Patents by Inventor Minoru Yamamoto
Minoru Yamamoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12222710Abstract: To keep plant performance constant in a control apparatus for controlling a plant including a plurality of units. The control apparatus (a PCM) controls an automobile including a plurality of units. The control apparatus includes a model controller that generates a target value of a characteristic to be achieved by each unit based on a model set for each unit, a unit specifier (a performance change determinator) that specifies a unit in which performance unique to the unit has changed among the units, and a target value corrector (an FF updater) that corrects the target value for the unit that has been specified by the unit specifier.Type: GrantFiled: January 18, 2022Date of Patent: February 11, 2025Assignee: MAZDA MOTOR CORPORATIONInventors: Minoru Miyakoshi, Chitoshi Morishige, Yasuhide Yano, Tomohoko Adachi, Seiya Fujii, Shin Wakitani, Nobutaka Wada, Toru Yamamoto
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Patent number: 12216404Abstract: An actinic ray-sensitive or radiation-sensitive resin composition includes a photoacid generator A that generates an acid represented by General Formula (I), the acid having a pKa of ?1.00 or more; one or more selected from the group consisting of a photoacid generator B that generates an acid having a pKa larger than that of an acid generated from the photoacid generator A by 1.00 or more, and a nitrogen-containing compound C having a pKa of a conjugate acid thereof larger than that of the acid generated from the photoacid generator A by 1.00 or more; and an acid-decomposable resin, in which in a case where the actinic ray-sensitive or radiation-sensitive resin composition includes a photoacid generator D that generates an acid having a pKa of less than ?1.00, a ratio of the number of moles of the photoacid generator A to the number of moles of the photoacid generator D in the composition, is 1.0 or more.Type: GrantFiled: November 29, 2020Date of Patent: February 4, 2025Assignee: FUJIFILM CorporationInventors: Masafumi Kojima, Minoru Uemura, Takashi Kawashima, Akiyoshi Goto, Kei Yamamoto, Kazuhiro Marumo, Keiyu Ou
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Publication number: 20250040322Abstract: A method of manufacturing an optical member includes: providing a polycrystalline wavelength conversion member including phosphor particles and having a first surface and a second surface opposite to the first surface; forming a modified portion inside the wavelength conversion member by focusing laser light inside the wavelength conversion member; and cleaving the wavelength conversion member with the modified portion being a starting point, which includes pressing the wavelength conversion member from a first surface side.Type: ApplicationFiled: July 22, 2024Publication date: January 30, 2025Applicant: NICHIA CORPORATIONInventors: Mitsuo HAMADA, Hiroaki TAMEMOTO, Minoru YAMAMOTO, Ryota TAOKA, Kenta NISHIHARA
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Publication number: 20240258170Abstract: A method of manufacturing a semiconductor element includes irradiating a laser beam on a wafer, which includes a sapphire substrate having a first face and a second face opposite the first face and a semiconductor structure disposed on the first face, from a second face side. The laser beam irradiated along a first direction parallel to the second face of the sapphire substrate is focused inside the sapphire substrate to thereby create a modified portion in the sapphire substrate along the first direction. The wafer is severed and separated into a number of semiconductor elements following the formation of a modified portion. In the step of forming a modified portion, the laser beam is focused closer to the second face than to the first face in a thickness direction of the sapphire substrate.Type: ApplicationFiled: January 25, 2024Publication date: August 1, 2024Applicant: NICHIA CORPORATIONInventors: Minoru YAMAMOTO, Naoto INOUE, Masayuki IBARAKI, Hiroaki TAMEMOTO
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Patent number: 11945173Abstract: A method for processing a resin member includes: irradiating a first member comprising a resin with first light of a first wavelength that causes electronic excitation of the resin; and irradiating the resin electronically excited through irradiation with the first light with second light of a second wavelength longer than the first wavelength. A wavelength range of the second wavelength is within a wavelength range in which light absorption of the resin increases through electronic excitation of the resin.Type: GrantFiled: June 23, 2022Date of Patent: April 2, 2024Assignees: LASER SYSTEMS INC., NICHIA CORPORATIONInventors: Yuichi Asakawa, Yasuyuki Tsuboi, Hiroaki Tamemoto, Ryota Taoka, Minoru Yamamoto
