Abstract: A printhead integrated circuit comprises a substrate having drive circuitry and a plurality of nozzle assemblies positioned on the substrate. Each nozzle assembly has a moving portion moveable relative to a stationary portion for ejection of ink. The printhead integrated circuit is covered with a polymeric layer. The polymeric layer covers a gap defined between each moving portion and each stationary portion.

Abstract: A printhead integrated circuit includes: a substrate comprising drive circuitry; a ceramic nozzle plate spaced apart from the substrate, the nozzle plate having a plurality of nozzle openings and a plurality of moveable portions defined therein; an active beam disposed on each moveable portion of the nozzle plate, such that each moveable portion is moveable towards the substrate when a current from the drive circuitry is passed through a respective active beam; and a polymer layer coating the nozzle plate and the active beams, wherein the polymer layer is comprised of a polymerized siloxane.

Abstract: A thermal bend actuator comprises an active beam for connection to drive circuitry and a passive beam mechanically cooperating with the active beam. When a current is passed through the active beam, the active beam expands relative to the passive beam resulting in bending of the actuator. The passive beam is comprised of first and second layers, and the second layer is sandwiched between the first layer and the active beam. The second layer is relatively more thermally insulating than the first layer.

Abstract: A method of fabricating a printhead having a hydrophobic ink ejection face is provided. The method comprises the steps of: (a) providing a partially-fabricated printhead comprising a plurality of nozzle chambers and a relatively hydrophilic nozzle surface, the nozzle surface at least partially defining the ink ejection face; (b) depositing a layer of relatively hydrophobic polymeric material onto the nozzle surface, the polymeric material being resistant to removal by ashing; and (c) defining a plurality of nozzle openings in the nozzle surface, thereby providing a printhead having a relatively hydrophobic ink ejection face. Steps (b) and (c) may be performed in any order.

Abstract: A MEMS integrated circuit comprises: a silicon substrate having a passivated CMOS layer, a MEMS layer disposed on the passivated CMOS layer, and a polymer layer disposed on the MEMS layer. The CMOS layer comprises drive circuitry for actuating actuator devices in the MEMS layer and the polymer layer comprises a polymerized siloxane.

Abstract: A wafer assembly comprises a wafer having a MEMS layer formed on a frontside and a polymer coating covering the MEMS layer. A holding means is releasably attached to the polymer coating so that the wafer assembly facilitates performance of backside operations on a backside of the wafer. The polymer coating is comprised of a polymerized siloxane.

Abstract: A printhead having a hydrophobic ink ejection face is provided. At least part of the ink ejection face is coated with a hydrophobic polymeric material selected from the group comprising: polymerized siloxanes and fluorinated polyolefins.

Abstract: A thermal bend actuator comprises an active beam for connection to drive circuitry and a passive beam mechanically cooperating with the active beam. When a current is passed through the active beam, the active beam expands relative to the passive beam resulting in bending of the actuator. The passive beam is comprised of first and second layers, and the second layer is sandwiched between the first layer and the active beam. The second layer is relatively more thermally insulating than the first layer.

Abstract: A thermal bend actuator, having a plurality of elements, is provided. The actuator comprises a first active element for connection to drive circuitry and a second passive element mechanically cooperating with the first element. When a current is passed through the first element, the first element expands relative to the second element, resulting in bending of the actuator. One of the plurality of elements is comprised of a porous material.

Abstract: A method of actuating a thermal bend actuator having an active beam fused to a passive beam. The method comprises passing an electrical current through the active beam so as to cause thermoelastic expansion of the active beam relative to the passive beam and bending of the actuator. The current is delivered in an actuation pulse having a pulse width of less than 0.2 microseconds.

Abstract: A printhead integrated circuit comprises a substrate having drive circuitry and a plurality of nozzle assemblies positioned on the substrate. Each nozzle assembly has a moving portion moveable relative to a stationary portion for ejection of ink. The printhead integrated circuit is covered with a polymeric layer. The polymeric layer covers a gap defined between each moving portion and each stationary portion.

