Abstract: The present invention provides a fixed-focus camera module and a manufacturing method therefor. The fixed-focus camera module comprises a light-sensitive chip, an optical lens assembly, and a lens base. The optical lens assembly is directed packaged in the lens base, and the optical lens assembly is kept in a light-sensitive path of the light-sensitive chip. In this manner, the size and the manufacturing costs of the fixed-focus camera module can be effectively reduced, so as to improve the product competitiveness of the fixed-focus camera module.

Abstract: A camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof is provided. The array camera module includes two or more camera lenses and a circuit unit. The circuit unit includes a circuit board portion for electrically connecting two or more photosensitive sensors of the array camera module, and a conjoined encapsulation portion integrally encapsulated on the circuit board portion. The camera lenses are respectively arranged along the photosensitive paths of the photosensitive sensors.

Abstract: A camera module and its molded circuit board assembly and manufacturing method are disclosed, wherein the molded circuit board assembly includes a circuit board and a molded base integrally formed with the circuit board through a molding process. The molded base forms a light window disposed corresponding to a photosensitive element of the camera module, wherein the light window is configured to have a trapezoidal or to multi-stair trapezoidal shape cross section which has diameters increasing from bottom to top to facilitate demoulding, so as to prevent damage to the molded base, and to avoid stray light.

Abstract: A method for manufacturing a semiconductor module for an image-sensing device is disclosed. The method may comprise forming a first molding component on a first surface of a printed circuit board (PCB); mounting at least a photosensitive member to a second surface of the PCB; and forming a second molding component on the second surface of the PCB. The PCB may comprise at least an electric component on the first surface of the PCB. The first molding component may encapsulate the at least one electric component with the PCB. The second molding component may secure the photosensitive member on the PCB.

Abstract: A method for manufacturing a semiconductor module for an image-sensing device is disclosed. The method may comprise forming a first molding component on a first surface of a printed circuit board (PCB); mounting at least a photosensitive member to a second surface of the PCB; and forming a second molding component on the second surface of the PCB. The PCB may comprise at least an electric component on the first surface of the PCB. The first molding component may encapsulate the at least one electric component with the PCB. The second molding component may secure the photosensitive member on the PCB.

Abstract: A camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof is provided. The array camera module comprises two or more camera lenses and a circuit unit. The circuit unit comprises a circuit board portion for electrically connecting two or more photosensitive sensors of the array camera module, and a conjoined encapsulation portion integrally encapsulated on the circuit board portion. The camera lenses are respectively arranged along the photosensitive paths of the photosensitive sensors.

Abstract: A camera lens module includes a lens assembly. The lens assembly may comprise a first optical lens module comprising a first carrier and at least one first optical lens received in the first carrier; and a second optical lens module comprising a second carrier, at least one second optical lens received in the second carrier, and a bearing portion connected to the second carrier. When the first optical lens module and the second optical lens module are assembled together, an adjustable clearance exists between the first carrier and the bearing portion, and between bottom surfaces of the first carrier and a lowermost lens of the first optical lenses and a top surface of an uppermost lens of the second optical lenses.

Abstract: A lens module and a capturing module integrating a focusing mechanism and an assembly method therefor. A lens module (1010) comprises at least one optical lens (1011), a focusing mechanism (1012), and a supporting structure component (1013). Each optical lens (1011) is mounted in an accommodating cavity of the supporting structure component (1013) in a height direction of the supporting structure component (1013). The supporting structure component (1013) is connected inside of the focusing mechanism (1012) as a carrier of the focusing mechanism (1012). The supporting structure component (1013) moves as the focusing mechanism (1012) is powered, and is thereby suitable for focusing. By replacing a carrier and a lens cone of a conventional focusing mechanism with the supporting structure component (1013), an overall assembly process is simplified, the yield and quality of a module are improved, and the manufacturing costs are reduced.

Abstract: The present disclosure discloses a method for compensating for image quality of an optical system by means of a lens adjustment, applicable to a camera module comprising an adjustable lens or an adjustable lens set, the method comprising the following steps: (A) determining, based on imaging information of a to-be-adjusted optical system, parameters that need to be adjusted for compensating for the image quality; (B) establishing functions of relation between the parameters that need to be adjusted for compensating for the image quality and a to-be-adjusted lens factors; and (C) determining an adjustment mode and an adjustment amount for the to-be-adjusted lens based on the relation between the parameters that need to be adjusted for compensating for the image quality and the to-be-adjusted lens factors.

Abstract: The present disclosure provides a camera module and an electrical bracket thereof. The electrical bracket is provided with a clear aperture. The electrical bracket not only has the functions of a conventional circuit board (conduction of the electrical signal of an electronic device such as a chip and a motor), but also has the effects of a conventional base to support an optical filter and serve as a motor base bracket.

