YEN HSIEH
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Patent number: 11974367Abstract: A lighting device includes a light board and a light dimmer circuit. The light board includes multiple first light emitting elements and second light emitting elements. The first light emitting elements are disposed in a first area of the light board. The second light emitting elements are disposed in a second area of the light board. The light dimmer circuit is configured to drive the second light emitting elements to generate flickering lights from the second area of the light board, and is configured to drive the first light emitting elements to generate non-flickering lights from the first area of the light board.Type: GrantFiled: October 4, 2022Date of Patent: April 30, 2024Assignee: DELTA ELECTRONICS, INC.Inventors: Chih-Hsien Wang, Ming-Chieh Cheng, Po-Yen Chen, Shih-Chieh Chang, Kuan-Hsien Tu, Xiu-Yi Lin, Ling-Chun Wang
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Patent number: 11971062Abstract: A mounting system is disclosed that includes a bracket configured to mount an object on a structure. The bracket includes a front panel, two side panels extending from the front panel, and a plurality of slots. Each slot is configured to accept a projection connected to the object and retain the projection within the slot. The bracket further includes a plurality of apertures. The mounting system further includes a retainer configured to extend into the bracket through the plurality of apertures and prevent, at least in part, the plurality of projections, retained by the bracket in the plurality of slots, from being withdrawn from the plurality of slots.Type: GrantFiled: January 9, 2023Date of Patent: April 30, 2024Assignee: QUANTA COMPUTER INC.Inventors: Yaw-Tzorng Tsorng, Ming-Lung Wang, Hong-Yi Huang
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Publication number: 20240121028Abstract: The present disclosure discloses a data receiving apparatus and a data receiving method having blind deconvolution mechanism. A descrambling circuit descrambles received data according to an antenna assumption and N data position assumptions within a transmission period to generate N groups of soft-bit data. A soft-bit processing circuit retrieves bit position data to determine non-variable bit positions and variable bit positions. N circular buffers of a storage circuit store and superimpose the N groups of soft-bit data corresponding to N data position assumptions in a circular manner to generate N groups of superimposed results and keep the data corresponding to the non-variable bit positions. A post-processing circuit performs de-interleaving and decoding on the N groups of superimposed results to generate N groups of decoded results to perform redundancy check thereon. When one decoded results passes the redundancy check, the soft-bit processing circuit stops performing the blind deconvolution process.Type: ApplicationFiled: June 16, 2023Publication date: April 11, 2024Inventors: FENG-XIANG WANG, MING-YUE YOU, JYUN-WEI PU, JIA-YI ZHUANG
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Publication number: 20240075449Abstract: The application relates to a polymerization vessel and a method for manufacturing the same. An interior surface of the polymerization vessel has a specific structure, so that the polymerization vessel has better heat transfer efficiency. Closed cooling channels are constructed from the specific structure, and therefore cooling fluid flows in the closed cooling channels. Furthermore, there won't be any by-pass defects in the cooling channels of the polymerization vessel, thereby improving cooling efficiency of the cooling fluid.Type: ApplicationFiled: March 30, 2023Publication date: March 7, 2024Inventors: Ming-Hung CHENG, Fuh-Yih SHIH, Shih-Ming YEH, Wen-Yi WANG
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Patent number: 11549990Abstract: A capacity judgment module and a capacity calibration method thereof are disclosed. The capacity judgment module is used to judge a capacity of a battery installed in an electronic device. The capacity judgment module includes a database, a voltage detection module and a processing module. The database is used to store the voltage-capacity comparison curve. The voltage detection module is used to obtain a voltage value interval between a maximum use voltage value and a minimum use voltage value of the electronic device so as to divide the voltage value interval into a plurality of levels.Type: GrantFiled: November 20, 2020Date of Patent: January 10, 2023Assignee: Gunitech Corp.Inventors: Huan-Ruei Shiu, Chung-Liang Hsu, Ming-Yi Wang, Hsin-Yi Kao
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Patent number: 11507367Abstract: A firmware update method and a firmware update system thereof includes the steps of: executing a setting process, which includes writing a first identification code into a memory module, and setting a firmware update file on a firmware providing end to make the firmware update file include a second firmware image file and a second identification code and executing a determining process, which includes receiving the firmware update file and determining whether the firmware update file conforms to a custom structure according to the first identification code. If it does not, then prohibiting the firmware update image file from updating a computer system, and if it does, replacing a first firmware image file with the second firmware image file and writing the second firmware image file into the memory module of the computer system along with the second identification code.Type: GrantFiled: May 28, 2020Date of Patent: November 22, 2022Assignee: Gunitech Corp.Inventors: Huan-Ruei Shiu, Hsin-Yi Kao, Chung-Liang Hsu, Xiao-Juan Lin, Ming-Yi Wang