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Publication number: 20240053218Abstract: An object of the present invention is to provide a chamber in which workpieces of different sizes can be positioned. A chamber according to an aspect of the present invention is a chamber for a leak tester, the chamber housing in the interior thereof a workpiece having an opening, the chamber including: a first member having a recess that forms a housing space for the workpiece; a second member adapted to close an open end of the recess; and a positioning mechanism for positioning the workpiece within the housing space such that the opening is in a predetermined position, wherein the positioning mechanism holds the workpiece apart from the first member and the second member.Type: ApplicationFiled: August 8, 2023Publication date: February 15, 2024Inventors: Toru ISHII, Minoru YAMAMOTO, Daisuke HOMMA, Kosei FUJITA
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Publication number: 20240053216Abstract: An object of the present disclosure is to provide a chamber with which inspection conditions of a leak test performed on workpieces of different sizes can easily be managed. The chamber according to an aspect of the present disclosure is a chamber used in a leak tester, and includes: a main chamber for housing a workpiece; a sub-chamber that communicates with the main chamber; and a volume changing mechanism for changing the volume of the sub-chamber, wherein the volume changing mechanism changes the volume of the sub-chamber such that a total volume of a space on the outside of the workpiece in the main chamber and the sub-chamber remains constant with respect to workpieces of different sizes.Type: ApplicationFiled: August 8, 2023Publication date: February 15, 2024Inventors: Toru ISHII, Minoru YAMAMOTO, Daisuke HOMMA, Kosei FUJITA
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Publication number: 20240001622Abstract: A method for producing a resin part includes: preparing an intermediate body comprising a first member and a second member, the first member containing a resin; and welding the first member with the second member by performing scanning of the intermediate body with a first laser beam and a second laser beam. In the welding of the first member with the second member, the scanning with the first laser beam and the second laser beam is performed in a state in which a center of a second spot is located on a rear side in a direction of the scanning with the first laser beam and the second laser beam as compared to a center of a first spot while at least a part of the first spot and at least a part of the second spot overlap with each other.Type: ApplicationFiled: June 28, 2023Publication date: January 4, 2024Applicants: Nichia Corporation, Laser Systems Inc.Inventors: Ryota TAOKA, Ryota TAKAO, Minoru YAMAMOTO, Hiroaki TAMEMOTO, Hiroshi YAGUCHI
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Publication number: 20230387344Abstract: A method of producing a semiconductor device, the method includes steps of: detecting a defect included in a semiconductor layer; forming a metal film on the semiconductor layer; after forming the metal film on the semiconductor layer, exposing the semiconductor layer through the metal film by removing a portion of the metal film by irradiation with a first laser emitting red or infrared light; and after the step of exposing the semiconductor layer, removing a portion of the semiconductor layer by irradiation with a second laser emitting ultraviolet light, said portion of the semiconductor layer including the defect. A diameter of said portion of the metal film is greater than a diameter of said portion of the semiconductor layer in a plan view. Said portion of the metal film overlaps with said portion of the semiconductor layer in the plan view.Type: ApplicationFiled: May 1, 2023Publication date: November 30, 2023Applicant: NICHIA CORPORATIONInventors: Yoshiki YAMAGUCHI, Hiroki HAYASHI, Satoshi OKUMURA, Minoru YAMAMOTO, Hiroaki TAMEMOTO
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Patent number: 11769852Abstract: A method of manufacturing a light emitting element according to certain embodiments of the present disclosure includes: scanning and irradiating a first laser light having a first irradiation intensity to a sapphire substrate along predetermined dividing lines collectively in a shape of a tessellation of a plurality of hexagonal shapes in a top view to create a plurality of first modified regions along the predetermined dividing lines; and scanning and irradiating a second laser light having a second irradiation intensity greater than the first irradiation intensity to the sapphire substrate along the predetermined dividing lines to create a plurality of second modified regions overlapping the plurality of first modified regions.Type: GrantFiled: July 31, 2020Date of Patent: September 26, 2023Assignee: NICHIA CORPORATIONInventors: Masayuki Ibaraki, Minoru Yamamoto, Naoto Inoue, Hiroaki Tamemoto
