Patents by Inventor Mingzhu Wang

Mingzhu Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220308310
    Abstract: An adjustable optical lens and camera module, and manufacturing method and applications thereof is disclosed. The camera module includes an optical sensor and an adjustable optical lens. The adjustable optical lens includes an optical structural member and at least two lenses, wherein each of the lenses is arranged in an internal space of the optical structural member. Along a vertical direction of the optical structural member, at least one lens is adapted to be adjustably pre-mounted to an internal space of the optical structural member serving as an adjustable lens. The side wall of the optical structural member is provided with at least one adjustment channel, which is positioned corresponding to the adjustable lens, so that an assembling position of the adjustable lens can be adjusted through the adjustment channel so as to align a central axis line of the adjustable optical lens with a central axis line of the optical sensor.
    Type: Application
    Filed: July 15, 2021
    Publication date: September 29, 2022
    Inventors: Mingzhu WANG, Bojie ZHAO, Heng JIANG, Liang DING, Feifan CHEN, Chunmei LIU, Nan GUO, Shoujie WANG
  • Patent number: 11457135
    Abstract: The present invention provides a camera unit with a light steering mechanism and application thereof, wherein the camera unit includes a long-focal-length camera module and a wide-angle camera module, wherein the wide-angle camera module provides a wide-angle image, and a ratio between an equivalent focal length of the long-focal-length camera module and an equivalent focal length of the wide-angle camera module is not less than 4, wherein the long-focal-length camera module includes a light steering mechanism, a long-focal-length lens and a long-focal-length photosensitive assembly, wherein the light steering mechanism is used for turning the light to pass through the long-focal-length lens to be received by the long-focal-length photosensitive assembly, wherein a height dimension of the long-focal-length camera module does not exceed 5.6 mm.
    Type: Grant
    Filed: June 6, 2019
    Date of Patent: September 27, 2022
    Assignee: NINGBO SUNNY OPOTECH CO., LTD.
    Inventors: Mingzhu Wang, Yinli Fang, Lifeng Yao, Ang Ji, Yurong Wu
  • Publication number: 20220299728
    Abstract: An optical lens (1000), comprising a first lens element (110) and a second lens component (200). The first lens element (110) has a first surface (112) located on an object side and a second surface (117) located on an image side, wherein a central region of the first surface (112) protrudes toward the object side to form a protruding portion (111), a top surface (113) of the protruding portion (111) forms an optical area (113a), the first surface (112) further has a first structured area (115) surrounding the protruding portion (111), and a side surface (114) connects the optical area (113a) and the first structured area (115). The second lens component (200) comprises a second lens barrel (220) and at least one second lens element (210) mounted inside the second lens barrel (220), and the at least one second lens element (210) and the first lens element (110) together constitute an imageable optical system.
    Type: Application
    Filed: July 3, 2020
    Publication date: September 22, 2022
    Applicant: NINGBO SUNNY OPOTECH CO., LTD
    Inventors: Mingzhu WANG, Lifeng YAO, Qi RONG, Zhewen MEI, Meishan GUO, Dongli YUAN, Haipeng PEI, Jun WANG
  • Publication number: 20220304148
    Abstract: A camera module with compression-molded circuit board is manufactured by compression-molding that can obtain properties such as high flatness, ultra-thin, fine wiring width and high integration.
    Type: Application
    Filed: May 18, 2021
    Publication date: September 22, 2022
    Inventors: Mingzhu WANG, Nan GUO, Feifan CHEN, Bojie ZHAO, Bo PENG, Zhen HUANG
  • Publication number: 20220301054
    Abstract: The invention relates to a block bidding method and system for promoting clean energy consumption based on the power trading platform. The block bidding method includes the following steps: dividing the time slots for clean energy units to participate in power trading; predicting the typical monthly power generation curve of clean energy units; decomposing the signed annual power contract of clean energy units into months; determining the monthly trading declaration curve of clean energy units; determining the monthly trading declaration curve of clean energy units; determining the time-slot declaration price of clean energy units; realizing the trading clearing by the power trading platform in accordance with the principle of “high-low matching”.
