Patents by Inventor Mingzhu Wang

Mingzhu Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10578837
    Abstract: An array imaging module includes a molded photosensitive assembly which includes a supporting member, at least a circuit board, at least two photosensitive units coupled at the chip coupling area of the circuit board, at least two lead wires electrically connected the photosensitive units at the chip coupling area of the circuit board, and a mold sealer which includes a main mold body and has two optical windows. When the main mold body is formed, the lead wires, the circuit board and the photosensitive units are sealed and molded by the main mold body of the mold sealer, such that at least a portion of the circuit board are integrally formed together at a position that the photosensitive units are aligned with the optical windows respectively.
    Type: Grant
    Filed: October 15, 2017
    Date of Patent: March 3, 2020
    Assignee: Ningbo Sunny Opotech Co., Ltd.
    Inventors: Mingzhu Wang, Bojie Zhao, Takehiko Tanaka, Nan Guo, Zhenyu Chen, Heng Jiang, Zhongyu Luan, Fengsheng Xi, Feifan Chen, Liang Ding
  • Publication number: 20200036964
    Abstract: A 3D test chart, an adjusting arrangement, a forming method, and an adjusting method thereof are disclosed. The 3D test chart provides a plurality of test patterns arranged at different depths. When testing a photographic arrangement, the photographic arrangement is only required to move for one time or even does not need to be moved, so as to obtain an image containing information of different depths, so that the testing and adjusting process of the photographic arrangement can be easily achieved.
    Type: Application
    Filed: August 8, 2019
    Publication date: January 30, 2020
    Inventors: Mingzhu WANG, Baozhong Zhang, Chunmei LIU
  • Publication number: 20200021720
    Abstract: An array camera module having a height difference, a circuit board assembly and a manufacturing method therefor, and an electronic device. The array camera module comprises a first camera module unit and a second camera module unit, wherein the first camera module unit comprises at least one first photosensitive assembly and at least one first lens; the first lens is located on a photosensitive path of the first photosensitive assembly; the first photosensitive assembly comprises at least one extension portion; the extension portion at least partially extends towards the direction away from the first photosensitive assembly; and the second camera module unit is fixedly connected to a second extension portion, so that the ends of the two camera module units are consistent.
    Type: Application
    Filed: December 20, 2017
    Publication date: January 16, 2020
    Applicant: NINGBO SUNNY OPOTECH CO., LTD.
    Inventors: Mingzhu WANG, Takehiko TANAKA, Zhenyu CHEN, Nan GUO, Bojie ZHAO, Zhewen MEI
  • Publication number: 20200013823
    Abstract: The present invention provides a semiconductor packaging method and semiconductor device based on a molding process. In the packaging method, first, at least a portion of a compensation part is kept on at least a portion of a bonding region formed between a first adjoining surface of a semiconductor element and a second adjoining surface of a packaging component, to form a semi-finished product of a semiconductor device; then, during hardening of the packaging component, the compensation part is caused to undergo different degrees of deformation at different positions to compensate for a difference between a magnitude of deformation of the packaging component and a magnitude of deformation of the semiconductor element, so as to package the semiconductor element to form the semiconductor device. By means of the method, undesirable phenomena such as cracking and deformation of the surface of the semiconductor element can be avoided.
    Type: Application
    Filed: September 20, 2019
    Publication date: January 9, 2020
    Inventors: Mingzhu WANG, Bojie ZHAO, Takehiko TANAKA, Zhenyu CHEN, Heng JIANG, Nan GUO
  • Publication number: 20200007726
    Abstract: The present invention provides a camera module, a molding photosensitive assembly thereof, a manufacturing method, and an electronic device, the molding photosensitive assembly comprises a lens, a photosensitive element, a circuit board, a molding base, and a supporting element, the photosensitive element being arranged on the circuit board, the molding base being formed into an integral structure with the lens, the supporting element, the photosensitive element, and the circuit board by means of a molding process, and the camera module and the molding photosensitive assembly thereof being capable of reducing stain sensitivity and shortening the distance of the lens plane above a light through hole of the lens to the photosensitive plane of the photosensitive element.
