Abstract: Display devices and related methods involving patterned phase retarding are provided. A representative display device includes: a backlight unit, having a light source and a color conversion layer having an alignment direction, the light comprising a first light exhibiting a first upstream polarization ratio, a second light exhibiting a second upstream polarization ratio, and a third light exhibiting a third upstream polarization ratio; and a patterned phase retarder positioned to receive the light, having a plurality of half-wave regions to alter polarization of light passing therethrough, and a plurality of free regions to pass light without altering the polarization; wherein polarization ratio (PR) is defined by PR=(I??I?)/(I?+I?); and wherein the first upstream polarization ratio exhibits a first sign, and both the second upstream polarization ratio and the third upstream polarization ratio exhibit a second sign opposite the first sign.

Abstract: A cathode electrode material and a lithium sulfur battery are disclosed. The cathode electrode material includes a sulfur containing cathode active material, a conducting agent, and a cathode binder. The cathode binder includes a polymer obtained by polymerizing a dianhydride monomer with a diamine monomer. The lithium sulfur battery includes an anode electrode, an electrolyte, and a cathode electrode.

Abstract: An embodiment fin field-effect-transistor (finFET) includes a semiconductor fin comprising a channel region and a gate oxide on a sidewall and a top surface of the channel region. The gate oxide includes a thinnest portion having a first thickness and a thickest portion having a second thickness different than the first thickness. A difference between the first thickness and the second thickness is less than a maximum thickness variation, and the maximum thickness variation is in accordance with an operating voltage of the finFET.

Abstract: A method of forming a semiconductor device is provided. Metallic interconnects are formed in a dielectric layer of the semiconductor device. A hard mask is used to avoid usual problems faced by manufacturers, such as possibility of bridging different conductive elements and via patterning problems when there are overlays between vias and trenches. The hard mask is etched multiple times to extend via landing windows, while keeping distance between the conductive elements to avoid the bridging problem.

Abstract: A method for designing a spline surface contour of a roller-type wave-motion includes of the steps of slicing radial movement track of a roller between a cam and a spline aperture and circumference rotation track at equal proportion at equal time intervals to sequentially obtain circle centers and points of tangency of the track circles during movement of the roller; connecting the points of tangency to form a unit cam circumference segment of a cam periphery in order to draw and form a single-sided tooth flank contour; and forming a correspondent side tooth flank contour by mirroring and projecting the single-sided tooth flank contour. A method of forming a spline wheel contour and a method of forming a cam periphery are obtained.

Abstract: Among other things, one or more image sensors and techniques for forming image sensors are provided. An image sensor comprises a photodiode array configured to detect light. The image sensor comprises an oxide grid comprising a first oxide grid portion and a second oxide grid portion. A metal grid is formed between the first oxide grid portion and the second oxide grid portion. The oxide grid and the metal grid define a filler grid. The filler grid comprises a filler grid portion, such as a color filter, that allows light to propagate through the filler grid portion to an underlying photodiode. The oxide grid and the metal grid confine or channel the light within the filler grid portion. The oxide grid and the metal grid are formed such that the filler grid provides a relatively shorter propagation path for the light, which improves light detection performance of the image sensor.

Abstract: Methods of forming connector pad structures, interconnect structures, and structures thereof are disclosed. In some embodiments, a method of forming a connector pad structure includes forming an underball metallization (UBM) pad, and increasing a surface roughness of the UBM pad by exposing the UBM pad to a plasma treatment. A polymer material is formed over a first portion of the UBM pad, leaving a second portion of the UBM pad exposed.

Abstract: A method for operating a server farm with a plurality of servers operably connected with each other includes the steps of: sorting the plurality of servers according to a respective energy efficiency value associated with each of the plurality of servers; defining a virtual server by selectively joining two or more of the servers with the highest energy efficiency values; receiving a job request of a computational task to be handled by the server farm; and assigning the computational task to one of the plurality of servers for processing based on a job assignment policy, the job assignment policy being arranged to give preference to assigning the computational task to the servers of the virtual server for processing so as to maximize an energy efficiency of the server farm.

Abstract: Aspects of the disclosure provide a method for beam management at a base station (BS) in a wireless communication system. The method can include transmitting a beam training reference signal (RS) resource configuration from a base station (BS) to a user equipment (UE) in a wireless communication system, transmitting an anchor association index indicating an association between a beam pair link and a set of second transmit beams of the BS, wherein the beam pair link is formed by a first transmit beam of the BS and a receive beam of the UE, transmitting beam training RSs according to the beam training RS resource configuration on the set of second transmit beams, and receiving a measurement report including quality measurements of beamformed channels over the receive beam and a subset of the second transmit beams.

