Abstract: One aspect of the instant application describes a system that includes a plurality of stacked mezzanine boards communicatively coupled to a motherboard and a metal enclosure enclosing the motherboard and mezzanine boards. A respective mezzanine board can include a number of solder pads, and the metal enclosure can include a plurality of metal strips, a respective metal strip to make contact with a solder pad of a corresponding mezzanine board. The system can further include a logic module positioned on the respective mezzanine board to determine a location of the respective mezzanine board based on a contact pattern between the metal strips and solder pads of the respective mezzanine board.

Abstract: An apparatus includes: a 1 U drive chassis divided into a plurality of compartments by a partition, the plurality of compartments including an interior compartment; an interior cage installed in the interior compartment, the interior cage including a plurality of pockets into which storage media are mounted when in use and having a back edge; a hinge by which the interior cage is rotatably mounted to the 1 U drive chassis along the back edge of the interior cage; a lift to rotate the interior cage at least partially to an open position when the first latch is released; and a latch to maintain the interior cage in a closed position and to maintain the interior cage in the opened position according to the rotation of the interior compartment.

Abstract: Embodiments are directed to an assembly including a bay structure including a bay structure that defines a bay for receiving a pluggable module and including sides and a front plate rotatably connected to the sides, a connecting bracket coupled with the bay structure, and a heat transfer device coupled with the bay structure. The bay structure, the heat transfer device, and the connecting bracket are configured such that rotating the front plate from a first position to a second position displaces the connecting bracket in a first direction which causes the connecting bracket to displace the heat transfer device in a second direction transverse to the first direction.

Abstract: The present subject matter relates to screws for tool-less assembling of an electronic board on a chassis. In an example implementation, the screw comprises a threaded pin to secure the screw on the electronic board using a nut. The screw also comprises a screw head that fits into a hook on the chassis when the electronic board is assembled on the chassis. The screw further comprises a flange integral to the screw and positioned between the threaded pin and the screw head. The flange is extended radially to support the electronic board and is positioned at a distance from the screw head based on a gap to be maintained between the electronic board and the chassis.

Abstract: A device assembly as disclosed herein includes a heat pipe coupled to a heat transfer device, and a thermal interface. The assembly further includes a cold plate rotatably coupled with the heat pipe through a hinge. The thermal interface is coupled with the cold plate through a plane to rotate about the heat pipe together with the cold plate, and the thermal interface includes a material having a thickness and a resiliency configured to make thermal contact with a circuit in a circuit card when the cold plate is rotated over the circuit card. A chassis and a method to build the chassis including the above assembly are also disclosed.

Abstract: An apparatus includes: a 1U drive chassis divided into a plurality of compartments by a partition, the plurality of compartments including an interior compartment; an interior cage installed in the interior compartment, the interior cage including a plurality of pockets into which storage media are mounted when in use and having a back edge; a hinge by which the interior cage is rotatably mounted to the 1U drive chassis along the back edge of the interior cage; a lift to rotate the interior cage at least partially to an open position when the first latch is released; and a latch to maintain the interior cage in a closed position and to maintain the interior cage in the opened position according to the rotation of the interior compartment.

Abstract: Embodiments are directed to an assembly including a bay structure including a bay structure that defines a bay for receiving a pluggable module and including sides and a front plate rotatably connected to the sides, a connecting bracket coupled with the bay structure, and a heat transfer device coupled with the bay structure. The bay structure, the heat transfer device, and the connecting bracket are configured such that rotating the front plate from a first position to a second position displaces the connecting bracket in a first direction which causes the connecting bracket to displace the heat transfer device in a second direction transverse to the first direction.

Abstract: Examples herein disclose a system including a board and a cooling member. The board includes a first surface, a second surface, and a midpoint between the first and the surface, the boards supports an electrical component on the first surface. The cooling member is routed along the second surface of the board and delivers cooling liquid to the electrical component by crossing the midpoint of the board from the second surface to the first surface. The cooling member routes heated liquid from the electrical component by crossing the midpoint of the board from the first surface to the second surface.

Abstract: Systems and devices for mounting servers are provided. In one aspect, a rack mounting system includes a first mounting bracket attached to a rack. The rack comprises a rack front side and a rack rear side opposite the rack front side. The first mounting bracket is attached to the rack rear side. A rail bracket is attached to a server component mounted in the rack. A second mounting bracket comprises a first end and a second end. The first end is coupled to the first mounting bracket. The second end is coupled to the rail bracket. The second mounting bracket comprises a first surface and a second surface opposite the first surface. The first surface of the second mounting bracket contacts the first mounting bracket. The second surface of the second mounting bracket contacts the rail bracket.

