Abstract: A method of manufacturing light emitting elements includes: providing a wafer including a substrate formed of sapphire and having a first main surface and a second main surface, and a semiconductor layered body disposed on the first main surface of the substrate; irradiating a laser beam into the substrate to form a modified region inside the substrate, the modified region having a crack reaching the first main surface and a crack reaching the second main surface; irradiating CO2 laser to a region of the substrate overlapping with a region to which the laser beam has been irradiated; and cleaving the wafer along the modified region to obtain the light emitting elements each having a hexagonal shape in a plan view.

Abstract: A method includes preparing a wafer including a substrate and a semiconductor structure, and irradiating an inner portion of the substrate at a predetermined depth in a thickness direction a plurality of times with laser pulses at a first time interval and a predetermined distance interval between irradiations. Each irradiation performed at the first time intervals in the step of irradiating the substrate with laser pulses includes irradiating the substrate at a first focal position in the thickness direction with a first laser pulse having a first pulse-energy; and after irradiating with the first laser pulse, irradiating the substrate with a second laser pulse performed after a second time interval, the second time interval being shorter than the first time interval and being in a range of 3 ps to 900 ps, and the second laser pulse having a second pulse-energy 0.5 to 1.5 times the first pulse-energy.

Abstract: Provided are a method for producing a multibranched polymer that can produce a multibranched polymer having a narrow molecular weight distribution in a one-pot procedure and the multibranched polymer. A method for producing a multibranched polymer includes the step of polymerizing a first vinyl monomer having a polymerization-initiating group in an ?-position of a vinyl bond and a second vinyl monomer free of polymerization-initiating group in an ?-position of a vinyl bond by a living radical polymerization.

Abstract: The electronic device manufacturing apparatus includes a cable holding tool, a work stage, a robot section, a first position detector, a second position detector, and a controller. The first position detector detects positions in a two-dimensional plane direction of the cable held by the cable holding tool and the connector of the electronic device held by the work stage. The second position detector detects positions in a height direction of the cable held by the cable holding tool and the connector of the electronic device held by the work stage. The controller controls the robot section based on the detection result of the first position detector and the second position detector.

Abstract: An electronic equipment assembly apparatus includes a cable holding tool, a work stage, and a robot unit. The cable holding tool holds the cable. The work stage holds the electronic equipment. The robot unit relatively moves the cable holding tool with respect to the electronic equipment held by the work stage. The cable holding tool includes a contactor and a width direction regulator. The contactor holds the cable by vacuum-sucking. The width direction regulator regulates a position in a width direction of the cable which comes into contact with the contactor.

Abstract: The electronic device manufacturing apparatus includes a cable holding tool, a work stage, a robot section, a first position detector, a second position detector, and a controller. The first position detector detects positions in a two-dimensional plane direction of the cable held by the cable holding tool and the connector of the electronic device held by the work stage. The second position detector detects positions in a height direction of the cable held by the cable holding tool and the connector of the electronic device held by the work stage. The controller controls the robot section based on the detection result of the first position detector and the second position detector.

Abstract: A board insertion device includes a holder; and an insertion guider which is slidably provided in the holder in an insertion direction of the board into the connector and includes a distal end portion protruding in the insertion direction from a first end surface of the board held in the holder and abutting against the connector during insertion of the board into the connector. Furthermore, the board insertion device includes an abutting portion; and a conversion mechanism converting a change of a relative position between the holder and the insertion guider into a movement of the abutting portion for changing a position of the ejector from a closed position to an open position. in which the conversion mechanism is provided in the insertion guider and engaged with the holder or is provided in the holder and engaged with the insertion guider.

Abstract: According to one embodiment, a magnetic disk device including a disk, a head configured to write data to the disk, a buffer memory configured to temporarily hold data to be written to the disk, a recorder configured to temporarily hold data to be input from the buffer memory, and a controller configured to transfer first data from the buffer memory to the recorder and to transfer second data corresponding to the first data from the recorder.

Abstract: A method of manufacturing a semiconductor element includes: providing a wafer having a semiconductor layered body on a sapphire substrate; irradiating a laser light in an interior region of the sapphire substrate to create cracks in the sapphire substrate by performing a first scan to irradiate the laser light at a first depth with a first pulse energy to create a first modified region, and a second scan following the first scan to irradiate the laser light at a second depth with a second pulse energy greater than the first pulse energy along and within the first modified region; and dividing the wafer by extending the cracks to obtain a semiconductor element.

Abstract: According to one embodiment, a magnetic disk device including a disk, a head configured to write data to the disk, a buffer memory configured to temporarily hold data to be written to the disk, a recorder configured to temporarily hold data to be input from the buffer memory, and a controller configured to transfer first data from the buffer memory to the recorder and to transfer second data corresponding to the first data from the recorder.