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Patent number: 11502504Abstract: A low voltage control system, a low voltage protection method for an electronic device, and a computer program product thereof are disclosed. The electronic device includes a power supply and a memory. The low voltage protection method for the electronic device includes the following steps: detecting a current voltage of the power supply; determining whether the current voltage is lower than a first voltage threshold; and if the voltage is lower than the first voltage threshold, a control module cutting off multiple access channels.Type: GrantFiled: June 3, 2020Date of Patent: November 15, 2022Assignee: Gunitech Corp.Inventors: Huan-Ruei Shiu, Hsin-Yi Kao, Chung-Liang Hsu, Xiao-Juan Lin, Ming-Yi Wang
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Publication number: 20210382117Abstract: A capacity judgment module and a capacity calibration method thereof are disclosed. The capacity judgment module is used to judge a capacity of a battery installed in an electronic device. The capacity judgment module includes a database, a voltage detection module and a processing module. The database is used to store the voltage-capacity comparison curve. The voltage detection module is used to obtain a voltage value interval between a maximum use voltage value and a minimum use voltage value of the electronic device so as to divide the voltage value interval into a plurality of levels.Type: ApplicationFiled: November 20, 2020Publication date: December 9, 2021Inventors: Huan-Ruei Shiu, Chung-Liang Hsu, Ming-Yi Wang, Hsin-Yi Kao
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Publication number: 20210272907Abstract: A redistribution layer of fan-out package and manufacturing method thereof is disclosed. Before forming a pattern wiring layer on each dielectric insulation layer, a thin metal ion layer is formed firstly. A connection between the metal ion layer and the corresponding dielectric insulation layer is weaker than that between the patterned wiring layer and the corresponding dielectric insulation layer. When the redistribution layer is placed in a high temperature and high humidity environment, the stress generated by the patterned circuit layer causes that multiple gaps to form between the metal ion layers and the corresponding dielectric insulating layer. Therefore, a distance between the adjacent dielectric insulating layer and the patterned wiring layer is increased to reduce the capacitive effect and the power consumption of the thinner redistribution layer.Type: ApplicationFiled: May 20, 2020Publication date: September 2, 2021Applicant: Powertech Technology Inc.Inventors: Ming-Yi WANG, Yu-Ping WANG
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Patent number: 11069228Abstract: A method for transmitting signal via a mesh network and a remote control system thereof are disclosed. The method comprises the steps of: executing a setting process, including: downloading a first control instruction to a mesh network control device; dividing the first control instruction into a plurality of transmission codes; storing a second control instruction, wherein the second control instruction is part of the first control instruction; transmitting a plurality of transmission codes to an infrared control device via the mesh network environment; and restoring the plurality of transmission codes to the first control instruction and storing the first control instruction; and executing remote control process, including: transmitting the second control instruction to the infrared control device; converting into the first control instruction according to the second control instruction; and controlling the device by using an infrared signal to control a controlled device.Type: GrantFiled: May 21, 2020Date of Patent: July 20, 2021Assignee: Gunitech Corp.Inventors: Ming-Yi Wang, Xiao-Juan Lin, Hsin-Yi Kao, Huan-Ruei Shiu, Chung-Liang Hsu
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Publication number: 20210200532Abstract: A firmware update method and a firmware update system thereof are disclosed. The method comprises the steps of: executing a setting process, which comprises: writing a first identification code into a memory module; and setting a firmware update file on a firmware providing end to make the firmware update file include a second firmware image file and a second identification code; and executing a determining process, which comprises: receiving the firmware update file; and determining whether the firmware update file conforms to a custom structure according to the first identification code; if no, then prohibiting the firmware update image file from updating a computer system; and if yes, replacing a first firmware image file with the second firmware image file and writing the second firmware image file into the memory module of the computer system along with the second identification code.Type: ApplicationFiled: May 28, 2020Publication date: July 1, 2021Inventors: Huan-Ruei Shiu, Hsin-Yi Kao, Chung-Liang Hsu, Xiao-Juan Lin, Ming-Yi Wang
