Patents by Inventor Mingzhu Wang

Mingzhu Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230012466
    Abstract: An adjustable optical lens and camera module, and manufacturing method and applications thereof is disclosed. The camera module includes an optical sensor and an adjustable optical lens. The adjustable optical lens includes an optical structural member and at least two lenses, wherein each of the lenses is arranged in an internal space of the optical structural member. Along a vertical direction of the optical structural member, at least one lens is adapted to be adjustably pre-mounted to an internal space of the optical structural member serving as an adjustable lens. The side wall of the optical structural member is provided with at least one adjustment channel, which is positioned corresponding to the adjustable lens, so that an assembling position of the adjustable lens can be adjusted through the adjustment channel so as to align a central axis line of the adjustable optical lens with a central axis line of the optical sensor.
    Type: Application
    Filed: July 15, 2021
    Publication date: January 12, 2023
    Inventors: Mingzhu WANG, Bojie ZHAO, Heng JIANG, Liang DING, Feifan CHEN, Chunmei LIU, Nan GUO, Shoujie WANG
  • Publication number: 20220413251
    Abstract: The present invention provides a method for assembling a camera module, including: preparing a first sub-lens assembly and a second sub-assembly, wherein the second sub-assembly includes a second sub-lens assembly and a photosensitive assembly fixed together; arranging the first sub-lens assembly on an optical axis of the second sub-lens assembly to form an optical system capable of imaging; adjusting a relative position of the first sub-lens assembly with respect to the second sub-lens assembly, so as to increase an actual measured resolution of imaging of the optical system, obtained by using the photosensitive element, to a first threshold, and decrease an actual measured image plane inclination obtained by using the photosensitive element to a second threshold; and connecting the first sub-lens assembly and the second sub-lens assembly. The present invention further provides a corresponding camera module.
    Type: Application
    Filed: August 31, 2022
    Publication date: December 29, 2022
    Inventors: Mingzhu Wang, Hailong Liao, Chunmei Liu, Yiqi Wang, Shuijia Chu
  • Patent number: 11533416
    Abstract: A camera module and an array camera module based on an integral packing process are disclosed. The camera module or each of the camera module units of the array camera module includes a circuit board, an integral base, a photosensitive element operatively connected to the circuit board, a lens, a light filter holder installed at the integral base and a light filter installed at the light filter holder. The light filter is not required to be directly installed to the integral base, so that the light filter is protected and the requiring area of the light filter is reduced.
    Type: Grant
    Filed: September 18, 2019
    Date of Patent: December 20, 2022
    Assignee: NINGBO SUNNY OPOTECH CO., LTD.
    Inventors: Mingzhu Wang, Bojie Zhao, Zhenyu Chen, Nan Guo, Takehiko Tanaka
  • Patent number: 11531180
    Abstract: A multi-group lens assembly (10), a camera module (100), and an electronic device (200) therefore are provided. The multi-group lens assembly (10) includes at least two group units (11 and 12). At least a first gap (15) is provided between the at least two adjacent group units (11 and 12) to compensate a difference between the multi-group lens assembly (10) and an optical design system, thus allowing an optical system of the multi-group lens assembly conform to the optical design system of the present invention.
    Type: Grant
    Filed: June 15, 2018
    Date of Patent: December 20, 2022
    Assignee: NINGBO SUNNY OPOTECH CO., LTD.
    Inventors: Chunmei Liu, Mingzhu Wang, Hailong Liao, Liang Ding
  • Publication number: 20220375978
    Abstract: A molded photosensitive assembly of a camera module includes at least one supporting member formed by a first substance, at least one photosensitive element, at least one circuit board, at least one set of wires electrically connecting the photosensitive element to the circuit board, and at least one molded base. Two ends of each of the wires are respectively connected to a chip connector of the photosensitive element and a circuit connector of the circuit board. The molded base is formed by a second substance and comprises a molded body and has at least one light window, wherein the photosensitive element and the wires are protected by a supporting member which is provided for avoiding an upper mold of a molding-die pressing on the wires during the molding process.
    Type: Application
    Filed: February 23, 2022
    Publication date: November 24, 2022
    Applicant: NINGBO SUNNY OPOTECH CO., LTD.
