Abstract: A rack system is disclosed for mounting various devices. The rack system comprises at least one front vertical support column and at least one rear vertical support column. A rail is deployed between the front vertical support column and the rear vertical support column. Additionally, a latching system is provided that enables secure engagement of the rail and easy removal of the rail.

Abstract: A swappable mount and cable support arm for a rack mount system. The swappable mount may have a variety of toolfree mounts, threaded fasteners, latches, and other mounting mechanisms. The swappable mount is interchangeably coupled to the cable support arm to facilitate adaptation to a particular rack mount system. One embodiment has a releasable hinge mechanism to facilitate the interchangeable coupling between the swappable mount and the cable support arm. The cable support arm may have a variety of expandable support structures, such as pivotally coupled arm sections. One embodiment of the cable support arm has first and second arm sections rotatably coupled one over the other at a hinge.

Abstract: A cable support arm for a rack mount system. The cable support arm may have first and second arm sections, which are rotatably coupled one over the other at a hinge. The first and second arm sections also may have hinges, which are coupleable to a rack and a rack mounted device of the rack mount system.

Abstract: An alignment and retention mechanism comprises a hinged upper subassembly rotatably mated with a fixed lower subassembly defining a receptacle into which a component (e.g., a processor and heat sink assembly) is aligned and retained in place. The alignment and retention mechanism aligns and retains the component without the use of tools and loose fasteners and includes various features that prevent an improper attempt at inserting and removing the component into the receptacle. The alignment and retention mechanism can be used in computer systems as well as other types of electrical systems.

Abstract: An alignment and retention mechanism comprises a hinged upper subassembly rotatably mated with a fixed lower subassembly defining a receptacle into which a component (e.g., a processor and heat sink assembly) is aligned and retained in place. The alignment and retention mechanism aligns and retains the component without the use of tools and loose fasteners and includes various features that prevent an improper attempt at inserting and removing the component into the receptacle. The alignment and retention mechanism can be used in computer systems as well as other types of electrical systems.

Abstract: A portable computer docking station housing is provided on its bottom side with a support foot structure which is pivotable relative to the housing to prop it up on a horizontal work station surface in a selectively variable one of a series of different front-to-rear tilt angles thereon. This permits the opened display screen of a docked portable computer disposed on the top side of the docking station housing to be selectively adjusted upwardly and downwardly in a vertical plane to accommodate the height and viewing preferences of a user of the docked computer. A specially designed spring-loaded, manually operable clutch mechanism is useable to releasably lock the support foot in its selected pivotal orientation relative to the housing. Various peripheral device connection ports are conveniently incorporated in the support foot.

Abstract: A portable computer docking station housing is provided on its bottom side with a support foot structure which is pivotable relative to the housing to prop it up on a horizontal work station surface in a selectively variable one of a series of different front-to-rear tilt angles thereon. This permits the opened display screen of a docked portable computer disposed on the top side of the docking station housing to be selectively adjusted upwardly and downwardly in a vertical plane to accommodate the height and viewing preferences of a user of the docked computer. A specially designed spring-loaded, manually operable clutch mechanism is useable to releasably lock the support foot in its selected pivotal orientation relative to the housing. Various peripheral device connection ports are conveniently incorporated in the support foot.

Abstract: A portable computer docking station housing is provided on its bottom side with a support foot structure which is pivotable relative to the housing to prop it up on a horizontal work station surface in a selectively variable one of a series of different front-to-rear tilt angles thereon. This permits the opened display screen of a docked portable computer disposed on the top side of the docking station housing to be selectively adjusted upwardly and downwardly in a vertical plane to accommodate the height and viewing preferences of a user of the docked computer. A specially designed spring-loaded, manually operable clutch mechanism is useable to releasably lock the support foot in its selected pivotal orientation relative to the housing. Various peripheral device connection ports are conveniently incorporated in the support foot.

Abstract: A docking station for a portable computer has a top side from which peripheral rib structures upwardly project and form a receiving and holding area into which the computer may be lowered in preparation for docking. The receiving and holding area complementarily receives the computer, with the rib structures preventing the computer from shifting parallel to the top docking station side. A lever structure is then manually pivoted to responsively move a docking station electrical connector relative to the stationary computer into a releasably mated relationship with a corresponding connector on the computer to complete the docking process. The rotation of the docking lever also interlocks a security latch member with the computer to block its upward removal from the docking station. A Kensington lock may be used to hold the lever in its docking orientation, and thus keep the security latch interlocked with the docked computer.

Abstract: A thermal management controller to regulate the operating temperature of high speed, high circuit density semiconductor dice in an electronic product. The thermal management controller monitors the temperature of a heat sink in thermal contact with the high speed, high circuit density semiconductor dice and also monitors the operational status of one or more specified devices which may increase the heat load within the electronic product. As the temperature of the heat sink increases and/or as specified devices increase the heat load in the electronic product, the thermal management controller will start cooling fans and/or increases the speed of the cooling fans to increase heat removal from the electronic product by forced convection.

Abstract: A thermal management structure to provide mechanical isolation and heat removal for an unpackaged semiconductor die mounted directly on a printed circuit board substrate. The thermal management structure sandwiches the unpackaged semiconductor die and substrate between two heat sink pieces which are rigidly mounted to the substrate, thereby mechanically isolating the unpackaged semiconductor die and preventing the die from being accidentally touched. The two heat sink pieces further compliantly thermally engage selected sites on the exposed face of the semiconductor die and the surface of the substrate to conductively remove heat away from the substrate. The thermal management structure may also provide electromagnetic shielding which isolates the electromagnetic fields generated by the substrate from electromagnetic fields external to the thermal management structure.

Abstract: A thermal management structure to provide mechanical isolation and heat removal for a unpackaged semiconductor die mounted directly on a printed circuit board substrate. The thermal management structure sandwiches the unpackaged semiconductor die and substrate between two heat sink pieces which are rigidly mounted to the substrate, thereby mechanically isolating the unpackaged semiconductor die and preventing the die from being accidentally touched. The two heat sink pieces further compliantly thermally engage selected sites on the exposed face of the semiconductor die and the surface of the substrate to conductively remove heat away from the substrate. The thermal management structure may also thermally engage selected thermally conductive components within an end product to spread the heat more uniformly throughout the system.