Patents by Inventor Minoru Yamamoto

Minoru Yamamoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240073639
    Abstract: The present technology relates to an information processing apparatus and method, and a program that enable more efficient edit. The information processing apparatus includes a control unit that selects and groups a plurality of objects existing in a predetermined space, and changes the positions of the plurality of the objects while maintaining the relative positional relationship of the plurality of the grouped objects in the space. The present technology can be applied to information processing apparatuses.
    Type: Application
    Filed: November 9, 2023
    Publication date: February 29, 2024
    Applicant: Sony Group Corporation
    Inventors: Minoru Tsuji, Toru Chinen, Mitsuyuki Hatanaka, Yuki Yamamoto
  • Patent number: 11917221
    Abstract: The present technology relates to an encoding device, an encoding method, a reproduction device, a reproduction method, and a program enabling each reproduction equipment to reproduce an appropriate content in a simplified manner. A content data decoding unit decodes encoded metadata and outputs zoom area information, which is included in metadata acquired as a result thereof, designating an area to be zoomed. A zoom area selecting unit selects one or a plurality of pieces of zoom area information from among the zoom area information. A video segmenting unit segments a zoom area represented by the selected zoom area information in a video based on video data and outputs zoom video data acquired as a result thereof. An audio converting unit performs an audio converting process according to the selected zoom area information for audio data and outputs zoom audio data acquired as a result thereof. The present technology can be applied to a reproduction device.
    Type: Grant
    Filed: April 26, 2022
    Date of Patent: February 27, 2024
    Assignee: Sony Group Corporation
    Inventors: Minoru Tsuji, Toru Chinen, Runyu Shi, Masayuki Nishiguchi, Yuki Yamamoto
  • Publication number: 20240053216
    Abstract: An object of the present disclosure is to provide a chamber with which inspection conditions of a leak test performed on workpieces of different sizes can easily be managed. The chamber according to an aspect of the present disclosure is a chamber used in a leak tester, and includes: a main chamber for housing a workpiece; a sub-chamber that communicates with the main chamber; and a volume changing mechanism for changing the volume of the sub-chamber, wherein the volume changing mechanism changes the volume of the sub-chamber such that a total volume of a space on the outside of the workpiece in the main chamber and the sub-chamber remains constant with respect to workpieces of different sizes.
    Type: Application
    Filed: August 8, 2023
    Publication date: February 15, 2024
    Inventors: Toru ISHII, Minoru YAMAMOTO, Daisuke HOMMA, Kosei FUJITA
  • Publication number: 20240053218
    Abstract: An object of the present invention is to provide a chamber in which workpieces of different sizes can be positioned. A chamber according to an aspect of the present invention is a chamber for a leak tester, the chamber housing in the interior thereof a workpiece having an opening, the chamber including: a first member having a recess that forms a housing space for the workpiece; a second member adapted to close an open end of the recess; and a positioning mechanism for positioning the workpiece within the housing space such that the opening is in a predetermined position, wherein the positioning mechanism holds the workpiece apart from the first member and the second member.
    Type: Application
    Filed: August 8, 2023
    Publication date: February 15, 2024
    Inventors: Toru ISHII, Minoru YAMAMOTO, Daisuke HOMMA, Kosei FUJITA
  • Publication number: 20240001622
    Abstract: A method for producing a resin part includes: preparing an intermediate body comprising a first member and a second member, the first member containing a resin; and welding the first member with the second member by performing scanning of the intermediate body with a first laser beam and a second laser beam. In the welding of the first member with the second member, the scanning with the first laser beam and the second laser beam is performed in a state in which a center of a second spot is located on a rear side in a direction of the scanning with the first laser beam and the second laser beam as compared to a center of a first spot while at least a part of the first spot and at least a part of the second spot overlap with each other.
    Type: Application
    Filed: June 28, 2023
    Publication date: January 4, 2024
    Applicants: Nichia Corporation, Laser Systems Inc.