    Inventors: Mingzhu WANG, Zhenyu CHEN, Nan GUO, Bojie ZHAO, Takehiko TANAKA, Zhen HUANG, Zhongyu LUAN, Heng JIANG
  • Patent number: 11506857
    Abstract: The present invention provides a method for assembling a camera module, including: preparing a first sub-lens assembly and a second sub-assembly, wherein the second sub-assembly includes a second sub-lens assembly and a photosensitive assembly fixed together; arranging the first sub-lens assembly on an optical axis of the second sub-lens assembly to form an optical system capable of imaging; adjusting a relative position of the first sub-lens assembly with respect to the second sub-lens assembly, so as to increase an actual measured resolution of imaging of the optical system, obtained by using the photosensitive element, to a first threshold, and decrease an actual measured image plane inclination obtained by using the photosensitive element to a second threshold; and connecting the first sub-lens assembly and the second sub-lens assembly. The present invention further provides a corresponding camera module.
    Type: Grant
    Filed: April 20, 2018
    Date of Patent: November 22, 2022
    Inventors: Mingzhu Wang, Hailong Liao, Chunmei Liu, Yiqi Wang, Shuijia Chu
  • Patent number: 11509887
    Abstract: Provided are a fixed-focus photographing module, a manufacturing method thereof, and a focusing device and method thereof. The focusing method includes: pre-assembling an optical lens assembly in a lens assembly holder, wherein the optical lens assembly is exposed at the exterior of the lens assembly holder, and the optical lens assembly is located in a photosensing path of a photosensing component assembled in a circuit board to form a pre-assembled photographing module; performing, by the pre-assembled photographing module, a photographing operation to obtain a testing image; adjusting, according to the testing image, a relative position between the optical lens assembly and lens assembly holder until the pre-assemble photographing module outputs a clear image as required; and fixing the optical lens assembly and the lens assembly holder to complete a focusing operation and obtain an assembled fixed-focus photographing module.
    Type: Grant
    Filed: November 2, 2020
    Date of Patent: November 22, 2022
    Inventors: Zhenyu Chen, Mingzhu Wang, Xiaojuan Su, Bojie Zhao
  • Publication number: 20220342174
    Abstract: An adjustable optical lens, a camera module and an aligning method thereof are disclosed. The adjustable optical lens includes at least one lens element and an optical structure element. Each of the lens elements is successively and overlappingly arranged in an photosensitive apparatus of the optical structure element, wherein at least one of the lens elements is configured as an adjustable lens element whose assemble position is adjustable. The optical structure element has at least one adjusting channel and at least one fixing channel for adjusting and fixing the adjustable lens element respectively.
    Type: Application
    Filed: July 13, 2020
    Publication date: October 27, 2022
    Inventors: Mingzhu WANG, Bojie ZHAO, Liang DING, Chunmei LIU, Feifan CHEN, Nan GUO
  • Publication number: 20220345602
    Abstract: A camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof is provided. The array camera module includes two or more camera lenses and a circuit unit. The circuit unit includes a circuit board portion for electrically connecting two or more photosensitive sensors of the array camera module, and a conjoined encapsulation portion integrally encapsulated on the circuit board portion. The camera lenses are respectively arranged along the photosensitive paths of the photosensitive sensors.
    Type: Application
    Filed: July 1, 2020
    Publication date: October 27, 2022
    Inventors: Mingzhu WANG, Bojie ZHAO, Takehiko Tanaka, Feifan CHEN, Qimin MEI, Liang DING, Heng JIANG
  • Patent number: 11480754
    Abstract: A multi-group lens assembly includes a plurality of lens group units and at least one assembly structure. The assembly structure is for assembling two adjacent lens group units. Lenses in the lens group units are made of any two or three of a glass material, a resin material, and a glass-resin composite material. Alternatively, the lenses are made of only the glass-resin composite material. The lenses can be assembled and adjusted easily and conveniently and have high pixel densities and small TTLs, thereby improving user experience.
    Type: Grant
    Filed: June 14, 2018
    Date of Patent: October 25, 2022
    Assignee: NINGBO SUNNY OPOTECH CO., LTD.