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Patent number: 11713294Abstract: Provided is a method for producing an organic tellurium compound that enables the production of an organic tellurium compound in high yield using metallic tellurium as a source material and produces less amount of side products. A method for producing an organic tellurium compound includes the steps of: (A) reacting metallic tellurium with a compound represented by a general formula (1) below; and (B) reacting a compound obtained by the step (A) with an organic halogen compound, the metallic tellurium having a copper content of less than 100 ppm, M(R1)m ??Formula (1) where R1 represents an alkyl group having 1 to 8 carbon atoms, an aryl group or an aromatic heterocyclic group, M represents an alkali metal or an alkaline earth metal, m represents 1 when M is an alkali metal, and m represents 2 when M is an alkaline earth metal.Type: GrantFiled: November 19, 2019Date of Patent: August 1, 2023Assignee: OTSUKA CHEMICAL CO., LTDInventor: Minoru Yamamoto
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Publication number: 20230138592Abstract: A method for manufacturing a light-emitting element includes preparing a wafer; a laser beam irradiation process; and a separation process. The laser beam irradiation process includes a first irradiation process of forming a plurality of first modified portions, and a second irradiation process of forming a plurality of second modified portions. The second modified portions are formed in the second irradiation process so that a length in a thickness direction of the sapphire substrate of the second modified portions is greater than a length in the thickness direction of the first modified portions.Type: ApplicationFiled: October 12, 2022Publication date: May 4, 2023Applicants: NICHIA CORPORATION, HAMAMATSU PHOTONICS K.K.Inventors: Naoto INOUE, Minoru YAMAMOTO, Taichi OKUBO, Hiroaki TAMEMOTO, Ryota SUGIO, Yusuke SEKIMOTO
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Publication number: 20220371130Abstract: This laser processing apparatus is for forming modified regions in an object, which includes a sapphire substrate having a C-plane as a main surface, along cutting lines by focusing laser light on the object, and is provided with a laser light source, a spatial light modulator, and a focusing optical system. The spatial light modulator performs aberration correction by a first aberration correction amount smaller than an ideal aberration correction amount when the modified region is formed along a first cutting line along an a-axis direction of the sapphire substrate, and performs aberration correction by a second aberration correction amount smaller than the ideal aberration correction amount and different from the first aberration correction amount when the modified region is formed along a second cutting line along an in-axis direction of the sapphire substrate.Type: ApplicationFiled: August 7, 2020Publication date: November 24, 2022Applicants: NICHIA CORPORATION, HAMAMATSU PHOTONICS K.K.Inventors: Hiroaki TAMEMOTO, Minoru YAMAMOTO, Yusuke SEKIMOTO, Ryota SUGIO, Tominori NAKAMURA
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Patent number: 11489086Abstract: A method of manufacturing light emitting elements includes: providing a wafer including a substrate formed of sapphire and having a first main surface and a second main surface, and a semiconductor layered body disposed on the first main surface of the substrate; irradiating a laser beam into the substrate to form a modified region inside the substrate, the modified region having a crack reaching the first main surface and a crack reaching the second main surface; irradiating CO2 laser to a region of the substrate overlapping with a region to which the laser beam has been irradiated; and cleaving the wafer along the modified region to obtain the light emitting elements each having a hexagonal shape in a plan view.Type: GrantFiled: June 22, 2020Date of Patent: November 1, 2022Assignee: NICHIA CORPORATIONInventors: Naoto Inoue, Minoru Yamamoto, Satoshi Okumura, Hiroki Okamoto, Hiroaki Tamemoto
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Publication number: 20220324180Abstract: A method for processing a resin member includes: irradiating a first member comprising a resin with first light of a first wavelength that causes electronic excitation of the resin; and irradiating the resin electronically excited through irradiation with the first light with second light of a second wavelength longer than the first wavelength. A wavelength range of the second wavelength is within a wavelength range in which light absorption of the resin increases through electronic excitation of the resin.Type: ApplicationFiled: June 23, 2022Publication date: October 13, 2022Applicants: Laser Systems Inc., NICHIA CORPORATIONInventors: Yuichi ASAKAWA, Yasuyuki TSUBOI, Hiroaki TAMEMOTO, Ryota TAOKA, Minoru YAMAMOTO