    Type: Application
    Filed: April 28, 2021
    Publication date: September 22, 2022
    Inventors: Lei WANG, Kai XIE, Yali ZHANG, Wujun DONG, Honghai TANG, Ning YANG, Hao TAN, Liang XU, Nan KANG, Peiyu XI, Haining WANG, Shijie JI, Qingbo WANG, Chuncheng GAO, Yin FANG, Shuhong SHI, Mingzhu YUAN, Qian ZHANG, Wentao LV, Jingwei LV, Wanli HU, Ziyang BAI, Junliang LV, Jincheng ZHANG, Xian ZHAO, Xin CHANG, Shulu WAN, Shoubao LI, Ruixiao LI, Ying XUE, Xuan YIN
  • Publication number: 20220303437
    Abstract: A photosensitive component, and a camera module and a manufacturing method therefor. The photosensitive component comprises at least a photosensitive element, at least a window-form circuit board and at least a packaging body, wherein the photosensitive element and the window-form circuit board are integrally packaged through the packaging body. The window-form circuit board comprises a circuit board main body which comprises at least one window arranged thereon, wherein the photosensitive element is arranged within the window.
    Type: Application
    Filed: June 1, 2022
    Publication date: September 22, 2022
    Inventors: Mingzhu WANG, Zhenyu CHEN, Zhongyu LUAN, Zhen HUANG, Nan GUO, Fengsheng XI, Takehiko TANAKA, Bojie ZHAO, Heng JIANG, Ye WU, Zilong DENG
  • Publication number: 20220303441
    Abstract: A camera module and an array camera module based on an integral packing process are disclosed. The camera module or each of the camera module units of the array camera module includes a circuit board, an integral base, a photosensitive element operatively connected to the circuit board, a lens, a light filter holder installed at the integral base and a light filter installed at the light filter holder. The light filter is not required to be directly installed to the integral base, so that the light filter is protected and the requiring area of the light filter is reduced.
    Type: Application
    Filed: June 6, 2022
    Publication date: September 22, 2022
    Inventors: Mingzhu WANG, Bojie ZHAO, Zhenyu CHEN, Nan GUO, Takehiko TANAKA
  • Patent number: 11451693
    Abstract: The present invention provides a camera module and a molding circuit board assembly, circuit board and application thereof, the circuit board comprising a digital circuit unit, an analog circuit unit and a substrate. The digital circuit nit and the analog circuit unit are respectively formed on the substrate, and the digital circuit unit and the analog circuit unit are conductively connected to each other, wherein at least one part of the analog circuit unit has a safe distance from the digital circuit unit, so as to prevent an electromagnetic wave generated by a circuit of the digital circuit unit from interfering with an electrical signal transmitted and processed by the analog circuit unit, thereby improving the stability and reliability of the transmission and the processing of the electrical signal by the circuit board.
    Type: Grant
    Filed: May 7, 2021
    Date of Patent: September 20, 2022
    Assignee: NINGBO SUNNY OPOTECH CO., LTD.
    Inventors: Mingzhu Wang, Duanliang Cheng, Fengsheng Xi, Bojie Zhao, Takehiko Tanaka, Zhen Huang, Zhenyu Chen, Nan Guo
  • Publication number: 20220294940
    Abstract: A camera module and a photosensitive assembly thereof, an electronic device, and a manufacturing method are provided. The photosensitive assembly includes a photosensitive chip having a photosensitive area and an electric connection area located around the photosensitive area, at least one resistance-capacitance device, a conducting element, an expanded wiring layer, and a molded base. The expanded wiring layer has a top surface and a bottom surface. The at least one resistance-capacitance device is electrically connected to the bottom surface of the expanded wiring layer. The conducting element extends between the bottom surface of the expanded wiring layer and the electric connection area of the photosensitive chip, so as to electrically connect the photosensitive chip to the expanded wiring layer by means of the conducting element. A light hole is formed in the expanded wiring layer, and the light hole corresponds to at least the photosensitive area of the photosensitive chip.
    Type: Application
    Filed: February 28, 2020
    Publication date: September 15, 2022
    Applicant: NINGBO SUNNY OPOTECH CO., LTD.
    Inventors: Mingzhu WANG, Takehiko TANAKA, Xiaodi LIU, Zhen HUANG, Zhenyu CHEN
  • Publication number: 20220294943
    Abstract: Disclosed are a camera module and a photosensitive assembly thereof, an electronic device, and a manufacturing method. The photosensitive assembly includes a photosensitive chip, at least one resistance-capacitance device, an extended wiring layer, a filter element assembly, and a molded base. The filter element assembly includes a filter element and a bonding layer bonded around the filter element. The filter element assembly is attached to a top surface of the extended wiring layer, and the filter element of the filter element assembly corresponds to a light transmission hole of the extended wiring layer, so that external light is filtered by the filter element before reaching a photosensitive area of the photosensitive chip through the light transmission hole.
