Abstract: A semiconductor die including mechanical-stress-resistant bump structures is provided. The semiconductor die includes dielectric material layers embedding metal interconnect structures, a connection pad-and-via structure, and a bump structure including a bump via portion and a bonding bump portion. The entirety of a bottom surface of the bump via portion is located within an area of a horizontal top surface of a pad portion of the connection pad-and-via structure.

Abstract: A triboelectric nanogenerating device is configured for providing an electric power to an electronic device and the triboelectric nanogenerating device includes at least one scaly triboelectric membrane configured for providing the electric power to the electronic device by frictional electrification. The at least one scaly triboelectric membrane includes a keratin and a polyvinyl alcohol, the at least one scaly triboelectric membrane has a first triboelectric surface, and the first triboelectric surface of the at least one scaly triboelectric membrane includes a plurality of scaly layers. Each of the scaly layers is arranged in order and extends along an orienting direction. A distal end of each of the scaly layers has a plurality of saw-tooth structures.

Abstract: A semiconductor device includes a plurality of channel layers vertically separated from one another. The semiconductor device also includes an active gate structure comprising a lower portion and an upper portion. The lower portion wraps around each of the plurality of channel layers. The semiconductor device further includes a gate spacer extending along a sidewall of the upper portion of the active gate structure. The gate spacer has a bottom surface. Moreover, a dummy gate dielectric layer is disposed between the gate spacer and a topmost channel layer of plurality of channel layers. The dummy gate dielectric layer is in contact with a top surface of the topmost channel layer, the bottom surface of the gate spacer, and the sidewall of the gate structure.

Abstract: Provided are a package structure and a method of forming the same. The method includes providing a first package having a plurality of first dies and a plurality of second dies therein; performing a first sawing process to cut the first package into a plurality of second packages, wherein one of the plurality of second packages comprises three first dies and one second die; and performing a second sawing process to remove the second die of the one of the plurality of second packages, so that a cut second package is formed into a polygonal structure with the number of nodes greater than or equal to 5.

Abstract: Integrated fan-out packages and methods of forming the same are disclosed. An integrated fan-out package includes two dies, an encapsulant, a first metal line and a plurality of dummy vias. The encapsulant is disposed between the two dies. The first metal line is disposed over the two dies and the encapsulant, and electrically connected to the two dies. The plurality of dummy vias is disposed over the encapsulant and aside the first metal line.

Abstract: A semiconductor device and method for forming the semiconductor device are provided. In some embodiments, a semiconductor substrate comprises a device region. An isolation structure extends laterally in a closed path to demarcate the device region. A first source/drain region and a second source/drain region are in the device region and laterally spaced. A sidewall of the first source/drain region directly contacts the isolation structure at a first isolation structure sidewall, and remaining sidewalls of the first source/drain region are spaced from the isolation structure. A selectively-conductive channel is in the device region, and extends laterally from the first source/drain region to the second source/drain region. A plate comprises a central portion and a first peripheral portion. The central portion overlies the selectively-conductive channel, and the first peripheral portion protrudes from the central portion towards the first isolation structure sidewall.

Abstract: A package structure and the manufacturing method thereof are provided. The package structure includes a first package including at least one first semiconductor die encapsulated in an insulating encapsulation and through insulator vias electrically connected to the at least one first semiconductor die, a second package including at least one second semiconductor die and conductive pads electrically connected to the at least one second semiconductor die, and solder joints located between the first package and the second package. The through insulator vias are encapsulated in the insulating encapsulation. The first package and the second package are electrically connected through the solder joints. A maximum size of the solder joints is greater than a maximum size of the through insulator vias measuring along a horizontal direction, and is greater than or substantially equal to a maximum size of the conductive pads measuring along the horizontal direction.

Abstract: An abnormal traffic detection method is provided according to an embodiment of the disclosure. The method includes: obtaining network traffic data of a target device; sampling the network traffic data by a sampling window with a time length to obtain sampling data; generating, according to the sampling data, an image which presents a traffic feature of the network traffic data corresponding to the time length; and analyzing the image to generate evaluation information corresponding to an abnormal traffic. In addition, an abnormal traffic detection device is also provided according to an embodiment of the disclosure to improve a detection ability and/or an analysis ability for the abnormal traffic and/or a malware.

Abstract: A transparent display panel with driving electrode regions, circuit wiring regions, and optically transparent regions is provided. The driving electrode regions are arranged into an array in a first direction and a second direction. An average light transmittance of the circuit wiring regions is less than ten percent, and an average light transmittance of the optically transparent regions is greater than that of the driving electrode regions and the circuit wiring regions. The first direction intersects the second direction. The circuit wiring regions connect the driving electrode regions at intervals, such that each optically transparent region spans among part of the driving electrode regions. The transparent display panel includes first signal lines and second signal lines extending along the circuit wiring regions, and each circuit wiring region is provided with at least one of the first signal lines and at least one of the second signal lines.

Abstract: A self-healing elastomeric compound for use in blowout preventer packers includes one or more elastomers, carbon black, silica, and a self-healing agent evenly distributed throughout the compound.

