Abstract: Techniques are provided for creating, organizing, and maintaining a sharded database. A sharded database can be created using user-defined sharding, system-managed sharding, or composite sharding. The sharded database is implemented with relational database techniques. The techniques described provide improvements to load distribution, organization, query processing, and schema propagation in a sharded database.

Abstract: A method and structure for providing improved thermal management in multichip and package on package (PoP) applications. A first substrate attached to a second smaller substrate wherein the second substrate is encircled by a heat ring attached to the first substrate, the heat ring comprising heat conducting materials and efficient heat dissipating geometries. The first substrate comprises a heat generating chip and the second substrate comprises a heat sensitive chip. A method is presented providing the assembled structure with increased heat dissipation away from the heat sensitive chip.

Abstract: An electrical connector assembly includes: a connector housing receiving a plurality of contacts mounted to an internal substrate; a shielding shell enclosing the connector housing; and a pair of latches secured to the connector housing in a cantilevered fashion; wherein the latch has an arm secured to the substrate.

Abstract: The present invention discloses methods and systems for configuring a second system. The system of the present invention determines the identity information of the second system and at least one configuration. The at least one configuration is then sent to the second system. The second system is configured with the at least one configuration. The at least one configuration can be sent through an SMS message, a USB modem plugged in the second system, or NFC. Additionally, the at least one configuration may comprise an APN. The at least one configuration may also be used to configure the second system to establish one or more VPN connections.

Abstract: An apparatus and method for transforming NC programs are provided, and the apparatus is electrically connected to a controller configured to, according to a NC program, command a machine to drive a cutting tool to cut a workpiece. The apparatus includes a triggering module, a coordinate position processing module, and a storage module. The triggering module is electrically connected to the controller. The coordinate position processing module is electrically connected to the controller and the triggering module. The storage module is electrically connected to the coordinate position processing module. The triggering module triggers the controller to execute the NC program in a single block mode. The coordinate position processing module is triggered by the triggering module to acquire at least one coordinate position from the controller. The storage module stores the at least one coordinate position. The triggering module simultaneously triggers the controller and the coordinate position processing module.

Abstract: An audio playing system has a first channel output device, a first equalizer, and a controller. The first equalizer is configured to adjust a received first channel audio signal with a set of first parameters of frequency response and output the adjusted first channel audio signal to the first channel output device in a first mode, and to adjust the received first channel audio signal with the a of second parameters of frequency response and output the adjusted first channel audio signal to the first channel output device in a second mode. In a test mode, the controller is configured to send a set of test audio signals to the first channel output device and to adjust the set of first parameters of frequency response and the set of second parameters of frequency response based on a plurality of pieces of received first confirmation signal.

Abstract: Packaged semiconductor devices and methods of packaging semiconductor devices are disclosed. In some embodiments, a packaged semiconductor device includes an integrated circuit die, a molding compound disposed around the integrated circuit die, and an interconnect structure disposed over the integrated circuit die and the molding compound. The molding compound is thicker than the integrated circuit die.

Abstract: Present application provides a method of manufacturing a semiconductor structure, including forming a well, forming a gate electrode over the well, implanting a lightly doped region in a first side of the well, implanting a first drain in the lightly doped region by a first depth, implanting a second drain in the lightly doped region by a second depth, implanting a source in a second side of the well, the second side being opposite to the first side. The second depth is greater than the first depth. The gate electrode is formed to cover a part of the lightly doped region and a part of the first drain.

Abstract: Disclosed is a centrifugal microfluidic device comprising a piezoelectric substrate; a rotatable platform device on the substrate; and at least one transducer on the substrate, the transducer being configured to generate a surface acoustic wave that propagates on the surface of the substrate and contacts the rotatable platform device asymmetrically to transfer energy thereto with a lateral distribution to cause rotation of the rotatable platform device. The device may be a microfluidic valve, a microfluidic mixer or a microfluidic particle concentrator.

Abstract: A method of preparing application data for visitors of a website is performed at a computer server. The computer server receives a webpage request initiated by a client device, the webpage request including a first element from a first dataset and a second element from a second dataset. In response, the computer server generates two sets of combinations between the first and second elements and respective elements of the second and first datasets, respectively. The computer server queries a cache for application data associated with each combination of elements. For each combination that returns a cache miss, the computer server retrieves the associated application data from an application database and stores the application data in the cache. The computer generates a response using application data associated with the first and second elements and returns the response to the client device.