Abstract: A framework of cloud service for biological growth is disclosed. The framework of cloud service for biological growth includes a client end, a service provider, an expert end, and an equipment end. The client end has a biological cultivate area, a first processing unit, a first control module, and a first transceiver module. The service provider has a first database, a second processing unit, a data integration module, a web server, a data integration module, and a second transceiver module. The expert end has a second database, a third processing unit, a second monitoring module, a biological growth simulation module, and a third transceiver module. The equipment end has a third database, a fourth processing unit, and a fourth transceiver module.

Abstract: A probe head and methods of testing a device using a probe head are provided. The probe head includes a first end connected to a first substrate. The first substrate is configured to be connected to a test head. The probe head also includes second end having a first inner recess surrounded by a first protrusion and a first plurality of probe needles connected to the first protrusion.

Abstract: The present disclosure relates to a package-on-package structure providing mechanical strength and warpage control. In some embodiments, the package-on-package structure includes a first set of conductive elements coupling a first package component to a second package component. A first molding material is arranged on the first package component. The first molding material surrounds the first set of conductive elements and outer sidewalls of the second package component and has a top surface below a top surface of the second package component. The stacked integrated chip structure further includes a second set of conductive elements that couples the second package component to a third package component.

Abstract: A semiconductor device includes a semiconductor substrate, a gate structure, a first spacer, a second spacer, and a first contact plug. The gate structure is disposed on the semiconductor substrate. The first spacer is disposed around the gate structure. The second spacer is disposed on the first spacer. The first contact plug lands on the second spacer and the gate structure.

Abstract: An integrated circuit includes a substrate having at least one depression on a top surface. At least one solder bump is disposed over the substrate. A die is disposed over the at least one solder bump and electrically connected with the substrate through the at least one solder bump. An underfill surrounds the at least one solder bump and is formed between the substrate and the die. The at least one depression is disposed around the underfill to keep any spillover from the underfill in the at least one depression.

Abstract: A method includes forming a coil over a carrier, encapsulating the coil in an encapsulating material, planarizing a top surface of the encapsulating material until the coil is exposed, forming at least one dielectric layer over the encapsulating material and the coil, and forming a plurality of redistribution lines extending into the at least one dielectric layer. The plurality of redistribution lines is electrically coupled to the coil.

Abstract: A switching device includes a rod, a rotating shaft, and a valve assembly including a cover and a plug member. The cover engaged with the valve body has a first block section, a second block section, a space, and a threaded hole communicates with the space. The plug member is rotatably provided in a chamber of the cover, changing an area of an opening of an inlet hole. The rotating shaft has a projection is adapted to drive the plug member to rotate. A rod body of the rod has a threaded section engaged with the threaded hole. When the projection abuts against the first block section, the plug member seals the inlet hole. When the projection abuts against the rod, the plug member changes the area to a first area. When the projection abuts against the second block section, the plug member changes the area to a second area.

Abstract: A three-dimensional integrated circuit has a plurality of layers disposed in a stacked relationship. Logic circuitry is embodied in a first layer of the three-dimensional integrated circuit. An input output circuit is electrically coupled to the logic circuitry and has a plurality of transistors embodied in at least two layers of the three-dimensional integrated circuit. The input output circuit has first and second input output circuitry, wherein the first input output circuitry operates faster than the second input output circuitry.

Abstract: In one embodiment, a method includes receiving, from a client system of a first user of a communication network, an input from the first user to access a card-stack interface, generating one or more card clusters from a plurality of cards, each card comprising a query referencing a query-domain associated with the communication network and zero or more query-filters for the query-domain, wherein each query-filter references one or more objects of the communication network, each card cluster comprising one or more cards from the plurality of cards, the cards being formed into card clusters based on a card-affinity between the cards, and sending, to the client system in response to the input from the first user, the card-stack interface for display to the first user, wherein the card-stack interface comprises one or more of the card clusters.

Abstract: A control circuit and method for a synchronous rectifier having a plurality of switches and receiving an AC input signal. The control method includes switching between controlling a first switch of the plurality of switches in response to a control signal for a second switch of the plurality of switches, controlling the first switch in response to a comparison between the AC input signal and a second signal.

Abstract: The present disclosure provides a touch display panel including a self-capacitance or mutual-capacitance type touch display panel, a manufacturing method and a method driving for the same and a display device. The self-capacitance type touch display panel includes an array substrate having a first metal layer and self-capacitance touch electrodes, and a touch control chip. Each touch electrode includes common electrodes, first metal layer includes touch lead wires corresponding to the touch electrodes, and each touch electrode is connected with the touch control chip via a corresponding touch lead wire. The touch lead wire is configured to transmit a common electrode signal to the touch electrode during a display stage, to transmit a touch scan signal to the touch electrode during a touch stage, and to transmit a touch signal, which is generated by the touch electrode at a position where a touch operation occurs, to the touch control chip.