Abstract: A thermal bend actuator comprising: (a) a pair of electrical contacts positioned at one end of the actuator; (b) an active beam connected to the electrical contacts and extending longitudinally away from the contacts, the active beam defining a bent current flow path between the contacts; and (c) a passive beam fused to the active beam. When a current is passed through the active beam, the active beam heats and expands relative to the passive beam, resulting in bending of the actuator. The active beam comprises a resistive heating bar having a relatively smaller cross-sectional area than any other part of the current flow path. Heating of the active beam is concentrated in the heating bar.

Abstract: A method of fabricating a plurality of MEMS integrated circuits from a wafer having a MEMS layer formed on a frontside thereof and a polymer coating over said MEMS layer, said polymer coating having a plurality of frontside dicing streets defined therethrough, said method comprising the steps of: (a) releasably attaching a first holding means to said polymer coating; and (b) performing at least one operation on a backside of the wafer, said at least one operation including etching a plurality of backside dicing streets through the wafer, each backside dicing street meeting with a respective frontside dicing street, thereby providing the plurality of MEMS integrated circuits releasably attached to said first holding means, wherein each MEMS integrated circuit comprises a respective polymer coating.

Abstract: An inkjet printhead comprising a plurality of nozzle assemblies is provided. Each nozzle assembly has a moving portion for ejection of ink. The printhead includes a seal membrane joining the moving portions to the printhead.

Abstract: A method of fabricating a printhead having a hydrophobic ink ejection face, the method comprising the steps of: (a) providing a partially-fabricated printhead comprising a plurality of nozzle chambers and a nozzle plate having relatively hydrophilic nozzle surface, the nozzle surface at least partially defining the ink ejection face of the printhead; (b) defining a plurality of nozzle openings in the nozzle plate; (c) depositing a hydrophobic polymeric layer onto the nozzle surface; (d) depositing a protective metal film onto the polymeric layer; (e) subjecting the printhead to an oxidizing plasma; and (f) removing the protective metal film, thereby providing a printhead having a relatively hydrophobic ink ejection face. Step (b) may be performed immediately after any of steps (a), (c) or (d).

Abstract: A method of fabricating a plurality of MEMS integrated circuits from a wafer having a MEMS layer formed on a frontside thereof and a polymer coating over said MEMS layer, said polymer coating having a plurality of frontside dicing streets defined therethrough, said method comprising the steps of: (a) releasably attaching a first holding means to said polymer coating; and (b) performing at least one operation on a backside of the wafer, said at least one operation including etching a plurality of backside dicing streets through the wafer, each backside dicing street meeting with a respective frontside dicing street, thereby providing the plurality of MEMS integrated circuits releasably attached to said first holding means, wherein each MEMS integrated circuit comprises a respective polymer coating.

Abstract: An inkjet printhead comprising a plurality of nozzle assemblies is provided. Each nozzle assembly has a moving portion for ejection of ink. The printhead includes a seal membrane joining the moving portions to the printhead.

Abstract: A printhead having a hydrophobic ink ejection face is provided. At least part of the ink ejection face is coated with a hydrophobic polymeric material selected from the group comprising: polymerized siloxanes and fluorinated polyolefins.

Abstract: A nozzle assembly for an inkjet printhead is provided. The nozzle assembly comprises a nozzle chamber having a roof, the roof having a moving portion moveable relative to a static portion and a nozzle opening defined in the roof, such that movement of the moving portion relative to the static portion causes ejection of ink through the nozzle opening. The nozzle assembly also comprises an actuator for moving the moving portion relative to the static portion, and a mechanical seal interconnecting the moving portion and the static portion. The mechanical seal comprises a polymeric material selected from the group comprising: polymerized siloxanes and fluorinated polyolefins.

Abstract: A method of fabricating a printhead having a hydrophobic ink ejection face is provided. The method comprises the steps of: (a) providing a partially-fabricated printhead comprising a plurality of nozzle chambers and a relatively hydrophilic nozzle surface, the nozzle surface at least partially defining the ink ejection face; (b) depositing a layer of relatively hydrophobic polymeric material onto the nozzle surface, the polymeric material being resistant to removal by ashing; and (c) defining a plurality of nozzle openings in the nozzle surface, thereby providing a printhead having a relatively hydrophobic ink ejection face. Steps (b) and (c) may be performed in any order.