Abstract: A device assembly as disclosed herein includes a heat pipe coupled to a heat transfer device, and a thermal interface. The assembly further includes a cold plate rotatably coupled with the heat pipe through a hinge. The thermal interface is coupled with the cold plate through a plane to rotate about the heat pipe together with the cold plate, and the thermal interface includes a material having a thickness and a resiliency configured to make thermal contact with a circuit in a circuit card when the cold plate is rotated over the circuit card. A chassis and a method to build the chassis including the above assembly are also disclosed.

Abstract: Systems and devices for mounting servers are provided. In one aspect, a rack mounting system includes a first mounting bracket attached to a rack. The rack comprises a rack front side and a rack rear side opposite the rack front side. The first mounting bracket is attached to the rack rear side. A rail bracket is attached to a server component mounted in the rack. A second mounting bracket comprises a first end and a second end. The first end is coupled to the first mounting bracket. The second end is coupled to the rail bracket. The second mounting bracket comprises a first surface and a second surface opposite the first surface. The first surface of the second mounting bracket contacts the first mounting bracket. The second surface of the second mounting bracket contacts the rail bracket.

Abstract: A liquid-cooled integrated circuit system includes two printed circuit assemblies having removable heat spreaders and cooling pipes coated with a thermal interface material. The two printed circuit assemblies are placed together in opposition such that the top surfaces of the heat spreaders on each printed circuit assembly contacts, and become thermally coupled with, the thermal interface material on the cooling pipes of the other printed circuit assembly. In this arrangement, each printed circuit assembly is cooled by the other.

Abstract: In one example implementation according to aspects of the present disclosure, a server chassis may include a server zone to receive a plurality of blade servers, each of the plurality of blade servers having a fabric connection. The server chassis may further include a flexible input/output zone to receive an input/output card, the input/output card being communicatively coupled to each of the plurality of blade servers via the fabric connection of each of the plurality of blade servers. The functionality of the input/output card may be distributed across the plurality of blade servers.

Abstract: A removable electronic module usable with an electrical system includes a main body, electronic devices, indicators, and a switching member. The indicators receive the power by the power storage device when the main body is removed from a slot and electrically disconnected from the electrical system to indicate a functional status of the corresponding electronic devices when placed in an active state.

Abstract: Examples herein disclose a system including a board and a cooling member. The board includes a first surface, a second surface, and a midpoint between the first and the surface, the boards supports an electrical component on the first surface. The cooling member is routed along the second surface of the board and delivers cooling liquid to the electrical component by crossing the midpoint of the board from the second surface to the first surface. The cooling member routes heated liquid from the electrical component by crossing the midpoint of the board from the first surface to the second surface.

Abstract: The present subject matter relates to screws for tool-less assembling of an electronic board on a chassis. In an example implementation, the screw comprises a threaded pin to secure the screw on the electronic board using a nut. The screw also comprises a screw head that fits into a hook on the chassis when the electronic board is assembled on the chassis. The screw further comprises a flange integral to the screw and positioned between the threaded pin and the screw head. The flange is extended radially to support the electronic board and is positioned at a distance from the screw head based on a gap to be maintained between the electronic board and the chassis.

Abstract: A disk drive module is provided herein. The disk drive module includes a frame, a keyed member, a front aperture, and a back aperture. The frame includes a top wall, a bottom wall, and a pair of side walls therebetween. The keyed member is formed along at least one of the pair of side walls. The front aperture to receive a drive carrier. The back aperture to interchangeably receive at least one back end selected from a hot plug back end and a non-hot plug back end.

Abstract: A removable electronic module usable with an electrical system includes main body, electronic devices, indicators, and a switching member The indicators receive the power by the power storage device when the main body is removed from a slot and electrically disconnected from the electrical system to indicate a functional status of the corresponding electronic devices when placed in an active state.

Abstract: A front cable management assembly for a server rack includes a first assembly bracket and a second assembly bracket and a cable rail movably coupled to the first and the second assembly brackets. The first and the second assembly brackets are to be mounted to a front of a server rack. The cable rail is positioned in between the first and the second assembly brackets and is to move to a first position and a second position while movably coupled to the first and the second assembly brackets.

Abstract: A memory cartridge includes a first printed circuit board and a second printed circuit board. The first printed circuit board includes a DIMM connectors to receive a first set of DIMMS. The second printed circuit board includes a second set of DIMM connectors to receive a second set of DIMMS. The first printed circuit board and the second printed circuit board are movably connected to each other to enable the first printed circuit board and the second printed circuit board to fold over each other.