Abstract: A composite inflatable mattress includes a bottom layer, an air cushion layer and an air pressure adjustment unit. The bottom layer defines a bottom space. The air cushion layer is disposed on the bottom layer and includes an outer casing, and a partition plate disposed in the outer casing and cooperating with the outer casing to define two air chambers thereamong. The air pressure adjustment unit is mounted to the bottom layer and the air cushion layer, and includes an inflation mechanism mounted to the air cushion layer and in spatial communication with the two air chambers, an air pump motor mounted in the bottom space and in spatial communication with the inflation mechanism, and two pressure relief valves mounted to the outer casing and in spatial communication respectively with the two air chambers.

Abstract: An information handling system, comprising an embedded controller configured to remove a first power setting of the information handling system in response to a determination that a power adapter plugged in the information handling system is undersized. The embedded controller is further configured to determine a second power setting based on a power rating of the power adapter and transmit an advanced configuration and power interface (ACPI) command to a basic input/output system (BIOS) to set the information handling system to the second power setting. The BIOS is configured to determine an offset value for a total graphics power based on the power rating of the power adapter subsequent to receipt of the ACPI command and notify a graphics processing unit of the offset value.

Abstract: A method of inspecting a wafer dicing process entails performing a scanning process on a grooved wafer with a light beam used by an optical scanning device. The method includes using a film layer of the grooved wafer as an incident surface for the scanning process; performing the scanning process on the grooved wafer in a Y-axis direction to obtain XZ section structure images corresponding in position to consecutive different Y-axis positions on the grooved wafer; analyzing the XZ section structure images at the consecutive different positions and defining positions corresponding in position to grooves, the film layer, a silicon layer and a metal layer; and analyzing a depth of each of the grooves to determine whether the grooved wafer is grooved successfully or grooved unsuccessfully. Therefore, the method is applicable to wafer processing procedures and addresses the lack of inspection methods in the wafer dicing process.

Abstract: A laser grooving operation is performed to form a plurality of grooves in a semiconductor die prior to attaching the semiconductor die to a semiconductor device package substrate. In addition to forming a first groove through which blade sawing is to be performed to separate the semiconductor die from other semiconductor dies, a second groove may be formed between the first groove and a seal ring of the semiconductor die. The second groove is configured to contain any potential delamination that might otherwise propagate to an active region of the semiconductor die. Accordingly, the second groove and the associated laser grooving operation described herein may reduce the likelihood of delamination that might otherwise be caused by swelling and/or expansion in a molding compound formed around the semiconductor die after the semiconductor die is attached to the semiconductor device package substrate.

Abstract: A laser grooving operation is performed to form a plurality of grooves in a semiconductor die prior to attaching the semiconductor die to a semiconductor device package substrate. In addition to forming a first groove through which blade sawing is to be performed to separate the semiconductor die from other semiconductor dies, a second groove may be formed between the first groove and a seal ring of the semiconductor die. The second groove is configured to contain any potential delamination that might otherwise propagate to an active region of the semiconductor die. Accordingly, the second groove and the associated laser grooving operation described herein may reduce the likelihood of delamination that might otherwise be caused by swelling and/or expansion in a molding compound formed around the semiconductor die after the semiconductor die is attached to the semiconductor device package substrate.

Abstract: An optical scanning system for non-destructively acquiring a three-dimensional structure of an object includes an optical image processing device and an optical scanning device. The optical image processing device is configured to generate an optical beam along a first optical axis direction. The optical scanning device is configured to convert the optical beam along the first optical axis direction into an optical beam along a second optical axis direction, and scan an object to be inspected by using the optical beam along the second optical axis direction. The optical image processing device scans the object to be inspected by the optical scanning device along X-axis and Y-axis directions to acquire YZ and XZ cross section structural images at different consecutive positions, so as to reconstruct a three-dimensional structural image.

Abstract: A laser grooving operation is performed to form a plurality of grooves in a semiconductor die prior to attaching the semiconductor die to a semiconductor device package substrate. In addition to forming a first groove through which blade sawing is to be performed to separate the semiconductor die from other semiconductor dies, a second groove may be formed between the first groove and a seal ring of the semiconductor die. The second groove is configured to contain any potential delamination that might otherwise propagate to an active region of the semiconductor die. Accordingly, the second groove and the associated laser grooving operation described herein may reduce the likelihood of delamination that might otherwise be caused by swelling and/or expansion in a molding compound formed around the semiconductor die after the semiconductor die is attached to the semiconductor device package substrate.