Abstract: An adjustable optical lens, a camera module and an aligning method thereof are disclosed. The adjustable optical lens includes at least one lens element and an optical structure element. Each of the lens elements is successively and overlappingly arranged in an photosensitive apparatus of the optical structure element, wherein at least one of the lens elements is configured as an adjustable lens element whose assemble position is adjustable. The optical structure element has at least one adjusting channel and at least one fixing channel for adjusting and fixing the adjustable lens element respectively.

Abstract: A camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof is provided. The array camera module comprises two or more camera lenses and a circuit unit. The circuit unit comprises a circuit board portion for electrically connecting two or more photosensitive sensors of the array camera module, and a conjoined encapsulation portion integrally encapsulated on the circuit board portion. The camera lenses are respectively arranged along the photosensitive paths of the photosensitive sensors.

Abstract: A camera module includes a lens, a photosensitive chip and an electrical holder. The electrical holder has an integrated circuit that the electrical holder serves as an integration of a base and a PCB in a conventional camera module, wherein the electrical holder not only forms an assembling unit for connecting a motor and an optical lens but also forms an electrical connection unit for electrically connecting to the motor, a photosensitive chip and a flexible circuit board with each other, so as to minimize an overall size of the camera module.

Abstract: A camera module, a molded circuit board assembly, a molded photosensitive assembly and manufacturing method thereof are disclosed. The camera module includes a molded base which is integrally formed with a circuit board through a molding process, wherein a photosensitive element may be electrically connected on the circuit board and at least a portion of a non-photosensitive area portion of the photosensitive element is also connected by the molded base through the molding process. A light window is formed in a central portion of the molded base to provide a light path for the photosensitive element, wherein a cross section of the light window is configured to have a trapezoidal or multi-step trapezoidal shape which has a size increasing from bottom to top to facilitate demoulding and avoiding stray lights.

Abstract: A camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof is provided. The array camera module comprises two or more camera lenses and a circuit unit. The circuit unit comprises a circuit board portion for electrically connecting two or more photosensitive sensors of the array camera module, and a conjoined encapsulation portion integrally encapsulated on the circuit board portion. The camera lenses are respectively arranged along the photosensitive paths of the photosensitive sensors.

Abstract: A camera module includes an optical lens, a plurality of different camera components, and a plurality of connection elements pre-formed on at least one of the camera components for electrical connection. Each of the connection elements includes a first connection element formed on a surface of the camera component and a first conduction element electrically formed on the first connection element and protruded from the first connection element in order to electrically connect with other camera components.

Abstract: A camera lens module includes a lens assembly. The lens assembly may comprise a first optical lens module comprising a first carrier and at least one first optical lens received in the first carrier; and a second optical lens module comprising a second carrier, at least one second optical lens received in the second carrier, and a bearing portion connected to the second carrier. When the first optical lens module and the second optical lens module are assembled together, an adjustable clearance exists between the first carrier and the bearing portion, and between bottom surfaces of the first carrier and a lowermost lens of the first optical lenses and a top surface of an uppermost lens of the second optical lenses.

Abstract: The present invention provides a camera module and a molding circuit board assembly, circuit board and application thereof, the circuit board comprising a digital circuit unit, an analog circuit unit and a substrate. The digital circuit nit and the analog circuit unit are respectively formed on the substrate, and the digital circuit unit and the analog circuit unit are conductively connected to each other, wherein at least one part of the analog circuit unit has a safe distance from the digital circuit unit, so as to prevent an electromagnetic wave generated by a circuit of the digital circuit unit from interfering with an electrical signal transmitted and processed by the analog circuit unit, thereby improving the stability and reliability of the transmission and the processing of the electrical signal by the circuit board.

Abstract: The present disclosure discloses a method for compensating for image quality of an optical system by means of a lens adjustment, applicable to a camera module comprising an adjustable lens or an adjustable lens set, the method comprising the following steps: (A) determining, based on imaging information of a to-be-adjusted optical system, parameters that need to be adjusted for compensating for the image quality; (B) establishing functions of relation between the parameters that need to be adjusted for compensating for the image quality and a to-be-adjusted lens factors; and (C) determining an adjustment mode and an adjustment amount for the to-be-adjusted lens based on the relation between the parameters that need to be adjusted for compensating for the image quality and the to-be-adjusted lens factors.

Abstract: A molded photosensitive assembly includes a supporting member, at least a circuit board, at least two photosensitive units, at least two lead wires, and a mold sealer. The photosensitive units are coupled at the chip coupling area of the circuit board. The lead wires are electrically connected the photosensitive units at the chip coupling area of the circuit board. The mold sealer includes a main mold body and has two optical windows. When the main mold body is formed, the lead wires, the circuit board and the photosensitive units are sealed and molded by the main mold body of the mold sealer, such that after the main mold body is formed, the main mold body and at least a portion of the circuit board are integrally formed together at a position that the photosensitive units are aligned with the optical windows respectively.