    Inventors: Chunmei Liu, Mingzhu Wang, Zhenyu Chen, Nan Guo
  • Publication number: 20220334339
    Abstract: Provided is a lens assembly, which comprises: a first optical lens module, comprising a first carrier and at least one first optical lens received in the first carrier; and a second optical lens module, comprising a second carrier, at least one second optical lens received in the second carrier, and a bearing portion connected to the second carrier. A lower end portion of the first carrier extends to the bearing portion, so as to constrain the relative positions of the first optical lens module and the second optical lens module.
    Type: Application
    Filed: July 6, 2022
    Publication date: October 20, 2022
    Applicant: NINGBO SUNNY OPOTECH CO., LTD.
    Inventors: Chunmei LIU, Yiqi WANG, Liang DING, Mingzhu WANG, Hailong LIAO, Nan GUO
  • Patent number: 11477354
    Abstract: A camera module and its molded circuit board assembly and manufacturing method are disclosed, wherein the molded circuit board assembly includes a circuit board and a molded base integrally formed with the circuit board through a molding process. The molded base forms a light window disposed corresponding to a photosensitive element of the camera module, wherein the light window is configured to have a trapezoidal or to multi-stair trapezoidal shape cross section which has diameters increasing from bottom to top to facilitate demoulding, so as to prevent damage to the molded base, and to avoid stray light.
    Type: Grant
    Filed: April 8, 2020
    Date of Patent: October 18, 2022
    Assignee: NINGBO SUNNY OPOTECH CO., LTD.
    Inventors: Mingzhu Wang, Zhenyu Chen, Nan Guo, Takehiko Tanaka, Bojie Zhao, Zilong Deng
  • Publication number: 20220308310
    Abstract: An adjustable optical lens and camera module, and manufacturing method and applications thereof is disclosed. The camera module includes an optical sensor and an adjustable optical lens. The adjustable optical lens includes an optical structural member and at least two lenses, wherein each of the lenses is arranged in an internal space of the optical structural member. Along a vertical direction of the optical structural member, at least one lens is adapted to be adjustably pre-mounted to an internal space of the optical structural member serving as an adjustable lens. The side wall of the optical structural member is provided with at least one adjustment channel, which is positioned corresponding to the adjustable lens, so that an assembling position of the adjustable lens can be adjusted through the adjustment channel so as to align a central axis line of the adjustable optical lens with a central axis line of the optical sensor.
    Type: Application
    Filed: July 15, 2021
    Publication date: September 29, 2022
    Inventors: Mingzhu WANG, Bojie ZHAO, Heng JIANG, Liang DING, Feifan CHEN, Chunmei LIU, Nan GUO, Shoujie WANG
  • Patent number: 11457135
    Abstract: The present invention provides a camera unit with a light steering mechanism and application thereof, wherein the camera unit includes a long-focal-length camera module and a wide-angle camera module, wherein the wide-angle camera module provides a wide-angle image, and a ratio between an equivalent focal length of the long-focal-length camera module and an equivalent focal length of the wide-angle camera module is not less than 4, wherein the long-focal-length camera module includes a light steering mechanism, a long-focal-length lens and a long-focal-length photosensitive assembly, wherein the light steering mechanism is used for turning the light to pass through the long-focal-length lens to be received by the long-focal-length photosensitive assembly, wherein a height dimension of the long-focal-length camera module does not exceed 5.6 mm.
    Type: Grant
    Filed: June 6, 2019
    Date of Patent: September 27, 2022
    Assignee: NINGBO SUNNY OPOTECH CO., LTD.
    Inventors: Mingzhu Wang, Yinli Fang, Lifeng Yao, Ang Ji, Yurong Wu
  • Publication number: 20220303441
    Abstract: A camera module and an array camera module based on an integral packing process are disclosed. The camera module or each of the camera module units of the array camera module includes a circuit board, an integral base, a photosensitive element operatively connected to the circuit board, a lens, a light filter holder installed at the integral base and a light filter installed at the light filter holder. The light filter is not required to be directly installed to the integral base, so that the light filter is protected and the requiring area of the light filter is reduced.
