Abstract: A method for manufacturing a semiconductor device is provided. A semiconductor substrate is received. The semiconductor substrate is patterned to form a plurality of protrusions spaced from one another, wherein the protrusion comprises a base section, and a seed section stacked on the base section. A plurality of first insulative structures are formed, covering sidewalls of the base sections and exposing sidewalls of the seed sections. A plurality of spacers are formed, covering the sidewalls of the seed sections. The first insulative structures are partially removed to partially expose the sidewalls of the base sections. The base sections exposed from the first insulative structures are removed. A plurality of second insulative structures are formed under the seed sections.

Abstract: Various embodiments of the present application are directed towards an integrated circuit (IC) in which a bootstrap metal-oxide-semiconductor (MOS) device is integrated with a high voltage metal-oxide-semiconductor (HVMOS) device and a high voltage junction termination (HVJT) device. In some embodiments, a drift well is in the semiconductor substrate. The drift well has a first doping type and has a ring-shaped top layout. A first switching device is on the drift well. A second switching device is on the semiconductor substrate, at an indent in a sidewall the drift well. A peripheral well is in the semiconductor substrate and has a second doping type opposite the first doping type. The peripheral well surrounds the drift well, the first switching device, and the second switching device, and further separates the second switching device from the drift well and the first switching device.

Abstract: A multifunctional intelligent watch includes a watch case and a main control motherboard. More than one conductive electrodes, transceivers and a SIM card slot are disposed on the watch case. The conductive electrodes and the transceivers form a current circuit for detecting and measuring the collected data. The main control motherboard serves to calculate the relevant data to display the data on a screen of the watch face. The data are uploaded to the cloud via a third-party APP of the intelligent mobile phone. Through the cloud computing technology, the complete data such as the electrocardiogram can be shown. A specific computing technology is used to precisely catch abnormal electrocardiogram and transmit an abnormal notice. Accordingly, a user can conveniently obtain many diagnostic data and automatically get an alert of any abnormal detected value. The SIM card serves to position and transmit data and provide communication function to ensure safety.

Abstract: A method of detecting audio input mode applied to an electronic device is disclosed. According to how the user presses the start button of the electronic device, the audio input mode is determined to be a short-press mode or a long-press mode. The method of detecting an audio input mode includes: detecting if a pressing time of the start button is less than a threshold time; if so, determining that the audio input mode is the short-press mode; if not, detecting if an audio time of the receiving audio of the microphone exceeds an audio threshold time during the pressing time; if so, determining that the audio input mode is the long-press mode; if not, determining that the audio input mode is the short-press mode.

Abstract: Size-band analysis is used to determine whether a chromosomal region exhibits a copy number aberration or an epigenetic alteration. Multiple size ranges may be analyzed instead of focusing on specific sizes. By using multiple size ranges instead of specific sizes, methods may analyze more sequence reads and may be able to determine whether a chromosomal region exhibits a copy number aberration even when clinically-relevant DNA may be a low fraction of the biological sample. Using multiple ranges may allow for the use of all sequence reads from a genomic region, rather than a selected subset of reads in the genomic region. The accuracy of analysis may be increased with higher sensitivity at similar or higher specificity. Analysis may include fewer sequencing reads to achieve the same accuracy, resulting in a more efficient process.

Abstract: A wearable liquid supplying device for human insulin injection is fixed on a body of human through a ring belt and includes a substrate, a flow-guiding-and-actuating unit, a sensor and a driving chip. The substrate has a liquid storage chamber. The flow-guiding-and-actuating unit has a liquid guiding channel in communication with a liquid storage outlet of the liquid storage chamber and a liquid guiding outlet. The sensor measures a blood glucose level and generates measured data correspondingly. The driving chip receives the measured data from the sensor and controls the actuation of the flow-guiding-and-actuating unit and the open/closed states of the switching valves. The flow-guiding-and-actuating unit is enabled to generate a pressure difference so that the insulin liquid is transported to the liquid guiding outlet through the liquid guiding channel and flows into the microneedle patch for allowing the microneedles to inject the insulin liquid into the subcutaneous tissue.

Abstract: An efficient data storage device is disclosed, which uses a microprocessor and at least one volatile memory to operate a non-volatile memory. The microprocessor allocates the volatile memory to provide a cache area. According to an asynchronous event request (AER) issued by a host, the microprocessor uses the cache area to collect sections of write data requested by the host, programs the sections of write data collected in the cache area to the non-volatile memory together, and reports failed programming of the sections of write data to the host by AER completion information.

Abstract: A package includes a bottom substrate and a bottom die over and bonded to the bottom substrate. A metal-particle-containing compound material is overlying a top surface of the bottom die, wherein the metal-particle-containing compound material comprises metal particles. A molding material molds at least a lower part of the bottom die therein, wherein the molding material is overlying the bottom substrate.