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Patent number: 11289621Abstract: A method includes preparing a wafer including a substrate and a semiconductor structure, and irradiating an inner portion of the substrate at a predetermined depth in a thickness direction a plurality of times with laser pulses at a first time interval and a predetermined distance interval between irradiations. Each irradiation performed at the first time intervals in the step of irradiating the substrate with laser pulses includes irradiating the substrate at a first focal position in the thickness direction with a first laser pulse having a first pulse-energy; and after irradiating with the first laser pulse, irradiating the substrate with a second laser pulse performed after a second time interval, the second time interval being shorter than the first time interval and being in a range of 3 ps to 900 ps, and the second laser pulse having a second pulse-energy 0.5 to 1.5 times the first pulse-energy.Type: GrantFiled: November 26, 2018Date of Patent: March 29, 2022Assignees: NICHIA CORPORATION, IMRA AMERICA, INC.Inventors: Minoru Yamamoto, Naoto Inoue, Hiroaki Tamemoto, Yoshitaka Hotta, Hideyuki Ohtake
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Publication number: 20220009885Abstract: Provided is a method for producing an organic tellurium compound that enables the production of an organic tellurium compound in high yield using metallic tellurium as a source material and produces less amount of side products. A method for producing an organic tellurium compound includes the steps of: (A) reacting metallic tellurium with a compound represented by a general formula (1) below; and (B) reacting a compound obtained by the step (A) with an organic halogen compound, the metallic tellurium having a copper content of less than 100 ppm, M(R1)m ??Formula (1) where R1 represents an alkyl group having 1 to 8 carbon atoms, an aryl group or an aromatic heterocyclic group, M represents an alkali metal or an alkaline earth metal, m represents 1 when M is an alkali metal, and m represents 2 when M is an alkaline earth metal.Type: ApplicationFiled: November 19, 2019Publication date: January 13, 2022Applicant: OTSUKA CHEMICAL CO., LTDInventor: Minoru Yamamoto
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Patent number: 11186588Abstract: The 6H-thieno[2,3-e][1,2,4]triazolo[3,4-c][1,2,4]triazepine derivatives or salts thereof of the present invention have BRD4 inhibitory activity, and thus, they are useful as medicaments, in particular, as prophylaxis and/or therapeutic agents for diseases associated with BRD4.Type: GrantFiled: May 31, 2018Date of Patent: November 30, 2021Assignee: AYUMI PHARMACEUTICAL CORPORATIONInventors: Hiroyuki Aono, Iwao Seki, Miwa Imamura, Tomomi Tanaka, Satoshi Shirae, Kenji Kawashima, Yusuke Yamazaki, Minoru Yamamoto
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Publication number: 20210130367Abstract: The 6H-thieno[2,3-e][1,2,4]triazolo[3,4-c][1,2,4]triazepine derivatives or salts thereof of the present invention have BRD4 inhibitory activity, and thus, they are useful as medicaments, in particular, as prophylaxis and/or therapeutic agents for diseases associated with BRD4.Type: ApplicationFiled: May 31, 2018Publication date: May 6, 2021Applicant: AYUMI PHARMACEUTICAL CORPORATIONInventors: Hiroyuki AONO, Iwao SEKI, Miwa IMAMURA, Tomomi TANAKA, Satoshi SHIRAE, Kenji KAWASHIMA, Yusuke YAMAZAKI, Minoru YAMAMOTO
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Publication number: 20210036182Abstract: A method of manufacturing a light emitting element according to certain embodiments of the present disclosure includes: scanning and irradiating a first laser light having a first irradiation intensity to a sapphire substrate along predetermined dividing lines collectively in a shape of a tessellation of a plurality of hexagonal shapes in a top view to create a plurality of first modified regions along the predetermined dividing lines; and scanning and irradiating a second laser light having a second irradiation intensity greater than the first irradiation intensity to the sapphire substrate along the predetermined dividing lines to create a plurality of second modified regions overlapping the plurality of first modified regions.Type: ApplicationFiled: July 31, 2020Publication date: February 4, 2021Applicant: NICHIA CORPORATIONInventors: Masayuki IBARAKI, Minoru YAMAMOTO, Naoto INOUE, Hiroaki TAMEMOTO