Abstract: The present disclosure describes a structure that joins semiconductor packages and a method for forming the structure. The structure includes an adhesion layer in contact with a first semiconductor package and a first joint pad in contact with the adhesion layer. The structure further includes a film layer disposed on the first semiconductor package and the first joint pad, where the film layer includes a slanted sidewall, the slanted sidewall covers an end portion of the adhesion layer and a first portion of the first joint pad, and the slanted sidewall exposes a second portion of the first joint pad. The structure further includes a solder ball attached to the second portion of the first joint pad and a second joint pad of a second semiconductor package.

Abstract: A pepper mill includes a receiving unit, a grinding unit, and an adjusting mechanism. The receiving unit includes a stationary seat and a rotatable seat. The grinding unit includes inner and outer grinding seats. The adjusting mechanism includes an operating base mounted in the rotatable seat and operable to rotate about a rotary axis, and a movable seat disposed between the operating base and the inner grinding seat. The operating base includes a threaded rod extending upwardly into and threadedly engaging the movable seat. The movable seat is connected co-rotatably to the rotatable seat, is movable with the inner grinding seat along the rotary axis, and is not rotatable relative to the rotatable seat. Rotation of the operating base drives the movable seat to move along the rotary axis under guidance of the rotatable seat, thereby driving the inner grinding seat to move along the rotary axis.

Abstract: A reacting device of dual path synchronous immunochromatographic platform includes a seat, an upper housing, and a fluid dividing funnel. The seat contains two immunochromatographic carriers. The hollow pipe portion has two sloped structures. A force bearing portion of the fluid dividing funnel can be pressed down, so two fluid exits of the fluid dividing funnel move towards these two sloped structures. The specimen drops and is guided into these two immunochromatographic carriers respectively. A reaction result can be observable. The fluid dividing funnel can divide the specimen into two immunochromatographic carriers evenly. The sloped structure can increase the accuracy of specimen supply. Excess specimen can be scraped off for enhancing the solving accuracy. In addition, it can decrease the possibility of false positive problem.

Abstract: A sealing cover for covering an opening of a barrel body includes an outer cover body, an inner cover body, an airtight ring and an operating member. The outer cover body includes two pivot connecting portions. The airtight ring is sleeved on an outer peripheral surface of the inner cover body. The operating member is pivotally connected to the pivot connecting portions and the inner cover body. The operating member is operable to pivot so as to drive movement of the inner cover body between a sealed position and an unsealed position. When at the sealed position, the airtight ring is deformed and airtightly pressed between the barrel body and the outer cover body. When at the unsealed position, the airtight ring restores to its original shape and is configured not to be pressed between the barrel body and the outer cover body.

Abstract: A sealing cover for covering an opening of a barrel body includes an outer cover body, an inner cover body, an airtight ring and an operating member. The outer cover body includes two pivot connecting portions. The airtight ring is sleeved on an outer peripheral surface of the inner cover body. The operating member is pivotally connected to the pivot connecting portions and the inner cover body. The operating member is operable to pivot so as to drive movement of the inner cover body between a sealed position and an unsealed position. When at the sealed position, the airtight ring is deformed and airtightly pressed between the barrel body and the outer cover body. When at the unsealed position, the airtight ring restores to its original shape and is configured not to be pressed between the barrel body and the outer cover body.

Abstract: A device for encouraging and guiding a spirometer user includes a housing, a main valve, a visual assembly, and a sound making assembly. The housing has a guiding channel, a first outlet channel, a second outlet channel, and an inlet channel. The main valve is disposed in a housing communicating with the guiding channel, the first outlet channel, the second outlet channel or the inlet channel and configured to regulate or control fluid flowing paths. The visual assembly includes a check valve in the second outlet channel, and at least one movable member. The sound making assembly includes a check valve and a sound maker. So, it can generate the visual and sound encouraging effects for learning how to use a spirometer correctly.