    Type: Application
    Filed: February 8, 2018
    Publication date: January 2, 2020
    Applicant: Ningbo Sunny Opotech Co., Ltd.
    Inventors: Mingzhu WANG, Zhongyu LUAN, Liefeng CHEN, Duanliang CHENG, Bojie ZHAO, Takehiko TANAKA, Zhen HUANG
  • Publication number: 20190387147
    Abstract: A camera module includes a circuit board, an optical lens, an insulating member, a photosensitive sensor, and an integral encapsulating support structure. The insulating member is disposed on the periphery of a photosensitive area of the photosensitive sensor to prevent the photosensitive sensor from contacting to and being damaged by the formation mold during the forming process of the integral encapsulating support structure and to prevent the fluid material from flowing to the photosensitive area of the photosensitive sensor.
    Type: Application
    Filed: August 27, 2019
    Publication date: December 19, 2019
    Inventors: Mingzhu WANG, Bojie ZHAO, Takehiko TANAKA, Zhen HUANG, Nan GUO
  • Patent number: 10498942
    Abstract: A camera module, a molded circuit board assembly, a molded photosensitive assembly and manufacturing method thereof are disclosed. The camera module includes a molded base which is integrally formed with a circuit board through a molding process, wherein a photosensitive element may be electrically connected on the circuit board and at least a portion of a non-photosensitive area portion of the photosensitive element is also connected by the molded base through the molding process. A light window is formed in a central portion of the molded base to provide a light path for the photosensitive element, wherein a cross section of the light window is configured to have a trapezoidal or multi-step trapezoidal shape which has a size increasing from bottom to top to facilitate demolding and avoiding stray lights.
    Type: Grant
    Filed: March 16, 2017
    Date of Patent: December 3, 2019
    Assignee: Ningbo Sunny Opotech Co., Ltd.
    Inventors: Mingzhu Wang, Zhenyu Chen, Nan Guo, Takehiko Tanaka, Bojie Zhao, Zilong Deng
  • Publication number: 20190364184
    Abstract: The present disclosure provides a camera module, a circuit board assembly and a manufacturing method thereof, and an electronic device with the camera module, wherein the circuit board assembly comprises at least one electronic component, a substrate, and a molding unit. At least one of the electronic components is connected to the substrate conductively on a back face of the substrate. The molding unit comprises a back molding portion and a molding base, wherein the molding base is bonded to a front face of the substrate integrally when the back molding portion is bonded to at least a part of an area of the back face of the substrate integrally. There may be no need to reserve a position on the front face of the substrate to conductively connect the electronic components, so that the length and width of the camera module can be reduced, thereby reducing the volume of the camera module.
    Type: Application
    Filed: December 25, 2017
    Publication date: November 28, 2019
    Applicant: NINGBO SUNNY OPOTECH CO., LTD.
    Inventors: Mingzhu WANG, Nan GUO, Zhenyu CHEN, Bojie ZHAO, Takehiko TANAKA, Feifan CHEN, Ye WU
  • Publication number: 20190361191
    Abstract: A camera lens module includes an image sensor and a lens assembly. The image sensor includes a photosensitive chip defining a photosensitive path, wherein the lens assembly is coupled to the image sensor along the photosensitive path of the photosensitive chip. The lens assembly includes at least one optical lens module and an aperture member coupled at the optical lens module, wherein the optical lens module includes a lens barrel and at least an optical lens supported within the lens barrel. A relative position of the lens assembly with respect to the image sensor is adjustable for calibration and the relative position of the optical lens module is permanently fixed after calibration.
    Type: Application
    Filed: May 31, 2019
    Publication date: November 28, 2019
    Inventors: Mingzhu WANG, Heng JIANG, Feifan CHEN, Chunmei LIU, Bojie ZHAO, Nan GUO, Liang DING
  • Publication number: 20190364183
    Abstract: A camera module includes a lens, a photosensitive chip and an electrical holder. The electrical holder has an integrated circuit that the electrical holder serves as an integration of a base and a PCB in a conventional camera module, wherein the electrical holder not only forms an assembling unit for connecting a motor and an optical lens but also forms an electrical connection unit for electrically connecting to the motor, a photosensitive chip and a flexible circuit board with each other, so as to minimize an overall size of the camera module.