Abstract: A method of manufacturing a semiconductor package structure includes the following steps. A die is bonded to a wafer. A dielectric material layer is formed on the wafer and the die. The dielectric material layer covers a top surface and sidewalls of the die. At least one planarization process is performed to remove a portion of the dielectric material layer and a portion of the die, such that the top surface of the die is exposed and a dielectric layer aside the die is formed. The dielectric layer surrounds and covers the sidewalls of the die.

Abstract: The invention provides for compounds of formula (I) wherein R1, X, Y, R4, R5, R6, R7, R8, R9, R10, R11, R12, R13, R14, m, and R? have any of the values defined in the specification, and pharmaceutically acceptable salts thereof, that are useful as agents in the treatment of diseases and conditions mediated and modulated by CFTR, including cystic fibrosis, Sjögren's syndrome, pancreatic insufficiency, chronic obstructive lung disease, and chronic obstructive airway disease. Also provided are pharmaceutical compositions comprised of one or more compounds of formula (I).

Abstract: Disclosed are methods of treating a subject having high-risk multiple myeloma, methods of achieving negative minimal residual disease status in a subject having multiple myeloma, and methods of predicting a likelihood of, or decreasing a risk of, relapse and/or disease progression in a subject having multiple myeloma.

Abstract: A ladder cord fastening seat for a non-pull window blind includes two vertical posts located opposite to each other and an arc bridge. The ladder cord fastening seat is fastened in a top beam through the two vertical posts. Each of the vertical posts has a cord inserting hole for a ladder cord to be inserted therethrough. The arc bridge is used for fastening the ladder cord. The arc bridge connects the two vertical posts in such a way that an accommodation space is defined to accommodate a transmission member located in the top beam.

Abstract: A heat dissipation fan including a hub and a plurality of metal fan blades disposed all around the hub. Each of the metal fan blades has a first end and a second end opposite to each other, wherein the first end is connected to the hub, and the metal fan blade has a flap wing at the second end. An angle is included between the flap wing and a surface of the metal fan blade.

Abstract: Integrated fan-out packages and methods of forming the same are disclosed. An integrated fan-out package includes a bump structure, a polymer layer and a metal layer. The bump structure includes a metal pad and a bump electrically connected to the metal pad. The polymer layer extends laterally from a sidewall of the bump. The metal layer is over the bump structure and in physical contact with a side surface of the metal pad.

Abstract: A method includes forming first spacers on opposing sidewalls of a first fin, where the first fin protrudes above a substrate, recessing the first fin to form a first recess between the first spacers, and treating the first spacers using a baking process, where treating the first spacers changes a profile of the first spacers. The method further includes epitaxially growing a first semiconductor material over a top surface of the first fin after treating the first spacers.

Abstract: A semiconductor structure is disclosed. The semiconductor structure includes: a substrate and a gate element over the substrate. The gate element includes: a gate dielectric layer over the substrate; a gate electrode over the gate dielectric layer; and a waveguide passing through the gate electrode from a top surface of the gate electrode to a bottom surface of the gate electrode. A manufacturing method of the same is also disclosed.

Abstract: Methods of cutting gate structures and fins, and structures formed thereby, are described. In an embodiment, a substrate includes first and second fins and an isolation region. The first and second fins extend longitudinally parallel, with the isolation region disposed therebetween. A gate structure includes a conformal gate dielectric over the first fin and a gate electrode over the conformal gate dielectric. A first insulating fill structure abuts the gate structure and extends vertically from a level of an upper surface of the gate structure to at least a surface of the isolation region. No portion of the conformal gate dielectric extends vertically between the first insulating fill structure and the gate electrode. A second insulating fill structure abuts the first insulating fill structure and an end sidewall of the second fin. The first insulating fill structure is disposed laterally between the gate structure and the second insulating fill structure.

Abstract: Techniques for providing data protection in high availability cluster environments. The techniques employ multiple layers of data protection, including a first layer that provides full data protection for a source storage system at a first-layer destination storage system, and a second layer of data protection that provides distributed data protection for the source storage system among a cluster of second-layer destination storage systems.

Abstract: A cloth washing device contains: a washing machine and a fiber opener. The washing machine includes multiple transmission rollers arranged on water and multiple bearings fixed in the water. The fiber opener includes multiple transmission rollers arranged on the water, multiple bearings fixed in the water, and at least two mesh wheels arranged in the water. The fiber opener is mounted behind the washing machine, and a cloth is delivered between the washing machine and the fiber opener by way of the multiple transmission rollers and the multiple bearings of the washing machine and the fiber opener and the least two mesh wheels.

Abstract: An imaging lens element includes an optical effective section, an outer diameter surface, at least two cut traces and at least two clearance surfaces. The optical effective section has an optical axis. The outer diameter surface surrounds the optical effective section. Each of the cut traces is shrunk from an outer diameter reference plane of the outer diameter surface toward a center of the imaging lens element. The clearance surfaces are connected between each of the cut traces and the outer diameter surface, respectively. At least one of the cut traces includes a first surface, and a curvature center of the first surface is closer to the center of the imaging lens element than the first surface to the center of the imaging lens element thereto.