    Type: Application
    Filed: February 28, 2020
    Publication date: September 15, 2022
    Applicant: NINGBO SUNNY OPOTECH CO., LTD.
    Inventors: Mingzhu WANG, Takehiko TANAKA, Zhen HUANG, Zhenyu CHEN
  • Publication number: 20220286592
    Abstract: A camera module, a molded circuit board assembly, a molded photosensitive assembly and manufacturing method thereof are disclosed. The camera module includes a molded base which is integrally formed with a circuit board through a molding process, wherein a photosensitive element may be electrically connected on the circuit board and at least a portion of a non-photosensitive area portion of the photosensitive element is also connected by the molded base through the molding process. A light window is formed in a central portion of the molded base to provide a light path for the photosensitive element, wherein a cross section of the light window is configured to have a trapezoidal or multi-step trapezoidal shape which has a size increasing from bottom to top to facilitate demoulding and avoiding stray lights.
    Type: Application
    Filed: May 25, 2022
    Publication date: September 8, 2022
    Inventors: Mingzhu WANG, Zhenyu CHEN, Nan GUO, Takehiko TANAKA, Bojie ZHAO, Zilong DENG
  • Publication number: 20220283399
    Abstract: A camera lens module includes an image sensor and a lens assembly. The image sensor includes a photosensitive chip defining a photosensitive path, wherein the lens assembly is coupled to the image sensor along the photosensitive path of the photosensitive chip. The lens assembly includes at least one optical lens module and an aperture member coupled at the optical lens module, wherein the optical lens module includes a lens barrel and at least an optical lens supported within the lens barrel. A relative position of the lens assembly with respect to the image sensor is adjustable for calibration and the relative position of the optical lens module is permanently fixed after calibration.
    Type: Application
    Filed: May 23, 2022
    Publication date: September 8, 2022
    Inventors: Mingzhu WANG, Heng JIANG, Feifan CHEN, Chunmei LIU, Bojie ZHAO, Nan GUO, Liang DING
  • Patent number: 11435545
    Abstract: A camera lens module includes a lens assembly. The lens assembly may comprise a first optical lens module comprising a first carrier and at least one first optical lens received in the first carrier; and a second optical lens module comprising a second carrier, at least one second optical lens received in the second carrier, and a bearing portion connected to the second carrier. When the first optical lens module and the second optical lens module are assembled together, an adjustable clearance exists between the first carrier and the bearing portion, and between bottom surfaces of the first carrier and a lowermost lens of the first optical lenses and a top surface of an uppermost lens of the second optical lenses.
    Type: Grant
    Filed: June 22, 2020
    Date of Patent: September 6, 2022
    Assignee: NINGBO SUNNY OPOTECH CO., LTD.
    Inventors: Chunmei Liu, Yiqi Wang, Liang Ding, Mingzhu Wang, Hailong Liao, Nan Guo
  • Publication number: 20220268968
    Abstract: A molded photosensitive assembly includes a supporting member, at least a circuit board, at least two photosensitive units, at least two lead wires, and a mold sealer. The photosensitive units are coupled at the chip coupling area of the circuit board. The lead wires are electrically connected the photosensitive units at the chip coupling area of the circuit board. The mold sealer includes a main mold body and has two optical windows. When the main mold body is formed, the lead wires, the circuit board and the photosensitive units are sealed and molded by the main mold body of the mold sealer, such that after the main mold body is formed, the main mold body and at least a portion of the circuit board are integrally formed together at a position that the photosensitive units are aligned with the optical windows respectively.
    Type: Application
    Filed: May 10, 2022
    Publication date: August 25, 2022
    Inventors: Mingzhu WANG, Bojie ZHAO, Takehiko TANAKA, Nan GUO, Zhenyu CHEN, Heng JIANG, Zhongyu LUAN, Fengsheng XI, Feifan CHEN, Liang DING
  • Patent number: 11394861
    Abstract: A camera module includes a circuit board, a photosensitive element mounted on the circuit board, and a support body formed on the circuit board and surrounding the photosensitive element. The support body extends towards the photosensitive element and contacts the photosensitive element. The support body and the circuit board are fixed together to form a combined body, and the combined body has a side face including an indented surface indented towards the direction of the photosensitive element, one end of the indented surface being located at the bottom surface of the circuit board. A method is used for manufacturing a camera module and an intelligent terminal with built-in camera module. The screen-to-body ratio of the intelligent terminal is increased, which allows the thickness of the intelligent terminal to be further decreased, enables easy processing, and allows for a miniaturized camera module having a good structural strength.