Abstract: An embodiment is a device including a first fin extending from a substrate, a first gate stack over and along sidewalls of the first fin, a first gate spacer disposed along a sidewall of the first gate stack, and a first epitaxial source/drain region in the first fin and adjacent the first gate spacer. The first epitaxial source/drain region including a first epitaxial layer on the first fin, the first epitaxial layer including silicon and carbon, a second epitaxial layer on the first epitaxial layer, the second epitaxial layer having a different material composition than the first epitaxial layer, the first epitaxial layer separating the second epitaxial layer from the first fin, and a third epitaxial layer on the second epitaxial layer, the third epitaxial layer having a different material composition than the first epitaxial layer.

Abstract: A packaging structure of a laser diode is provided. The packaging structure of the laser diode includes a laser chip, a first substrate and a second substrate. The first substrate having a first electrode and a second electrode on a first surface of the first substrate, and the laser chip is disposed on the first surface of the first substrate; and a second substrate having a third electrode and a fourth electrode on a second surface of the second substrate, wherein the first electrode and the second electrode are electrically connected to the third electrode and the fourth electrode by a wireless-bonding process, respectively.

Abstract: Presented herein is a device including an insulator layer disposed over a substrate. An adhesion layer is disposed over the insulator layer and includes a semiconductor oxide, the semiconductor oxide includes a compound of a semiconductor element and oxygen. A semiconductor film layer is over the adhesion layer, the semiconductor film layer being a material that includes the semiconductor element, the semiconductor film layer having a different composition than the adhesion layer. Bonds at an interface between the insulator layer and the adhesion layer comprise oxygen-hydrogen bonds and oxygen-semiconductor element bonds. An interface between a dummy gate and a gate dielectric layer of a gate-last transistor structure may be similarly formed.

Abstract: A method of selectively removing silicon nitride is provided. The method includes: providing a wafer having silicon nitride on a surface of the wafer; providing a mixture of phosphoric acid and a silicon-containing material; and delivering the mixture to the surface of the wafer to remove the silicon nitride. Single wafer etching apparatuses of selectively removing silicon nitride are also provided.

Abstract: A method of packaging an integrated circuit includes forming a first integrated circuit and a second integrated circuit on a wafer, the first and second integrated circuit separated by a singulation region. The method includes covering the first and second integrated circuits with a molding compound, and sawing through the molding compound and a top portion of the wafer using a beveled saw blade, while leaving a bottom portion of the wafer remaining. The method further includes sawing through the bottom portion of the wafer using a second saw blade, the second saw blade having a thickness that is less than a thickness of the beveled saw blade. The resulting structure is within the scope of the present disclosure.

Abstract: A device comprises a buried layer over a substrate, a first well over the buried layer, a first high voltage region and a second high voltage region extending through the first well, a first drain/source region in the first high voltage region, a first gate electrode over the first well, a first spacer on a first side of the first gate electrode, wherein the first spacer is between the first drain/source region and the first gate electrode, a second spacer on a second side of the first gate electrode, a second drain/source region in the second high voltage region and a first isolation region in the second high voltage region and between the second drain/source region and the first gate electrode.

Abstract: This disclosure relates to an autonomous intelligent vehicle, including: a vehicle body and two eye lamps located in the front of the vehicle body and spaced apart from each other, wherein the eye lamp comprises a light emitting device and image acquiring device spaced apart from the light emitting device; the light emitting device is used to emit light to light the object in front of the vehicle, the image acquiring device is used to acquire and process the image of the object, and send the processed result to the advanced driver assistance system.

Abstract: A target tracking method and system adaptable to multi-target tracking include performing global-search detection on a current image to obtain candidates of the current image. Association between the candidates and a tracked target is performed to determine similarity between the candidates and the tracked target and to give corresponding similarity values to the candidates. The candidate with a maximum similarity value is defined as an associated candidate of the tracked target. Candidates with non-zero similarity values and primary-object classification other than the associated candidate are filtered out and defined as filtered candidates. New tracked targets are generated according to the associated candidate and the filtered candidates.

Abstract: An imaging lens includes first, second, third, fourth, fifth and six lens elements arranged in order from an object side to an image side along an optical axis. Each lens element has an object-side surface and an image-side surface. The image-side surface of the second lens element has a concave portion in a vicinity of the optical axis. The third lens element has negative refractive power. The object-side surface of the third lens element has a concave portion in a vicinity of the optical axis. The object-side surface of the fifth lens element has a convex portion in a vicinity of a periphery. All lens elements of the imaging lens having the refractive power are only the first, second, third, fourth, fifth and six lens elements.