Abstract: A pepper mill includes a receiving unit, a grinding unit, and an adjusting mechanism. The receiving unit includes a stationary seat and a rotatable seat. The grinding unit includes inner and outer grinding seats. The adjusting mechanism includes an operating base mounted in the rotatable seat and operable to rotate about a rotary axis, and a movable seat disposed between the operating base and the inner grinding seat. The operating base includes a threaded rod extending upwardly into and threadedly engaging the movable seat. The movable seat is connected co-rotatably to the rotatable seat, is movable with the inner grinding seat along the rotary axis, and is not rotatable relative to the rotatable seat. Rotation of the operating base drives the movable seat to move along the rotary axis under guidance of the rotatable seat, thereby driving the inner grinding seat to move along the rotary axis.

Abstract: A laser grooving operation is performed to form a plurality of grooves in a semiconductor die prior to attaching the semiconductor die to a semiconductor device package substrate. In addition to forming a first groove through which blade sawing is to be performed to separate the semiconductor die from other semiconductor dies, a second groove may be formed between the first groove and a seal ring of the semiconductor die. The second groove is configured to contain any potential delamination that might otherwise propagate to an active region of the semiconductor die. Accordingly, the second groove and the associated laser grooving operation described herein may reduce the likelihood of delamination that might otherwise be caused by swelling and/or expansion in a molding compound formed around the semiconductor die after the semiconductor die is attached to the semiconductor device package substrate.

Abstract: The present disclosure describes a structure that joins semiconductor packages and a method for forming the structure. The structure includes an adhesion layer in contact with a first semiconductor package and a first joint pad in contact with the adhesion layer. The structure further includes a film layer disposed on the first semiconductor package and the first joint pad, where the film layer includes a slanted sidewall, the slanted sidewall covers an end portion of the adhesion layer and a first portion of the first joint pad, and the slanted sidewall exposes a second portion of the first joint pad. The structure further includes a solder ball attached to the second portion of the first joint pad and a second joint pad of a second semiconductor package.

Abstract: A reacting device of dual path synchronous immunochromatographic platform includes a seat, an upper housing, and a fluid dividing funnel. The seat contains two immunochromatographic carriers. The hollow pipe portion has two sloped structures. A force bearing portion of the fluid dividing funnel can be pressed down, so two fluid exits of the fluid dividing funnel move towards these two sloped structures. The specimen drops and is guided into these two immunochromatographic carriers respectively. A reaction result can be observable. The fluid dividing funnel can divide the specimen into two immunochromatographic carriers evenly. The sloped structure can increase the accuracy of specimen supply. Excess specimen can be scraped off for enhancing the solving accuracy. In addition, it can decrease the possibility of false positive problem.

Abstract: A device for encouraging and guiding a spirometer user includes a housing, a main valve, a visual assembly, and a sound making assembly. The housing has a channel, a first outlet channel, a second outlet channel, and an inlet channel. The main valve is disposed in a housing communicating with the channel, the first outlet channel, the second outlet channel or the inlet channel and configured to regulate or control fluid flowing paths. The visual assembly includes a check valve in the second outlet channel, and at least one movable member. The sound making assembly includes a check valve and a sound making member. So, it can generate the visual and sound encouraging effects for learning how to use a spirometer correctly.

Abstract: A barcode detection method includes obtaining a gradient of each pixel in an image, generating a gradient phase and a gradient magnitude of each pixel according to the gradient, and binarizing the gradient magnitude of each pixel to generate a binary image, generating a sliding window on the image, sampling the binary image vertically and horizontally within the sliding window to generate the numbers of grayscale value variations in the vertical and horizontal directions, locating the most intensive flip region according to the grayscale variations in the vertical and horizontal directions, locating a core barcode region according to the most intensive flip region, capturing the gradient phase of the pixels in the core barcode region to generate a gradient phase distribution, generating a barcode format detection result according to the gradient phase distribution, and locating the barcode region according to the barcode format detection result.

Abstract: A barcode detection method includes obtaining a gradient of each pixel in an image, generating a gradient phase and a gradient magnitude of each pixel according to the gradient, and binarizing the gradient magnitude of each pixel to generate a binary image, generating a sliding window on the image, sampling the binary image vertically and horizontally within the sliding window to generate the numbers of grayscale value variations in the vertical and horizontal directions, locating the most intensive flip region according to the grayscale variations in the vertical and horizontal directions, locating a core barcode region according to the most intensive flip region, capturing the gradient phase of the pixels in the core barcode region to generate a gradient phase distribution, generating a barcode format detection result according to the gradient phase distribution, and locating the barcode region according to the barcode format detection result.