Abstract: A physiological information processing apparatus includes one or more processors, and one or more memories configured to store a computer readable instruction, when the computer readable instruction is executed by the processor, the physiological information processing apparatus is configured to: cause a plurality of physiological sensors to intermittently operate such that an operation time and a standby time are alternately repeated; obtain a plurality of pieces of physiological information on a patient from the plurality of physiological sensors during the operation time; and change an operation mode of the plurality of physiological sensors that intermittently operate in accordance with a condition related to at least a part of the plurality of pieces of physiological information or a condition related to at least a part of the plurality of physiological sensors.

Abstract: According to the invention, it is possible to efficiently construct an environment for implementing an IT system. Provided is an environment construction support device. The environment construction support device stores a tree structure model that is information representing an environment for implementing an IT system in a tree structure and can be updated as needed, a construction script structure that is information related to a construction script that is a series of codes for constructing the environment and can be updated as needed, and parameter correspondence information that is information indicating a correspondence between an element of the tree structure model and an element of the construction script, and updates the parameter correspondence information to correspond to latest contents of the tree structure model and the construction script structure by comparing at least one of the tree structure model and the construction script structure with the parameter correspondence information.

Abstract: A thermal barrier coating method forms a thermal barrier coating by spray coating over the surface of a component where cooling holes are made. The thermal barrier coating is formed by spray coating after masking pins, which do not protrude above the surface of the component, are inserted into the cooling holes or masking pins protruding above the surface of the component are inserted and get shrunk due to heat while spray coating, obtaining the protruding amount equal to or less than the thickness of the thermal barrier coating after shrinkage, which characterizes the method. By way of this method, a thermal barrier coating can be formed all over the surface without clogging the cooling holes.

Abstract: A thermal barrier coating method forms a thermal barrier coating by spray coating over the surface of a component where cooling holes are made. The thermal barrier coating is formed by spray coating after masking pins, which do not protrude above the surface of the component, are inserted into the cooling holes or masking pins protruding above the surface of the component are inserted and get shrunk due to heat while spray coating, obtaining the protruding amount equal to or less than the thickness of the thermal barrier coating after shrinkage, which characterizes the method. By way of this method, a thermal barrier coating can be formed all over the surface without clogging the cooling holes.

Abstract: A thermal barrier coating method forms a thermal barrier coating by spray coating over the surface of a component where cooling holes are made. The thermal barrier coating is formed by spray coating after masking pins, which do not protrude above the surface of the component, are inserted into the cooling holes or masking pins protruding above the surface of the component are inserted and get shrunk due to heat while spray coating, obtaining the protruding amount equal to or less than the thickness of the thermal barrier coating after shrinkage, which characterizes the method. By way of this method, a thermal barrier coating can be formed all over the surface without clogging the cooling holes.

Abstract: A thermal barrier coating method forms a thermal barrier coating by spray coating over the surface of a component where cooling holes are made. The thermal barrier coating is formed by spray coating after masking pins, which do not protrude above the surface of the component, are inserted into the cooling holes or masking pins protruding above the surface of the component are inserted and get shrunk due to heat while spray coating, obtaining the protruding amount equal to or less than the thickness of the thermal barrier coating after shrinkage, which characterizes the method. By way of this method, a thermal barrier coating can be formed all over the surface without clogging the cooling holes.

Abstract: A thermal barrier coating material, containing a metal binding layer laminated on a base material and ceramic layer laminated on the metal binding layer, the ceramic layer comprising partially stabilized ZrO2 which is partially stabilized by additives of Dy2O3 and Yb2O3.

Abstract: A thermal barrier coating material, containing a metal binding layer laminated on a base material and a ceramic layer laminated on the metal binding layer, the ceramic layer comprising partially stabilized ZrO2 which is partially stabilized by additives of Dy2O3 and Yb2O3.

Abstract: An IC card includes a semiconductor integrated circuit device package having one surface and another surface opposite to the one surface, card terminals on the one surface of the package, and a base card which includes a concave portion attached to the other surface of the package. The package includes a wiring board, a semiconductor integrated circuit chip on the wiring board, and an insulating resin coated over the semiconductor integrated circuit chip. The package is a rectangular parallelepiped package. The insulating resin is exposed to the other surface of the package. The insulating resin and the wiring board are exposed to four surfaces of the package except for the one surface and the other surface.

Abstract: An IC card includes a semiconductor integrated circuit device package having one surface and another surface opposite to the one surface, card terminals on the one surface of the package, and a base card which includes a concave portion attached to the other surface of the package. The package includes a wiring board, a semiconductor integrated circuit chip on the wiring board, and an insulating resin coated over the semiconductor integrated circuit chip. The package is a rectangular parallelepiped package. The insulating resin is exposed to the other surface of the package. The insulating resin and the wiring board are exposed to four surfaces of the package except for the one surface and the other surface.

Abstract: A thermal barrier coating enabling to prevent peeling of layer in a high temperature use and still having a high thermal barrier effect, a turbine part coated by this thermal barrier coating and a gas turbine comprising this turbine part are provided. The thermal barrier coating comprises a base material 21 of high temperature heat resistant alloy and a ceramics layer 23 formed on the base material 21. The ceramics layer 23 comprises ZrO2 added with Yb2O3 as stabilizer and is laminated on the base material via a bond coat layer 22 laminated as a metallic bond layer. A plurality of cracks 23A are preferably introduced in the ceramics layer 23. The turbine part is constructed having its surface coated with the above thermal barrier coating.