    Type: Application
    Filed: June 6, 2022
    Publication date: September 22, 2022
    Inventors: Mingzhu WANG, Bojie ZHAO, Zhenyu CHEN, Nan GUO, Takehiko TANAKA
  • Publication number: 20220304148
    Abstract: A camera module with compression-molded circuit board is manufactured by compression-molding that can obtain properties such as high flatness, ultra-thin, fine wiring width and high integration.
    Type: Application
    Filed: May 18, 2021
    Publication date: September 22, 2022
    Inventors: Mingzhu WANG, Nan GUO, Feifan CHEN, Bojie ZHAO, Bo PENG, Zhen HUANG
  • Publication number: 20220303437
    Abstract: A photosensitive component, and a camera module and a manufacturing method therefor. The photosensitive component comprises at least a photosensitive element, at least a window-form circuit board and at least a packaging body, wherein the photosensitive element and the window-form circuit board are integrally packaged through the packaging body. The window-form circuit board comprises a circuit board main body which comprises at least one window arranged thereon, wherein the photosensitive element is arranged within the window.
    Type: Application
    Filed: June 1, 2022
    Publication date: September 22, 2022
    Inventors: Mingzhu WANG, Zhenyu CHEN, Zhongyu LUAN, Zhen HUANG, Nan GUO, Fengsheng XI, Takehiko TANAKA, Bojie ZHAO, Heng JIANG, Ye WU, Zilong DENG
  • Publication number: 20220299728
    Abstract: An optical lens (1000), comprising a first lens element (110) and a second lens component (200). The first lens element (110) has a first surface (112) located on an object side and a second surface (117) located on an image side, wherein a central region of the first surface (112) protrudes toward the object side to form a protruding portion (111), a top surface (113) of the protruding portion (111) forms an optical area (113a), the first surface (112) further has a first structured area (115) surrounding the protruding portion (111), and a side surface (114) connects the optical area (113a) and the first structured area (115). The second lens component (200) comprises a second lens barrel (220) and at least one second lens element (210) mounted inside the second lens barrel (220), and the at least one second lens element (210) and the first lens element (110) together constitute an imageable optical system.
    Type: Application
    Filed: July 3, 2020
    Publication date: September 22, 2022
    Applicant: NINGBO SUNNY OPOTECH CO., LTD
    Inventors: Mingzhu WANG, Lifeng YAO, Qi RONG, Zhewen MEI, Meishan GUO, Dongli YUAN, Haipeng PEI, Jun WANG
  • Patent number: 11451693
    Abstract: The present invention provides a camera module and a molding circuit board assembly, circuit board and application thereof, the circuit board comprising a digital circuit unit, an analog circuit unit and a substrate. The digital circuit nit and the analog circuit unit are respectively formed on the substrate, and the digital circuit unit and the analog circuit unit are conductively connected to each other, wherein at least one part of the analog circuit unit has a safe distance from the digital circuit unit, so as to prevent an electromagnetic wave generated by a circuit of the digital circuit unit from interfering with an electrical signal transmitted and processed by the analog circuit unit, thereby improving the stability and reliability of the transmission and the processing of the electrical signal by the circuit board.
    Type: Grant
    Filed: May 7, 2021
    Date of Patent: September 20, 2022
    Assignee: NINGBO SUNNY OPOTECH CO., LTD.
    Inventors: Mingzhu Wang, Duanliang Cheng, Fengsheng Xi, Bojie Zhao, Takehiko Tanaka, Zhen Huang, Zhenyu Chen, Nan Guo
  • Publication number: 20220294943
    Abstract: Disclosed are a camera module and a photosensitive assembly thereof, an electronic device, and a manufacturing method. The photosensitive assembly includes a photosensitive chip, at least one resistance-capacitance device, an extended wiring layer, a filter element assembly, and a molded base. The filter element assembly includes a filter element and a bonding layer bonded around the filter element. The filter element assembly is attached to a top surface of the extended wiring layer, and the filter element of the filter element assembly corresponds to a light transmission hole of the extended wiring layer, so that external light is filtered by the filter element before reaching a photosensitive area of the photosensitive chip through the light transmission hole.
    Type: Application
    Filed: February 28, 2020
    Publication date: September 15, 2022
    Applicant: NINGBO SUNNY OPOTECH CO., LTD.
    Inventors: Mingzhu WANG, Takehiko TANAKA, Zhen HUANG, Zhenyu CHEN