Abstract: A method includes preparing a wafer including a substrate and a semiconductor structure, and irradiating an inner portion of the substrate at a predetermined depth in a thickness direction a plurality of times with laser pulses at a first time interval and a predetermined distance interval between irradiations. Each irradiation performed at the first time intervals in the step of irradiating the substrate with laser pulses includes irradiating the substrate at a first focal position in the thickness direction with a first laser pulse having a first pulse-energy; and after irradiating with the first laser pulse, irradiating the substrate with a second laser pulse performed after a second time interval, the second time interval being shorter than the first time interval and being in a range of 3 ps to 900 ps, and the second laser pulse having a second pulse-energy 0.5 to 1.5 times the first pulse-energy.

Abstract: Provided is a method for producing an organic tellurium compound that enables the production of an organic tellurium compound in high yield using metallic tellurium as a source material and produces less amount of side products. A method for producing an organic tellurium compound includes the steps of: (A) reacting metallic tellurium with a compound represented by a general formula (1) below; and (B) reacting a compound obtained by the step (A) with an organic halogen compound, the metallic tellurium having a copper content of less than 100 ppm, M(R1)m ??Formula (1) where R1 represents an alkyl group having 1 to 8 carbon atoms, an aryl group or an aromatic heterocyclic group, M represents an alkali metal or an alkaline earth metal, m represents 1 when M is an alkali metal, and m represents 2 when M is an alkaline earth metal.

Abstract: The 6H-thieno[2,3-e][1,2,4]triazolo[3,4-c][1,2,4]triazepine derivatives or salts thereof of the present invention have BRD4 inhibitory activity, and thus, they are useful as medicaments, in particular, as prophylaxis and/or therapeutic agents for diseases associated with BRD4.

Abstract: The 6H-thieno[2,3-e][1,2,4]triazolo[3,4-c][1,2,4]triazepine derivatives or salts thereof of the present invention have BRD4 inhibitory activity, and thus, they are useful as medicaments, in particular, as prophylaxis and/or therapeutic agents for diseases associated with BRD4.

Abstract: A method of manufacturing a light emitting element according to certain embodiments of the present disclosure includes: scanning and irradiating a first laser light having a first irradiation intensity to a sapphire substrate along predetermined dividing lines collectively in a shape of a tessellation of a plurality of hexagonal shapes in a top view to create a plurality of first modified regions along the predetermined dividing lines; and scanning and irradiating a second laser light having a second irradiation intensity greater than the first irradiation intensity to the sapphire substrate along the predetermined dividing lines to create a plurality of second modified regions overlapping the plurality of first modified regions.

Abstract: According to one embodiment, an electronic device includes an interface, a setting unit, and a controller. The interface is operable to perform communication in accordance with a protocol. The setting unit is configured to set one of a plurality of items indicating a state of the electronic device. The controller is configured to, when a command is received via the interface, obtain the state of the item set in the setting unit, and when a response to the command is transmitted, include state information indicating the state of the set item in a header portion of the response defined in a communication standard of the protocol.

Abstract: A method of manufacturing light emitting elements includes: providing a wafer including a substrate formed of sapphire and having a first main surface and a second main surface, and a semiconductor layered body disposed on the first main surface of the substrate; irradiating a laser beam into the substrate to form a modified region inside the substrate, the modified region having a crack reaching the first main surface and a crack reaching the second main surface; irradiating CO2 laser to a region of the substrate overlapping with a region to which the laser beam has been irradiated; and cleaving the wafer along the modified region to obtain the light emitting elements each having a hexagonal shape in a plan view.

Abstract: A method includes preparing a wafer including a substrate and a semiconductor structure, and irradiating an inner portion of the substrate at a predetermined depth in a thickness direction a plurality of times with laser pulses at a first time interval and a predetermined distance interval between irradiations. Each irradiation performed at the first time intervals in the step of irradiating the substrate with laser pulses includes irradiating the substrate at a first focal position in the thickness direction with a first laser pulse having a first pulse-energy; and after irradiating with the first laser pulse, irradiating the substrate with a second laser pulse performed after a second time interval, the second time interval being shorter than the first time interval and being in a range of 3 ps to 900 ps, and the second laser pulse having a second pulse-energy 0.5 to 1.5 times the first pulse-energy.

Abstract: Provided are a method for producing a multibranched polymer that can produce a multibranched polymer having a narrow molecular weight distribution in a one-pot procedure and the multibranched polymer. A method for producing a multibranched polymer includes the step of polymerizing a first vinyl monomer having a polymerization-initiating group in an ?-position of a vinyl bond and a second vinyl monomer free of polymerization-initiating group in an ?-position of a vinyl bond by a living radical polymerization.

Abstract: An electronic equipment assembly apparatus includes a cable holding tool, a work stage, and a robot unit. The cable holding tool holds the cable. The work stage holds the electronic equipment. The robot unit relatively moves the cable holding tool with respect to the electronic equipment held by the work stage. The cable holding tool includes a contactor and a width direction regulator. The contactor holds the cable by vacuum-sucking. The width direction regulator regulates a position in a width direction of the cable which comes into contact with the contactor.