    Type: Application
    Filed: May 31, 2019
    Publication date: November 28, 2019
    Inventors: Mingzhu WANG, Nan GUO, Feifan CHEN, Bojie ZHAO, Bo PENG, Zhen HUANG
  • Publication number: 20190361153
    Abstract: A lens (10) and a camera module (100) and a manufacturing method thereof, wherein the lens (10) comprises an edge-cut lens sheet (114), wherein the edge-cut lens sheet (14) includes at least one chord edge (1141) and at least one circular edge (1142), wherein the chord edge (1141) and the circular edge (1142) are adjacently connected to each other, and wherein the chord edge (1141) and the circular edge (1142) have different curvatures, so that the lens sheet (114) becomes narrow and the width of the lens (10) become narrow, to form an ultra-narrow camera module (100).
    Type: Application
    Filed: January 26, 2018
    Publication date: November 28, 2019
    Applicant: NINGBO SUNNY OPOTECH CO., LTD.
    Inventors: Mingzhu WANG, Bojie ZHAO, Chunmei LIU, Feifan CHEN, Zhenyu CHEN
  • Patent number: 10477088
    Abstract: A camera module and an array camera module based on an integral packing process are disclosed. The camera module or each of the camera module units of the array camera module includes a circuit board, an integral base, a photosensitive element operatively connected to the circuit board, a lens, a light filter holder installed at the integral base and a light filter installed at the light filter holder. The light filter is not required to be directly installed to the integral base, so that the light filter is protected and the requiring area of the light filter is reduced.
    Type: Grant
    Filed: November 18, 2016
    Date of Patent: November 12, 2019
    Assignee: Ningbo Sunny Opotech Co., Ltd.
    Inventors: Mingzhu Wang, Bojie Zhao, Zhenyu Chen, Nan Guo, Takehiko Tanaka
  • Patent number: 10461116
    Abstract: The present invention provides a semiconductor packaging method and semiconductor device based on a molding process. In the packaging method, first, at least a portion of a compensation part is kept on at least a portion of a bonding region formed between a first adjoining surface of a semiconductor element and a second adjoining surface of a packaging component, to form a semi-finished product of a semiconductor device; then, during hardening of the packaging component, the compensation part is caused to undergo different degrees of deformation at different positions to compensate for a difference between a magnitude of deformation of the packaging component and a magnitude of deformation of the semiconductor element, so as to package the semiconductor element to form the semiconductor device. By means of the method, undesirable phenomena such as cracking and deformation of the surface of the semiconductor element can be avoided.
    Type: Grant
    Filed: April 6, 2018
    Date of Patent: October 29, 2019
    Assignee: NINGBO SUNNY OPOTECH CO., LTD.
    Inventors: Mingzhu Wang, Bojie Zhao, Takehiko Tanaka, Zhenyu Chen, Heng Jiang, Nan Guo
  • Publication number: 20190326342
    Abstract: A method for manufacturing a semiconductor module for an image-sensing device is disclosed. The method may comprise forming a first molding component on a first surface of a printed circuit board (PCB); mounting at least a photosensitive member to a second surface of the PCB; and forming a second molding component on the second surface of the PCB. The PCB may comprise at least an electric component on the first surface of the PCB. The first molding component may encapsulate the at least one electric component with the PCB. The second molding component may secure the photosensitive member on the PCB.
    Type: Application
    Filed: April 23, 2018
    Publication date: October 24, 2019
    Inventors: Mingzhu Wang, Nan Guo, Zhenyu Chen, Bojie Zhao, Takehiko Tanaka, Feifan Chen, Ye Wu
  • Publication number: 20190327396
    Abstract: A camera module includes an optical lens, a photosensitive chip and an electrical support. The electrical support includes a circuit module embedded in a support body to form an integral structure, a connecting member provided on the support body to electrically connect with the circuit module, and a camera component coupled at the support body and electrically connected to the connecting member. Therefore, the electrical support not only forms a circuit board to electrically connect with the camera component but only serves as a base to support the camera component.