    Type: Grant
    Filed: July 19, 2018
    Date of Patent: July 19, 2022
    Assignee: NINGBO SUNNY OPOTECH CO., LTD.
    Inventors: Mingzhu Wang, Bojie Zhao, Zhewen Mei, Nan Guo
  • Patent number: 11393862
    Abstract: A method for manufacturing a semiconductor module for an image-sensing device is disclosed. The method may comprise forming a first molding component on a first surface of a printed circuit board (PCB); mounting at least a photosensitive member to a second surface of the PCB; and forming a second molding component on the second surface of the PCB. The PCB may comprise at least an electric component on the first surface of the PCB. The first molding component may encapsulate the at least one electric component with the PCB. The second molding component may secure the photosensitive member on the PCB.
    Type: Grant
    Filed: June 23, 2020
    Date of Patent: July 19, 2022
    Assignee: NINGBO SUNNY OPOTECH CO., LTD.
    Inventors: Mingzhu Wang, Nan Guo, Zhenyu Chen, Bojie Zhao, Takehiko Tanaka, Feifan Chen, Ye Wu
  • Publication number: 20220224808
    Abstract: A split lens includes a first lens group including a first set of lenses, a second lens group including a second set of lenses, and at least one light shielding element. The light shielding element is disposed between the lens at the bottom position of the first lens group and the lens at the top position of the second lens group, such that a predetermined light path is formed between the first lens group and the second lens group, thereby conforming to the structure of the split lens.
    Type: Application
    Filed: March 22, 2018
    Publication date: July 14, 2022
    Inventors: Mingzhu WANG, Shoujie WANG, Nan GUO, Liang DING, Bojie ZHAO, Feifan CHEN, Chunmei LIU, Qimin MEI
  • Patent number: 11385432
    Abstract: A camera lens module includes an image sensor and a lens assembly. The image sensor includes a photosensitive chip defining a photosensitive path, wherein the lens assembly is coupled to the image sensor along the photosensitive path of the photosensitive chip. The lens assembly includes at least one optical lens module and an aperture member coupled at the optical lens module, wherein the optical lens module includes a lens barrel and at least an optical lens supported within the lens barrel. A relative position of the lens assembly with respect to the image sensor is adjustable for calibration and the relative position of the optical lens module is permanently fixed after calibration.
    Type: Grant
    Filed: January 23, 2019
    Date of Patent: July 12, 2022
    Assignee: NINGBO SUNNY OPOTECH CO., LTD.
    Inventors: Mingzhu Wang, Heng Jiang, Feifan Chen, Chunmei Liu, Bojie Zhao, Nan Guo, Liang Ding
  • Patent number: 11388320
    Abstract: A photosensitive component, and a camera module and a manufacturing method therefor. The photosensitive component comprises at least a photosensitive element, at least a window-form circuit board and at least a packaging body, wherein the photosensitive element and the window-form circuit board are integrally packaged through the packaging body. The window-form circuit board comprises a circuit board main body which comprises at least one window arranged thereon, wherein the photosensitive element is arranged within the window.
    Type: Grant
    Filed: June 2, 2017
    Date of Patent: July 12, 2022
    Assignee: NINGBO SUNNY OPOTECH CO., LTD.
    Inventors: Mingzhu Wang, Zhenyu Chen, Zhongyu Luan, Zhen Huang, Nan Guo, Fengsheng Xi, Takehiko Tanaka, Bojie Zhao, Heng Jiang, Ye Wu, Zilong Deng
  • Patent number: 11378722
    Abstract: An optical lens head, an camera module, and an assembling method therefor, wherein the camera module comprises a photosensitive chip (23) and an optical lens head (10); said optical lens head (10) comprises a plurality of optical lenses (111); the assembly position of one of the optical lenses (111) is adjustable; each of the optical lenses (111) is black-lacquered and matte-treated; a connecting portion (1113), a light-beam entrance hole (1114) and a light-shielding portion (1115) are formed on the corresponding optical lenses (111), such that the individual optical lenses (111) can be successively and jointly assembled together, eliminating the need of a spacing ring, a diaphragm, a lens barrel and other structural components used in a conventional camera module, thereby improving manufacture precision, production yield and imaging quality of the camera module.
    Type: Grant
    Filed: January 18, 2017
    Date of Patent: July 5, 2022
    Inventors: Mingzhu Wang, Nan Guo, Heng Jiang, Chunmei Liu