Abstract: According to one embodiment, there is provided a printed-wiring board, includes a first base member including a component mounting face, a first electronic component with a through-electrode mounted on the component mounting face, a second base member stacked on the first base member via an insulating layer covering the first electronic component, a hole part provided in the second base member and communicating with the through-electrode of the first electronic component, and a second electronic component mounted on the second base member and circuit-connected directly to the through-electrode via the hole part.

Abstract: According to one embodiment, a printed wiring board structure comprises a printed wiring board having first and second component mounting surfaces at front and back sides thereof, respectively, each for mounting a semiconductor package loading a semiconductor chip loaded on a substrate as a mounting component, a first semiconductor package mounted on the first component mounting surface, and a second semiconductor package mounted on the second component mounting surface, wherein the first and second semiconductor packages have a positional relationship such that the substrates are partially overlapped via the printed wiring board, and the semiconductor chips are not overlapped.

Abstract: A communicator is adapted to perform communications with an external apparatus. A rewritable memory stores a control program configured to control an operation of the electronic apparatus, and a first communication program. An unrewritable memory stores a second communication program. A first inspector is operable to judge whether the control program is normal. A second inspector is operable to judge whether the first communication program is normal. A first downloader is operable to download the control program from the external apparatus by way of the communicator under the control of the first communication program, in a case where the first inspector judges the control program is not normal and the second inspector judges the first communication program is normal.

Abstract: According to one embodiment, an electronic device includes a printed circuit board housed in a housing, a surface mount part soldered to the printed circuit board, a cooling mechanism which covers the surface mount part from an opposite side to the printed circuit board, a reinforcing portion formed by supplying an adhesive to an outer peripheral edge of the surface mount part and the printed circuit board such as to be across each other, which reinforces a solder joint portion provided between the surface mount part and the printed circuit board and a spacer formed of the adhesive, which is set between the surface mount part and the cooling mechanism and supports the cooling mechanism.

Abstract: According to one embodiment, an electronic device includes a housing, a first substrate having rigidity and including a slit, contained in the housing, a part mount portion provided on the first substrate and adjacent to the slit, an electronic part mounted on the part mount portion and a second substrate having flexibility. The second substrate is stacked on an inside of the first substrate and an inside of the part mount portion, and it crosses the slit, thereby supporting the part mount portion to be displaceable with respect to the first substrate.

Abstract: According to one embodiment, a semiconductor chip mounting body, with an enhanced shock-resistance at portions of the bonding member corresponding to the corners of a semiconductor chip, is provided. The semiconductor chip mounting body includes a circuit board having a circuit pattern formed on a mounting surface thereof, a semiconductor chip mounted on the circuit pattern of the circuit board, and a bonding member arranged at least between the circuit board and the semiconductor chip, and on the sides of the semiconductor chip to fix the semiconductor chip on the circuit board. The bonding member contains thermosetting resin and magnetic powder dispersed in the thermosetting resin. The magnetic powder is locally disposed in portions of the bonding member which is located the corners of the semiconductor chip.

Abstract: According to one embodiment, an electronic apparatus includes a housing, a printed wiring board accommodated in the housing, and a circuit component electrically connected to the printed wiring board, the circuit component including an outer peripheral surface. The printed wiring board includes an outer peripheral edge, at least a pair of edge portions extending in mutually crossing directions, the pair of edge portions being opposed to the outer peripheral surface of the circuit component and being located inside the outer peripheral edge, and a projection portion located between the pair of edge portions and projecting toward the circuit component.

Abstract: According to one embodiment, an electronic device includes a housing, a first substrate having rigidity and including a slit, contained in the housing, a part mount portion provided on the first substrate and adjacent to the slit, an electronic part mounted on the part mount portion and a second substrate having flexibility. The second substrate is stacked on an inside of the first substrate and an inside of the part mount portion, and it crosses the slit, thereby supporting the part mount portion to be displaceable with respect to the first substrate.

Abstract: According to one embodiment, an electronic device includes a printed circuit board housed in a housing, a surface mount part soldered to the printed circuit board, a cooling mechanism which covers the surface mount part from an opposite side to the printed circuit board, a reinforcing portion formed by supplying an adhesive to an outer peripheral edge of the surface mount part and the printed circuit board such as to be across each other, which reinforces a solder joint portion provided between the surface mount part and the printed circuit board and a spacer formed of the adhesive, which is set between the surface mount part and the cooling mechanism and supports the cooling mechanism.

Abstract: The present invention relates to a method for prevention or treatment of periodontal diseases, containing administering lignans represented by the following formula (1) (wherein R1 represents a hydrogen atom or a hydroxyl group; R2, R3, R4 and R5 are the same or different and each represents a hydrogen atom, a hydroxyl group, a C1-10 alkyl group, a hydroxy C1-10 alkyl group or a C1-10 alkoxy group) or plant extracts containing the lignans.