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Publication number: 20210192935Abstract: An infrared control device is configured for use in a mesh network environment to control a controlled device by transmitting an infrared signal. The controlled device includes an identification tag. The identification tag includes a first control instruction. The control device includes a tag identification module and a database. The tag identification module scans the identification tag to identify the first control instruction. The database is electrically connected to the tag identification module to store the first control instruction.Type: ApplicationFiled: December 14, 2020Publication date: June 24, 2021Inventors: Yu-Ting Hsiao, Che-Wei Hsu, Yu-Cheng Chou, Xiao-Juan Lin, Ming-Yi Wang
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Publication number: 20210194238Abstract: A low voltage control system, a low voltage protection method for an electronic device, and a computer program product thereof are disclosed. The electronic device includes a power supply and a memory. The low voltage protection method for the electronic device includes the following steps: detecting a current voltage of the power supply; determining whether the current voltage is lower than a first voltage threshold; and if the voltage is lower than the first voltage threshold, a control module cutting off multiple access channels.Type: ApplicationFiled: June 3, 2020Publication date: June 24, 2021Inventors: Huan-Ruei Shiu, Hsin-Yi Kao, Chung-Liang Hsu, Xiao-Juan Lin, Ming-Yi Wang
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Publication number: 20200380857Abstract: A method for transmitting signal via a mesh network and a remote control system thereof are disclosed. The method comprises the steps of: executing a setting process, including: downloading a first control instruction to a mesh network control device; dividing the first control instruction into a plurality of transmission codes; storing a second control instruction, wherein the second control instruction is part of the first control instruction; transmitting a plurality of transmission codes to an infrared control device via the mesh network environment; and restoring the plurality of transmission codes to the first control instruction and storing the first control instruction; and executing remote control process, including: transmitting the second control instruction to the infrared control device; converting into the first control instruction according to the second control instruction; and controlling the device by using an infrared signal to control a controlled device.Type: ApplicationFiled: May 21, 2020Publication date: December 3, 2020Inventors: Ming-Yi Wang, Xiao-Juan Lin, Hsin-Yi Kao, Huan-Ruei Shiu, Chung-Liang Hsu
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Patent number: 10299297Abstract: A network connection method is used for allowing a portable electronic device to connect to a node in a mesh network environment. The method includes the steps of: searching a plurality of nodes; determining whether there is a specific node in the plural of nodes; if yes, setting the specific node as a bridging point; if not, setting a node with the strongest signal strength in the plurality of nodes as the bridge point; and broadcasting to the other nodes via the bridge point under the mesh network environment.Type: GrantFiled: September 30, 2015Date of Patent: May 21, 2019Assignee: Gunitech Corp.Inventors: Shih-Chao Sheng, Ming-Yi Wang, Enoch Zhao, Huan-Ruei Shiu, Chien-Ju Hung
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Patent number: 10177058Abstract: An encapsulating composition and a semiconductor package are provided. The encapsulating composition adapted to encapsulate a semiconductor die includes a photosensitive dielectric material and a polarizable compound suspended in the photosensitive dielectric material. The polarizable compound within a predetermined region of the encapsulating composition affected by an external stimulus is arranged uniformly in a thickness direction to provide a conductive path penetrating through the photosensitive dielectric material along the thickness direction. The semiconductor package includes the encapsulating composition encapsulating the semiconductor die, a first and a second redistribution layer. The first and the second redistribution layer disposed on the opposite sides of the encapsulating composition are electrically connected each other through the encapsulating composition. A manufacturing method of the semiconductor package is also provided.Type: GrantFiled: January 26, 2018Date of Patent: January 8, 2019Assignee: Powertech Technology Inc.Inventors: Ming-Yi Wang, Kun-Yung Huang
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Patent number: 9832637Abstract: A connection information sharing system is applied in a mesh network environment which has at least one controlled device within. A connection information sharing method thereof includes the steps of: performing a transferring process, including: integrating a connection data to an integration data; converting the integration data to generate a connection code; performing a receiving process, including: reading the connection code; restoring the connection code to the integration data; and establishing a connection with the at least one controlled device via the integration data.Type: GrantFiled: August 24, 2015Date of Patent: November 28, 2017Assignee: Gunitech Corp.Inventors: Shih-Chao Sheng, Ming-Yi Wang
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Patent number: D1018891Type: GrantFiled: December 13, 2021Date of Patent: March 19, 2024Assignee: DELTA ELECTRONICS, INC.Inventors: Chih-Hsien Wang, Shih-Chieh Chang, Peng-Hui Wang, Ming-Chieh Cheng, Xiu-Yi Lin