    Inventors: Ryota TAOKA, Ryota TAKAO, Minoru YAMAMOTO, Hiroaki TAMEMOTO, Hiroshi YAGUCHI
  • Publication number: 20230387344
    Abstract: A method of producing a semiconductor device, the method includes steps of: detecting a defect included in a semiconductor layer; forming a metal film on the semiconductor layer; after forming the metal film on the semiconductor layer, exposing the semiconductor layer through the metal film by removing a portion of the metal film by irradiation with a first laser emitting red or infrared light; and after the step of exposing the semiconductor layer, removing a portion of the semiconductor layer by irradiation with a second laser emitting ultraviolet light, said portion of the semiconductor layer including the defect. A diameter of said portion of the metal film is greater than a diameter of said portion of the semiconductor layer in a plan view. Said portion of the metal film overlaps with said portion of the semiconductor layer in the plan view.
    Type: Application
    Filed: May 1, 2023
    Publication date: November 30, 2023
    Applicant: NICHIA CORPORATION
    Inventors: Yoshiki YAMAGUCHI, Hiroki HAYASHI, Satoshi OKUMURA, Minoru YAMAMOTO, Hiroaki TAMEMOTO
  • Patent number: 11769852
    Abstract: A method of manufacturing a light emitting element according to certain embodiments of the present disclosure includes: scanning and irradiating a first laser light having a first irradiation intensity to a sapphire substrate along predetermined dividing lines collectively in a shape of a tessellation of a plurality of hexagonal shapes in a top view to create a plurality of first modified regions along the predetermined dividing lines; and scanning and irradiating a second laser light having a second irradiation intensity greater than the first irradiation intensity to the sapphire substrate along the predetermined dividing lines to create a plurality of second modified regions overlapping the plurality of first modified regions.
    Type: Grant
    Filed: July 31, 2020
    Date of Patent: September 26, 2023
    Assignee: NICHIA CORPORATION
    Inventors: Masayuki Ibaraki, Minoru Yamamoto, Naoto Inoue, Hiroaki Tamemoto
  • Patent number: 11713294
    Abstract: Provided is a method for producing an organic tellurium compound that enables the production of an organic tellurium compound in high yield using metallic tellurium as a source material and produces less amount of side products. A method for producing an organic tellurium compound includes the steps of: (A) reacting metallic tellurium with a compound represented by a general formula (1) below; and (B) reacting a compound obtained by the step (A) with an organic halogen compound, the metallic tellurium having a copper content of less than 100 ppm, M(R1)m ??Formula (1) where R1 represents an alkyl group having 1 to 8 carbon atoms, an aryl group or an aromatic heterocyclic group, M represents an alkali metal or an alkaline earth metal, m represents 1 when M is an alkali metal, and m represents 2 when M is an alkaline earth metal.
    Type: Grant
    Filed: November 19, 2019
    Date of Patent: August 1, 2023
    Assignee: OTSUKA CHEMICAL CO., LTD
    Inventor: Minoru Yamamoto
  • Publication number: 20230138592
    Abstract: A method for manufacturing a light-emitting element includes preparing a wafer; a laser beam irradiation process; and a separation process. The laser beam irradiation process includes a first irradiation process of forming a plurality of first modified portions, and a second irradiation process of forming a plurality of second modified portions. The second modified portions are formed in the second irradiation process so that a length in a thickness direction of the sapphire substrate of the second modified portions is greater than a length in the thickness direction of the first modified portions.
    Type: Application
    Filed: October 12, 2022
    Publication date: May 4, 2023
    Applicants: NICHIA CORPORATION, HAMAMATSU PHOTONICS K.K.
    Inventors: Naoto INOUE, Minoru YAMAMOTO, Taichi OKUBO, Hiroaki TAMEMOTO, Ryota SUGIO, Yusuke SEKIMOTO
  • Publication number: 20220371130
    Abstract: This laser processing apparatus is for forming modified regions in an object, which includes a sapphire substrate having a C-plane as a main surface, along cutting lines by focusing laser light on the object, and is provided with a laser light source, a spatial light modulator, and a focusing optical system. The spatial light modulator performs aberration correction by a first aberration correction amount smaller than an ideal aberration correction amount when the modified region is formed along a first cutting line along an a-axis direction of the sapphire substrate, and performs aberration correction by a second aberration correction amount smaller than the ideal aberration correction amount and different from the first aberration correction amount when the modified region is formed along a second cutting line along an in-axis direction of the sapphire substrate.
    Type: Application
    Filed: August 7, 2020
    Publication date: November 24, 2022
    Applicants: NICHIA CORPORATION, HAMAMATSU PHOTONICS K.K.