Abstract: The electronic device manufacturing apparatus includes a cable holding tool, a work stage, a robot section, a first position detector, a second position detector, and a controller. The first position detector detects positions in a two-dimensional plane direction of the cable held by the cable holding tool and the connector of the electronic device held by the work stage. The second position detector detects positions in a height direction of the cable held by the cable holding tool and the connector of the electronic device held by the work stage. The controller controls the robot section based on the detection result of the first position detector and the second position detector.

Abstract: The electronic device manufacturing apparatus includes a cable holding tool, a work stage, a robot section, a first position detector, a second position detector, and a controller. The first position detector detects positions in a two-dimensional plane direction of the cable held by the cable holding tool and the connector of the electronic device held by the work stage. The second position detector detects positions in a height direction of the cable held by the cable holding tool and the connector of the electronic device held by the work stage. The controller controls the robot section based on the detection result of the first position detector and the second position detector.

Abstract: A board insertion device includes a holder; and an insertion guider which is slidably provided in the holder in an insertion direction of the board into the connector and includes a distal end portion protruding in the insertion direction from a first end surface of the board held in the holder and abutting against the connector during insertion of the board into the connector. Furthermore, the board insertion device includes an abutting portion; and a conversion mechanism converting a change of a relative position between the holder and the insertion guider into a movement of the abutting portion for changing a position of the ejector from a closed position to an open position. in which the conversion mechanism is provided in the insertion guider and engaged with the holder or is provided in the holder and engaged with the insertion guider.

Abstract: According to one embodiment, a magnetic disk device including a disk, a head configured to write data to the disk, a buffer memory configured to temporarily hold data to be written to the disk, a recorder configured to temporarily hold data to be input from the buffer memory, and a controller configured to transfer first data from the buffer memory to the recorder and to transfer second data corresponding to the first data from the recorder.

Abstract: A method of manufacturing a semiconductor element includes: providing a wafer having a semiconductor layered body on a sapphire substrate; irradiating a laser light in an interior region of the sapphire substrate to create cracks in the sapphire substrate by performing a first scan to irradiate the laser light at a first depth with a first pulse energy to create a first modified region, and a second scan following the first scan to irradiate the laser light at a second depth with a second pulse energy greater than the first pulse energy along and within the first modified region; and dividing the wafer by extending the cracks to obtain a semiconductor element.

Abstract: According to one embodiment, a magnetic disk device including a disk, a head configured to write data to the disk, a buffer memory configured to temporarily hold data to be written to the disk, a recorder configured to temporarily hold data to be input from the buffer memory, and a controller configured to transfer first data from the buffer memory to the recorder and to transfer second data corresponding to the first data from the recorder.

Abstract: A working apparatus includes a component holder that holds a component and mounts the component at a predetermined position of a work. In the working apparatus, the component holder that holds a component is configured to include a pair of grip members that pinch and grip the component, a grip member opening/closing portion that opens and closes the pair of grip members with an opening/closing motor as a drive source, a pair of contact portions that are disposed on the pair of grip members and freely rotate around a rotary shaft provided in an opening/closing direction of the grip member, and a contact portion driving portion that causes a roller, which is provided to be in contact with a side of a nozzle shaft, to convert a lifting and lowering motion of a nozzle shaft into a rotational motion of a spline shaft, and that causes the rotational motion to be transmitted to the contact portion via a plurality of rollers such that the contact portion rotates around the rotary shaft.

Abstract: Provided are a method for producing a multibranched polymer that can produce a multibranched polymer having a narrow molecular weight distribution in a one-pot procedure and the multibranched polymer. A method for producing a multibranched polymer includes the step of polymerizing a first vinyl monomer having a polymerization-initiating group in an ?-position of a vinyl bond and a second vinyl monomer free of polymerization-initiating group in an ?-position of a vinyl bond by a living radical polymerization.

Abstract: The electronic device manufacturing apparatus includes a cable holding tool, a work stage, a robot section, a first position detector, a second position detector, and a controller. The first position detector detects positions in a two-dimensional plane direction of the cable held by the cable holding tool and the connector of the electronic device held by the work stage. The second position detector detects positions in a height direction of the cable held by the cable holding tool and the connector of the electronic device held by the work stage. The controller controls the robot section based on the detection result of the first position detector and the second position detector.

Abstract: A method of manufacturing a semiconductor element includes: providing a wafer having a semiconductor layered body on a sapphire substrate; irradiating a laser light in an interior region of the sapphire substrate to create cracks in the sapphire substrate by performing a first scan to irradiate the laser light at a first depth with a first pulse energy to create a first modified region, and a second scan following the first scan to irradiate the laser light at a second depth with a second pulse energy greater than the first pulse energy along and within the first modified region; and dividing the wafer by extending the cracks to obtain a semiconductor element.