Abstract: According to an aspect of the present invention, there is provided a communication module including: a substrate including a recess, the recess including a bottom face and an opening portion; a MEMS device including a directional antenna, the MEMS device disposed in the recess and including a planar portion; and a supporting section configured to support the MEMS device so that an angle between the planar portion and the bottom face is changeable, the supporting section configured to electrically connect the substrate to the directional antenna.

Abstract: According to one embodiment, there is provided a printed circuit board includes a printed wiring board having a component mounting surface, a semiconductor package which is mounted on the component mounting surface of the printed wiring board by solder bonding using solder balls, and reinforcement portions which locally reinforce portions of the solder bonding of the semiconductor package at a plurality of locations on the component mounting surface of the printed wiring board, the reinforcement portions being formed of a resin material having parts entering the solder balls of the portions of the solder bonding.

Abstract: According to one embodiment, a printed wiring board structure comprises a printed wiring board having first and second component mounting surfaces at front and back sides thereof, respectively, each for mounting a semiconductor package loading a semiconductor chip loaded on a substrate as a mounting component, a first semiconductor package mounted on the first component mounting surface, and a second semiconductor package mounted on the second component mounting surface, wherein the first and second semiconductor packages have a positional relationship such that the substrates are partially overlapped via the printed wiring board, and the semiconductor chips are not overlapped.

Abstract: According to one embodiment, there is provided a printed circuit board which comprises a printed wiring board, a semiconductor package having a number of solder bonding members arranged on its back side and mounted on the printed wiring board by the solder bonding members being soldered to the wiring board, and reinforcing members which are formed of a reinforcing material having a solder flux function and locally reinforce the solder bonding members in a number of places on the semiconductor package mounting portion of the printed wiring board.

Abstract: According to one embodiment, a printed circuit board includes a wiring board, a through-hole mount device, and a surface mount device. The wiring board has a first surface, a second surface opposite to the first surface, and through holes. The through-hole mount device has leads. The leads are soldered inside the through holes so that the through-hole mount device is mounted on the first surface. The leads have distal ends positioned inside the through holes. An adhesive fills the region between the wiring board and the through-hole mount device. The adhesive fixes the through-hole mount device to the first surface. A surface mount device is soldered to the second surface and closes the through holes in which the leads are inserted.

Abstract: This invention provides a vasoprotective agent containing a plant or its extract as an effective ingredient. The plant is selected from the group consisting of rosemary, sage, geranium herb, adlai, field horsetail, bitter orange peel, fucus, burdock, dokudami, Japan pepper, Ophiopogon tuber, ginkgo, natsume and dishcloth gourd.

Abstract: According to one embodiment, a printed circuit board includes a printed wiring board including a through hole part, an electronic component including a component body and a lead member inserted into the through hole part to be electrically connected thereto, a metal member disposed around and separated from the through hole part, and a solder resist disposed at least around the metal member, at least a part of the component body being mounted on the solder resist

Abstract: According to one embodiment, there is provided a printed-wiring board, includes a first base member including a component mounting face, a first electronic component with a through-electrode mounted on the component mounting face, a second base member stacked on the first base member via an insulating layer covering the first electronic component, a hole part provided in the second base member and communicating with the through-electrode of the first electronic component, and a second electronic component mounted on the second base member and circuit-connected directly to the through-electrode via the hole part.

Abstract: According to one embodiment, a printed circuit board has a wiring board having through holes, a through-hole mount device having a lead, and a surface mount device. The lead is soldered in the through hole, whereby the through-hole mount device is mounted on a first surface of the wiring board. The lead has a distal end lying in the through hole. The surface mount device is soldered to a second surface of the wiring board, closing the through hole in which the lead is inserted. The second surface is opposite to the first surface.

Abstract: A communicator is adapted to perform communications with an external apparatus. A rewritable memory stores a control program configured to control an operation of the electronic apparatus, and a first communication program. An unrewritable memory stores a second communication program. A first inspector is operable to judge whether the control program is normal. A second inspector is operable to judge whether the first communication program is normal. A first downloader is operable to download the control program from the external apparatus by way of the communicator under the control of the first communication program, in a case where the first inspector judges the control program is not normal and the second inspector judges the first communication program is normal.

Abstract: According to one embodiment, a printed circuit board has a wiring board having through holes, a through-hole mount device having a lead, and a surface mount device. The lead is soldered in the through hole, whereby the through-hole mount device is mounted on a first surface of the wiring board. The lead has a distal end lying in the through hole. The surface mount device is soldered to a second surface of the wiring board, closing the through hole in which the lead is inserted. The second surface is opposite to the first surface.