    Inventors: Hiroaki TAMEMOTO, Minoru YAMAMOTO, Yusuke SEKIMOTO, Ryota SUGIO, Tominori NAKAMURA
  • Patent number: 11489086
    Abstract: A method of manufacturing light emitting elements includes: providing a wafer including a substrate formed of sapphire and having a first main surface and a second main surface, and a semiconductor layered body disposed on the first main surface of the substrate; irradiating a laser beam into the substrate to form a modified region inside the substrate, the modified region having a crack reaching the first main surface and a crack reaching the second main surface; irradiating CO2 laser to a region of the substrate overlapping with a region to which the laser beam has been irradiated; and cleaving the wafer along the modified region to obtain the light emitting elements each having a hexagonal shape in a plan view.
    Type: Grant
    Filed: June 22, 2020
    Date of Patent: November 1, 2022
    Assignee: NICHIA CORPORATION
    Inventors: Naoto Inoue, Minoru Yamamoto, Satoshi Okumura, Hiroki Okamoto, Hiroaki Tamemoto
  • Publication number: 20220324180
    Abstract: A method for processing a resin member includes: irradiating a first member comprising a resin with first light of a first wavelength that causes electronic excitation of the resin; and irradiating the resin electronically excited through irradiation with the first light with second light of a second wavelength longer than the first wavelength. A wavelength range of the second wavelength is within a wavelength range in which light absorption of the resin increases through electronic excitation of the resin.
    Type: Application
    Filed: June 23, 2022
    Publication date: October 13, 2022
    Applicants: Laser Systems Inc., NICHIA CORPORATION
    Inventors: Yuichi ASAKAWA, Yasuyuki TSUBOI, Hiroaki TAMEMOTO, Ryota TAOKA, Minoru YAMAMOTO
  • Patent number: 11289621
    Abstract: A method includes preparing a wafer including a substrate and a semiconductor structure, and irradiating an inner portion of the substrate at a predetermined depth in a thickness direction a plurality of times with laser pulses at a first time interval and a predetermined distance interval between irradiations. Each irradiation performed at the first time intervals in the step of irradiating the substrate with laser pulses includes irradiating the substrate at a first focal position in the thickness direction with a first laser pulse having a first pulse-energy; and after irradiating with the first laser pulse, irradiating the substrate with a second laser pulse performed after a second time interval, the second time interval being shorter than the first time interval and being in a range of 3 ps to 900 ps, and the second laser pulse having a second pulse-energy 0.5 to 1.5 times the first pulse-energy.
    Type: Grant
    Filed: November 26, 2018
    Date of Patent: March 29, 2022
    Assignees: NICHIA CORPORATION, IMRA AMERICA, INC.
    Inventors: Minoru Yamamoto, Naoto Inoue, Hiroaki Tamemoto, Yoshitaka Hotta, Hideyuki Ohtake
  • Publication number: 20220009885
    Abstract: Provided is a method for producing an organic tellurium compound that enables the production of an organic tellurium compound in high yield using metallic tellurium as a source material and produces less amount of side products. A method for producing an organic tellurium compound includes the steps of: (A) reacting metallic tellurium with a compound represented by a general formula (1) below; and (B) reacting a compound obtained by the step (A) with an organic halogen compound, the metallic tellurium having a copper content of less than 100 ppm, M(R1)m ??Formula (1) where R1 represents an alkyl group having 1 to 8 carbon atoms, an aryl group or an aromatic heterocyclic group, M represents an alkali metal or an alkaline earth metal, m represents 1 when M is an alkali metal, and m represents 2 when M is an alkaline earth metal.
    Type: Application
    Filed: November 19, 2019
    Publication date: January 13, 2022
    Applicant: OTSUKA CHEMICAL CO., LTD
    Inventor: Minoru Yamamoto
  • Patent number: 11186588
    Abstract: The 6H-thieno[2,3-e][1,2,4]triazolo[3,4-c][1,2,4]triazepine derivatives or salts thereof of the present invention have BRD4 inhibitory activity, and thus, they are useful as medicaments, in particular, as prophylaxis and/or therapeutic agents for diseases associated with BRD4.