Abstract: According to one embodiment, an electronic device is provided with a conductive member, a printed wiring board including an insulating base member, and a metal foil member provided on one surface of the base member, a fixing member which fixes the printed wiring board to the conductive member, and a conductive adhesive member which covers a surface of the metal foil member and electrically connects the metal foil member to the fixing member.

Abstract: To provide a lipolysis agent, a slimming agent, and a cellulite-ameliorating agent, which stimulate decomposition of fat accumulated in the adipose tissue, to thereby exhibit body-slimming effect and which is effective for inhibition or prevention of obesity and amelioration of prone to obesity. The lipolysis stimulator of the invention contains, as effective ingredients, a plant Huang Hua Cai or an extract thereof, and a xanthine derivative.

Abstract: According to one embodiment, a semiconductor chip mounting body, with an enhanced shock-resistance at portions of the bonding member corresponding to the corners of a semiconductor chip, is provided. The semiconductor chip mounting body includes a circuit board having a circuit pattern formed on a mounting surface thereof, a semiconductor chip mounted on the circuit pattern of the circuit board, and a bonding member arranged at least between the circuit board and the semiconductor chip, and on the sides of the semiconductor chip to fix the semiconductor chip on the circuit board. The bonding member contains thermosetting resin and magnetic powder dispersed in the thermosetting resin. The magnetic powder is locally disposed in portions of the bonding member which is located the corners of the semiconductor chip.

Abstract: According to one embodiment of, a multilayer printed wiring board comprises an electronic part, a mount layer where the electronic part is mounted, a mount layer conductor pattern formed in the mount layer, an opposite layer containing the electronic part between itself and the mount layer, an opposite layer conductor pattern formed on the opposite layer and an electrically conductive connector contained between the mount layer and the opposite layer and electrically connecting the mount layer conductor pattern and the opposite layer conductor pattern to each other.

Abstract: According to one embodiment, an electronic device includes a housing, a printed circuit board, an electronic component, a bonding material, and chips. The printed circuit board is housed in the housing. The electronic component includes an electrode on a surface thereof that faces the printed circuit board. The bonding material is applied to at least part of the outer periphery of the electronic component on the printed circuit board to bond the electronic component to the printed circuit board. The chips are arranged at positions on the printed circuit board corresponding to the periphery of the surface of the electronic component to prevent the bonding material from intruding in a gap between the surface of the electronic component and the printed circuit board.

Abstract: According to one embodiment, there is provided a printed circuit board includes a printed wiring board having a component mounting surface, a semiconductor package which is mounted on the component mounting surface of the printed wiring board by solder bonding using solder balls, and reinforcement portions which locally reinforce portions of the solder bonding of the semiconductor package at a plurality of locations on the component mounting surface of the printed wiring board, the reinforcement portions being formed of a resin material having parts entering the solder balls of the portions of the solder bonding.

Abstract: Ion-conducting (co)polymer media and ion-conducting oligomer media close in ion conductivity to organic-solvent-based electrolytes can be produced easily and safely on industrial scale. These ion-conducting (co)polymer media use (co)polymers containing at least one cyclocarbonato group, and these ion-conducting oligomer media employ oligomers containing at least two cyclocarbonato groups.

Abstract: A printed circuit board, an electronic instrument, and a semiconductor package are provided that are excellent in bonding strength and easy in rework. The printed circuit board includes a printed wiring board, an electronic device that is the semiconductor package, and an adhesion part. A protection member of the electronic device is arranged along the periphery of a mounting surface of a package body so as to abut a mounting surface of the printed wiring board. The adhesion part is provided in a stepped part defined by a peripheral wall of the electronic device and part of the mounting surface of the printed wiring board in the vicinity of the electronic device.

Abstract: According to an aspect of the present invention, there is provided a printed circuit board including: a semiconductor package having a surface and a plurality of solder bumps arranged on the surface; a wiring board having electrodes provided at positions respectively corresponding to the solder bumps and configured to mount the semiconductor package; and a reinforcing member formed continuously along the surface and configured to fix the semiconductor package to the wiring board; wherein the reinforcing member is configured to define an opening portion between the surface and the wiring board.

Abstract: According to one embodiment, a printed circuit board includes a wiring board, a through-hole mount device, and a surface mount device. The wiring board has a first surface, a second surface opposite to the first surface, and through holes. The through-hole mount device has leads. The leads are soldered inside the through holes so that the through-hole mount device is mounted on the first surface. The leads have distal ends positioned inside the through holes. An adhesive fills the region between the wiring board and the through-hole mount device. The adhesive fixes the through-hole mount device to the first surface. A surface mount device is soldered to the second surface and closes the through holes in which the leads are inserted.