Abstract: An IC card includes a semiconductor integrated circuit device package having one surface and another surface opposite to the one surface, card terminals on the one surface of the package, and a base card which includes a concave portion attached to the other surface of the package. The package includes a wiring board, a semiconductor integrated circuit chip on the wiring board, and an insulating resin coated over the semiconductor integrated circuit chip. The package is a rectangular parallelepiped package. The insulating resin is exposed to the other surface of the package. The insulating resin and the wiring board are exposed to four surfaces of the package except for the one surface and the other surface.

Abstract: The present invention relates to a method of repairing a Ni-based alloy part having an undercoat layer and a topcoat layer stacked on a Ni-based alloy base when the topcoat layer is damaged, comprising the steps of removing a peeled-off portion of the damaged topcoat layer and a denatured portion of the undercoat layer corresponding to the peeled-off portion, forming another undercoat layer by applying spraying to an opening portion of the undercoat layer in the atmosphere at a spray particle speed of 300 m/s or more and a base-material temperature of 300° C.

Abstract: A brazing construction and method of brazing an abradable sealing material onto a base material is provided. The abradable sealing material is a tabular member having a cellular compartment construction in honeycomb form having empty compartments and partitions formed by overlapping a plurality of thin corrugated sheets. The abradable sealing material is brazed on the main material by, applying a stop-off agent on a side surface of the abradable sealing material except on a portion of the side surface close to a brazing face to form a stop-off area that prevents infiltration of a brazing filler metal in an overlapping part; superposing the brazing face of the abradable sealing material on the base material, such that the brazing filler metal is provided between the abradable sealing material and the base metal; and brazing the abradable sealing material to said base material.

Abstract: A brazing filler metal sheet is prepared. The brazing filler metal sheet includes a brazing filler metal layer, a sticking material layer, and a released paper. The brazing filler metal layer includes a brazing filler metal. A coating material layer is laminated on the brazing filler metal layer. The coating material layer includes a mixture of coating material particles and a binder. As the coating material particles, MCrAlY particles and abrasive particles are used. The coating material layer is then dried, and the brazing filler metal sheet is cut (step S4), and adhered to a rotor blade. The rotor blade is heated, to melt the brazing filler metal. The brazing filler metal diffuses due to the heat treatment holding process. A solidified layer is then formed by cooling. This solidified layer is subjected to blasting to allow the cubic boron nitride particles to protrude.

Abstract: A sheet pan (120) having a groove (121), into which a brazing sheet is fitted, is disposed on a base (110). A slide member (140) can slidingly move along the longitudinal direction of the sheet pan (120) at a position above the sheet pan (120). A blade (160) is moved upward and downward by a micrometer (170) fixed to and supported by the slide member (140). A brazing sheet is fitted into the groove (121), and coated with an abrasive coating material. The slide member (140) is slid, with the clearance between the blade (160) and the sheet pan (110) being adjusted using the micrometer (170). As a result, a surplus of the abrasive coating material is scraped off, and the abrasive coating material becomes uniform in thickness. Thus, an abrasive coating sheet high in quality and uniform in the thickness of the abrasive coating material can be produced conveniently.

Abstract: A tip plug is capped on a boss section so as to fit to a hole which is used for detaching a core which is formed in a blade tip section of the gas turbine blade. A butt-section T is melted so as to form a butt-welding section by using a YAG laser beam. Also, parameters such as an interval between the butt-section T, a member for forming the tip plug, condition for a laser welding operation, and a defocus position of the laser beam are optimized.

Abstract: An object is to provide a brazing construction and a method for brazing for an abradable sealing material wherein a decrease in abradability does not occur. A stop-off area that prevents infiltration of a brazing filler metal is provided on a non-brazed side of a honey comb sheet, that is an abradable sealing material, with a predetermined depth through the sequential steps of: masking an area to a predetermined depth on a brazing side by pressing a brazing side of the honeycomb sheet into a masking sheet; applying a stop-off agent to the honeycomb sheet in this condition to form a film of the stop-off agent on a region outside of the masked region; removing the masking sheet; placing a face to be brazed of the honeycomb sheet onto a sheet of brazing filler metal which is positioned on a base material, so as to be pressed in; and brazing by placing the honeycomb sheet and the base material into a heating furnace.

Abstract: A thermal barrier coating enabling to prevent peeling of layer in a high temperature use and still having a high thermal barrier effect, a turbine part coated by this thermal barrier coating and a gas turbine comprising this turbine part are provided. The thermal barrier coating comprises a base material 21 of high temperature heat resistant alloy and a ceramics layer 23 formed on the base material 21. The ceramics layer 23 comprises ZrO2 added with Yb2O3 as stabilizer and is laminated on the base material via a bond coat layer 22 laminated as a metallic bond layer. A plurality of cracks 23A are preferably introduced in the ceramics layer 23. The turbine part is constructed having its surface coated with the above thermal barrier coating.

Abstract: There are provided for an improved card connector contacting structure featuring its compactness and simplicity in construction, higher reliability of contacting action and higher impact resistance. The contacting structure is designed as a card connector comprising a plurality of contact terminals which are arranged in parallel with one another; among the plurality of contact terminals, at least two are the terminals for connecting with the power source; at least two are the terminals for grounding; at least one is for detecting whether the IC card has been loaded securely into the card connector; among the plurality of contact terminals, one of the terminals for grounding comes into contact first with the corresponding external contact of the IC card, among the plurality of contact terminals, the terminal for detecting the card coming into contact last with the corresponding external contact of the IC card.