    Type: Grant
    Filed: May 31, 2018
    Date of Patent: November 30, 2021
    Assignee: AYUMI PHARMACEUTICAL CORPORATION
    Inventors: Hiroyuki Aono, Iwao Seki, Miwa Imamura, Tomomi Tanaka, Satoshi Shirae, Kenji Kawashima, Yusuke Yamazaki, Minoru Yamamoto
  • Publication number: 20210130367
    Abstract: The 6H-thieno[2,3-e][1,2,4]triazolo[3,4-c][1,2,4]triazepine derivatives or salts thereof of the present invention have BRD4 inhibitory activity, and thus, they are useful as medicaments, in particular, as prophylaxis and/or therapeutic agents for diseases associated with BRD4.
    Type: Application
    Filed: May 31, 2018
    Publication date: May 6, 2021
    Applicant: AYUMI PHARMACEUTICAL CORPORATION
    Inventors: Hiroyuki AONO, Iwao SEKI, Miwa IMAMURA, Tomomi TANAKA, Satoshi SHIRAE, Kenji KAWASHIMA, Yusuke YAMAZAKI, Minoru YAMAMOTO
  • Publication number: 20210036182
    Abstract: A method of manufacturing a light emitting element according to certain embodiments of the present disclosure includes: scanning and irradiating a first laser light having a first irradiation intensity to a sapphire substrate along predetermined dividing lines collectively in a shape of a tessellation of a plurality of hexagonal shapes in a top view to create a plurality of first modified regions along the predetermined dividing lines; and scanning and irradiating a second laser light having a second irradiation intensity greater than the first irradiation intensity to the sapphire substrate along the predetermined dividing lines to create a plurality of second modified regions overlapping the plurality of first modified regions.
    Type: Application
    Filed: July 31, 2020
    Publication date: February 4, 2021
    Applicant: NICHIA CORPORATION
    Inventors: Masayuki IBARAKI, Minoru YAMAMOTO, Naoto INOUE, Hiroaki TAMEMOTO
  • Patent number: 10901923
    Abstract: According to one embodiment, an electronic device includes an interface, a setting unit, and a controller. The interface is operable to perform communication in accordance with a protocol. The setting unit is configured to set one of a plurality of items indicating a state of the electronic device. The controller is configured to, when a command is received via the interface, obtain the state of the item set in the setting unit, and when a response to the command is transmitted, include state information indicating the state of the set item in a header portion of the response defined in a communication standard of the protocol.
    Type: Grant
    Filed: March 4, 2020
    Date of Patent: January 26, 2021
    Assignees: Kabushiki Kaisha Toshiba, Toshiba Electronic Devices & Storage Corporation
    Inventors: Minoru Yamamoto, Michihiko Umeda
  • Publication number: 20210005777
    Abstract: A method of manufacturing light emitting elements includes: providing a wafer including a substrate formed of sapphire and having a first main surface and a second main surface, and a semiconductor layered body disposed on the first main surface of the substrate; irradiating a laser beam into the substrate to form a modified region inside the substrate, the modified region having a crack reaching the first main surface and a crack reaching the second main surface; irradiating CO2 laser to a region of the substrate overlapping with a region to which the laser beam has been irradiated; and cleaving the wafer along the modified region to obtain the light emitting elements each having a hexagonal shape in a plan view.
    Type: Application
    Filed: June 22, 2020
    Publication date: January 7, 2021
    Inventors: Naoto INOUE, Minoru YAMAMOTO, Satoshi OKUMURA, Hiroki OKAMOTO, Hiroaki TAMEMOTO
  • Publication number: 20200365758
    Abstract: A method includes preparing a wafer including a substrate and a semiconductor structure, and irradiating an inner portion of the substrate at a predetermined depth in a thickness direction a plurality of times with laser pulses at a first time interval and a predetermined distance interval between irradiations. Each irradiation performed at the first time intervals in the step of irradiating the substrate with laser pulses includes irradiating the substrate at a first focal position in the thickness direction with a first laser pulse having a first pulse-energy; and after irradiating with the first laser pulse, irradiating the substrate with a second laser pulse performed after a second time interval, the second time interval being shorter than the first time interval and being in a range of 3 ps to 900 ps, and the second laser pulse having a second pulse-energy 0.5 to 1.5 times the first pulse-energy.
    Type: Application
    Filed: November 26, 2018
    Publication date: November 19, 2020
    Applicants: NICHIA CORPORATION, IMRA AMERICA, INC.
    Inventors: Minoru YAMAMOTO, Naoto INOUE, Hiroaki TAMEMOTO, Yoshitaka HOTTA, Hideyuki OHTAKE