Abstract: A working apparatus includes a component holder that holds a component and mounts the component at a predetermined position of a work. In the working apparatus, the component holder that holds a component is configured to include a pair of grip members that pinch and grip the component, a grip member opening/closing portion that opens and closes the pair of grip members with an opening/closing motor as a drive source, a pair of contact portions that are disposed on the pair of grip members and freely rotate around a rotary shaft provided in an opening/closing direction of the grip member, and a contact portion driving portion that causes a roller, which is provided to be in contact with a side of a nozzle shaft, to convert a lifting and lowering motion of a nozzle shaft into a rotational motion of a spline shaft, and that causes the rotational motion to be transmitted to the contact portion via a plurality of rollers such that the contact portion rotates around the rotary shaft.

Abstract: Provided are a method for producing a multibranched polymer that can produce a multibranched polymer having a narrow molecular weight distribution in a one-pot procedure and the multibranched polymer. A method for producing a multibranched polymer includes the step of polymerizing a first vinyl monomer having a polymerization-initiating group in an ?-position of a vinyl bond and a second vinyl monomer free of polymerization-initiating group in an ?-position of a vinyl bond by a living radical polymerization.

Abstract: A method of manufacturing a semiconductor element includes: providing a wafer having a semiconductor layered body on a sapphire substrate; irradiating a laser light in an interior region of the sapphire substrate to create cracks in the sapphire substrate by performing a first scan to irradiate the laser light at a first depth with a first pulse energy to create a first modified region, and a second scan following the first scan to irradiate the laser light at a second depth with a second pulse energy greater than the first pulse energy along and within the first modified region; and dividing the wafer by extending the cracks to obtain a semiconductor element.

Abstract: The electronic device manufacturing apparatus includes a cable holding tool, a work stage, a robot section, a first position detector, a second position detector, and a controller. The first position detector detects positions in a two-dimensional plane direction of the cable held by the cable holding tool and the connector of the electronic device held by the work stage. The second position detector detects positions in a height direction of the cable held by the cable holding tool and the connector of the electronic device held by the work stage. The controller controls the robot section based on the detection result of the first position detector and the second position detector.

Abstract: An electronic equipment assembly apparatus includes a cable holding tool, a work stage, and a robot unit. The cable holding tool holds the cable. The work stage holds the electronic equipment. The robot unit relatively moves the cable holding tool with respect to the electronic equipment held by the work stage. The cable holding tool includes a contactor and a width direction regulator. The contactor holds the cable by vacuum-sucking. The width direction regulator regulates a position in a width direction of the cable which comes into contact with the contactor.

Abstract: A board insertion device includes a holder; and an insertion guider which is slidably provided in the holder in an insertion direction of the board into the connector and includes a distal end portion protruding in the insertion direction from a first end surface of the board held in the holder and abutting against the connector during insertion of the board into the connector. Furthermore, the board insertion device includes an abutting portion; and a conversion mechanism converting a change of a relative position between the holder and the insertion guider into a movement of the abutting portion for changing a position of the ejector from a closed position to an open position. in which the conversion mechanism is provided in the insertion guider and engaged with the holder or is provided in the holder and engaged with the insertion guider.

Abstract: A working apparatus includes a component holder that holds a component and mounts the component at a predetermined position of a work. In the working apparatus, the component holder that holds a component is configured to include a pair of grip members that pinch and grip the component, a grip member opening/closing portion that opens and closes the pair of grip members with an opening/closing motor as a drive source, a pair of contact portions that are disposed on the pair of grip members and freely rotate around a rotary shaft provided in an opening/closing direction of the grip member, and a contact portion driving portion that causes a roller, which is provided to be in contact with a side of a nozzle shaft, to convert a lifting and lowering motion of a nozzle shaft into a rotational motion of a spline shaft, and that causes the rotational motion to be transmitted to the contact portion via a plurality of rollers such that the contact portion rotates around the rotary shaft.

Abstract: According to one embodiment, there is provided a disk device including a disk to store data and a controller to control writing data to the disk and reading data from the disk. The controller queues a command from a host device, executes a first command included in the queued command, and executes reordering processing to a plurality of commands which accesses a vicinity of a physical position of an access destination of the first command.

Abstract: According to one aspect, a non-transitory computer-readable recording medium stores therein a log acquisition program causing a computer to execute a process. The process includes receiving information for designating multiple functions of an application for which logs are to be acquired and designating a log detail level with respect to each of the multiple functions; and acquiring a log of the application with a corresponding log detail level with respect to each of the multiple functions designated.

Abstract: According to one embodiment, a storage device is provided which includes a control unit configured to, in case that first data coincides with third data out of second data of a second size greater than the first size stored on a storage medium, do not write fourth data obtained by replacing the third data included in the second data with the first data onto the storage medium.