    Type: Application
    Filed: June 30, 2019
    Publication date: October 24, 2019
    Inventors: Mingzhu WANG, Bojie ZHAO, Feifan CHEN, Liang DING, Nan GUO, Ye WU, Heng JIANG
  • Publication number: 20190319057
    Abstract: A semiconductor module for an image-sensing device is disclosed. The semiconductor module may include: a printed circuit board (PCB), a photosensitive member, at least an electric component and a molding component. The PCB may have a first surface, and the photosensitive member and the electric component are positioned on the first surface of the PCB. The molding component may be formed along with the first surface of the PCB, and separate the photosensitive member and the electric component from the ambient environment. The molding component may be in direct contact with the photosensitive member, the electric component and the first surface of the PCB. At least a portion of the molding component may be transparent to allow at last 50% of the incident light to pass through the molding component to reach the photosensitive member.
    Type: Application
    Filed: April 23, 2018
    Publication date: October 17, 2019
    Inventors: Mingzhu Wang, Takehiko Tanaka, Nan Guo, Zhenyu Chen, Bojie Zhao
  • Patent number: 10440247
    Abstract: A camera module includes a circuit board, an optical lens, an insulating member, a photosensitive sensor, and an integral encapsulating support structure. The insulating member is disposed on the periphery of a photosensitive area of the photosensitive sensor to prevent the photosensitive sensor from contacting to and being damaged by the formation mold during the forming process of the integral encapsulating support structure and to prevent the fluid material from flowing to the photosensitive area of the photosensitive sensor.
    Type: Grant
    Filed: June 27, 2017
    Date of Patent: October 8, 2019
    Assignee: Ningbo Sunny Opotech Co., Ltd.
    Inventors: Mingzhu Wang, Bojie Zhao, Takehiko Tanaka, Zhen Huang, Nan Guo
  • Patent number: 10432927
    Abstract: A 3D test chart, an adjusting arrangement, a forming method, and an adjusting method thereof are disclosed. The 3D test chart provides a plurality of test patterns arranged at different depths. When testing a photographic arrangement, the photographic arrangement is only required to move for one time or even does not need to be moved, so as to obtain an image containing information of different depths, so that the testing and adjusting process of the photographic arrangement can be easily achieved.
    Type: Grant
    Filed: September 30, 2015
    Date of Patent: October 1, 2019
    Assignee: Ningbo Sunny Opotech Co., Ltd.
    Inventors: Mingzhu Wang, Baozhong Zhang, Chunmei Liu
  • Publication number: 20190297236
    Abstract: A camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof is provided. The array camera module comprises two or more camera lenses and a circuit unit. The circuit unit comprises a circuit board portion for electrically connecting two or more photosensitive sensors of the array camera module, and a conjoined encapsulation portion integrally encapsulated on the circuit board portion. The camera lenses are respectively arranged along the photosensitive paths of the photosensitive sensors.
    Type: Application
    Filed: June 11, 2019
    Publication date: September 26, 2019
    Inventors: Mingzhu WANG, Bojie Zhao, Takehiko Tanaka, Feifan CHEN, Qimin MEI, Liang DING, Heng JIANG
  • Patent number: 10412278
    Abstract: A camera module includes an optical lens, a photosensitive chip and an electrical support. The electrical support includes a circuit module embedded in a support body to form an integral structure, a connecting member provided on the support body to electrically connect with the circuit module, and a camera component coupled at the support body and electrically connected to the connecting member. Therefore, the electrical support not only forms a circuit board to electrically connect with the camera component but only serves as a base to support the camera component.
    Type: Grant
    Filed: February 29, 2016
    Date of Patent: September 10, 2019
    Assignee: Ningbo Sunny Opotech Co., Ltd.
    Inventors: Mingzhu Wang, Bojie Zhao, Feifan Chen, Liang Ding, Nan Guo, Ye Wu, Heng Jiang