Abstract: According to one embodiment of, a multilayer printed wiring board comprises an electronic part, a mount layer where the electronic part is mounted, a mount layer conductor pattern formed in the mount layer, an opposite layer containing the electronic part between itself and the mount layer, an opposite layer conductor pattern formed on the opposite layer and an electrically conductive connector contained between the mount layer and the opposite layer and electrically connecting the mount layer conductor pattern and the opposite layer conductor pattern to each other.

Abstract: A solidifying material for a cell electrolyte solution is a block copolymer, which comprises, as segments A, a polymer non-compatible with the cell electrolyte solution and, as segments B, a polymer compatible with the cell electrolyte solution. The solidifying material absorbs and solidifies the cell electrolyte solution. A smallest unit of the block copolymer is A-B-A. To each of the segments B, at least one group selected from the group consisting of a carboxyl group, an ester group, a hydroxyl group, a sulfonic group, an amino group, a cyclic carbonate group and a polyoxyalkylene group is bonded via a —S— bond or a —C— bond.

Abstract: A high-molecular gelling agent precursor for an electrolyte comprises a copolymer formed of (A) a hydrophobic monomer having a hydrophobic group, which forms a carboxyl group upon saponification, and (B) a hydrophobic polyfunctional monomer. The saponification product of the copolymer has property to gel the electrolyte. A high-molecular gelling agent for the electrolyte is produced by saponifying the precursor with a saponifying agent selected from the group consisting of acids and alkalis while using a reaction medium selected from the group consisting of water and hydrophobic organic solvents.

Abstract: A desalting method for raw water with at least a water-soluble salt contained therein comprises the following first and second steps: (1) removing water from said raw water to concentrate said raw water; and (2) removing at least a part of said water-soluble salt from the resulting concentrated rawwater. This method can conduct the desalting of raw water, which contains at least a water-soluble salt, industrially and economically.

Abstract: The present invention relates to a method for prevention or treatment of periodontal diseases, containing administering lignans represented by the following formula (1) (wherein R1 represents a hydrogen atom or a hydroxyl group; R2, R3, R4 and R5 are the same or different and each represents a hydrogen atom, a hydroxyl group, a C1-10 alkyl group, a hydroxy C1-10 alkyl group or a C1-10 alkoxy group) or plant extracts containing the lignans.

Abstract: A solidifying material for a cell electrolyte solution is a block copolymer, which comprises, as segments A, a polymer non-compatible with the cell electrolyte solution and, as segments B, a polymer compatible with the cell electrolyte solution. The solidifying material absorbs and solidifies the cell electrolyte solution. A smallest unit of the block copolymer is A-B-A. To each of the segments B, at least one group selected from the group consisting of a carboxyl group, an ester group, a hydroxyl group, a sulfonic group, an amino group, a cyclic carbonate group and a polyoxyalkylene group is bonded via a −S— bond or a —C— bond.

Abstract: A solidifying material for a cell electrolyte solution is a block copolymer, which comprises, as segments A, a polymer non-compatible with the cell electrolyte solution and, as segments B, a polymer compatible with the cell electrolyte solution. The solidifying material absorbs and solidifies the cell electrolyte solution. A smallest unit of the block copolymer is A-B-A. To each of the segments B, at least one group selected from the group consisting of a carboxyl group, an ester group, a hydroxyl group, a sulfonic group, an amino group, a cyclic carbonate group and a polyoxyalkylene group is bonded via a —S— bond or a —C— bond.

Abstract: Ion-conducting (co)polymer media and ion-conducting oligomer media close in ion conductivity to organic-solvent-based electrolytes can be produced easily and safely on industrial scale. These ion-conducting (co)polymer media use (co)polymers containing at least one cyclocarbonato group, and these ion-conducting oligomer media employ oligomers containing at least two cyclocarbonato groups.

Abstract: A charge mosaic membrane having excellent selective permeability comprises a cationic polymer component, an anionic polymer component and a matrix component. Both of the cationic polymer component and the anionic polymer component are crosslinked particulate polymers. The matrix component is at least one polymer selected from a polysulfone resin, a polyarylate resin, a polyamide resin, a polyimide resin, a polyamideimide resin, a polyurethane resin, a fluorinated resin or a silicone resin. The charge mosaic membrane can be easily produced by conducting formation of the membrane by using a composition in which the cationic polymer component and the anionic polymer component are both dispersed in a solution of the matrix component in an organic solvent.