Abstract: An oligomer (2,6-dimethylphenylene ether) is provided. Its structure is shown as follows: which comprises separately independent hydrogen; alkyl or phenyl; separately independent —NR—, —CO—, —SO—, —CS—, —SO2—, —CH2—, —O—, null, —C(CH3)2—, or and a hydrogen, The features of the cured products include a high glass-transition temperature, a low dielectric feature, preferred thermal stability, and good flame retardancy. The present invention effectively controls the number-average molecular weight of the product to obtain excellent organic solubility.

Abstract: A phosphinated (2,6-dimethylphenyl ether) oligomer, preparation method thereof and cured product. The phosphinated (2,6-dimethylphenyl ether) oligomer includes a structure represented by Formula (1): wherein X is a single bond, —CH2—, —O—, —C(CH3)2— or R?0, R0, R1, R2 and R3 are independently hydrogen, C1-C6 alkyl or phenyl; n and m are independently an integer from 0 to 300; p and q are independently an integer from 1 to 4; Y is hydrogen, U and V are independently an aliphatic structure.

Abstract: A method for obtaining a handwriting trajectory is provided. The method includes the following steps: capturing images of handwriting that is written with a writing brush on a piece of paper on a writing platform; obtaining positions where pixels in each of the images are lower than a threshold according to the threshold; and outputting handwriting images according to the positions.

Abstract: An insect-trapping device includes a container, a funnel element, two photo interrupters and a controller. The container has an inlet and an accommodation space. The funnel element is placed on the inlet to extend into the accommodation space of the container. The photo interrupters are arranged within an inner passage of the funnel element along a long axis direction of the inner passage for sensing whether at least one insect passes through the inner passage from the inlet. The controller is electrically connected to the photo interrupters for counting the insects passing through the inner passage according to the photo interrupters.

Abstract: The invention discloses functionalized poly(2,6-dimethyl phenylene oxide oxide) oligomers containing dicyclopentadiene, a method of producing the same and use thereof. The cured products of the functionalized poly(2,6-dimethyl phenylene oxide oxide) oligomers of the invention exhibit low dielectric constant, low dissipation, and high glass transition temperature. As the functionalized poly(2,6-dimethyl phenylene oxide oxide) oligomers of the invention have number-average molecular weight ranging from 2500 to 6000 g/mol, the substrate made of theses functionalized poly(2,6-dimethyl phenylene oxide oxide) oligomers can pass the pressure cook test. Besides, the low dissipation factor characteristic the functionalized poly(2,6-dimethyl phenylene oxide oxide) oligomers of the invention can only be demonstrated at number-average molecular weight higher than 2500 g/mol.

Abstract: An oligomer (2,6-dimethylphenylene ether) is provided. Its structure is shown as follows: which comprises separately independent hydrogen; alkyl or phenyl; separately independent —NR—, —CO—, —SO—, —CS—, —SO2—, —CH2—, —O—, null, —C(CH3)2—, or and a hydrogen, The features of the cured products include a high glass-transition temperature, a low dielectric feature, preferred thermal stability, and good flame retardancy. The present invention effectively controls the number-average molecular weight of the product to obtain excellent organic solubility.

Abstract: A phosphinated (2,6-dimethylphenyl ether) oligomer, preparation method thereof and cured product are provided. The phosphinated (2,6-dimethylphenyl ether) oligomer includes a structure represented by Formula (1): wherein X is a single bond, —CH2—, —O—, —C(CH3)2— or R?0, R0, R1, R2 and R3 are independently hydrogen, C1-C6 alkyl or phenyl; n and m are independently an integer from 0 to 300; p and q are independently an integer from 1 to 4; Y is hydrogen, U and V are independently an aliphatic structure.

Abstract: An insect-trapping device includes a container, a funnel element, a photo interrupter and a controller. The container is formed with an inlet and an accommodation space connected to each other. The funnel element is with light-absorbed color, placed on the inlet, and inserts into the accommodation space. The photo interrupter is located within an inner passage of the funnel element for sensing whether at least one of insects passes through the inner passage from the inlet. The controller is electrically connected to the first photo interrupter for counting the insects passing through the inner passage according to the photo interrupter.

Abstract: The invention relates to elastomeric compositions containing filler particles that are predominantly two-dimensional in shape. The elastomeric compositions exhibit significantly improved thermal, chemical, and mechanical properties as compared with elastomers containing conventional fillers such as natural clay, carbon black, and carbon fiber. In addition, the elastomeric compositions of the invention exhibit improved resistance to solvent-induced swelling and to unwanted permeation of gases such as hydrogen sulfide. The invention also provides a method of forming such elastomeric compositions and methods of using such elastomeric compositions to prepare elastomeric articles with improved resistance to thermal, chemical, and mechanical stresses.

Abstract: The invention discloses functionalized poly(2,6-dimethyl phenylene oxide oxide) oligomers containing dicyclopentadiene, a method of producing the same and use thereof. The cured products of the functionalized poly(2,6-dimethyl phenylene oxide oxide) oligomers of the invention exhibit low dielectric constant, low dissipation, and high glass transition temperature. As the functionalized poly(2,6-dimethyl phenylene oxide oxide) oligomers of the invention have number-average molecular weight ranging from 2500 to 6000 g/mol, the substrate made of theses functionalized poly(2,6-dimethyl phenylene oxide oxide) oligomers can pass the pressure cook test. Besides, the low dissipation factor characteristic the functionalized poly(2,6-dimethyl phenylene oxide oxide) oligomers of the invention can only be demonstrated at number-average molecular weight higher than 2500 g/mol.