Abstract: A polymer including, as the main chain, a metal-oxygen-metal bond including a structural unit represented by the following general formula (1): wherein M represents a metal atom selected from the group consisting of Al, Sc, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Ga, Ge, Y, Zr, Nb, Mo, In, Sn, Sb, Hf, Ta, W, and Bi; R1 is selected from a hydrogen atom, a C1-C8 alkyl group, a C1-C8 alkylcarbonyl group, a C6-C12 aryl group, a C7-C13 aralkyl group, a (R53Si-group, a (R6R7N—) group, a 4-oxopent-2-en-2-yl group, a C5-C12 4-alkoxy-4-oxobuta-2-en-2-yl group, and a C10-C16 4-aryloxy-4-oxobuta-2-en-2-yl group; R2 and R3 are each independently a hydrogen atom or a C1-C8 alkyl group; R4 is a hydrogen atom, a C1-C8 alkyl group, or a C1-C8 alkylcarbonyl group; R5 is a hydroxy group, a C1-C8 alkyl group, a C5-C12 alicyclic alkyl group, a C1-C12 alkoxy group, a C6-C12 aryl group, a C7-C13 aralkyl group, or a group having a siloxane bond; a plurality of R5 may be the same or different; R6 and R7 are each independently a hydrogen

Abstract: A polymetalloxane including structural units represented by formulae (1-1) and (1-2), and having a weight-average molecular weight of 30,000 or more and 2,000,000 or less; wherein, M1 and M2 independently represent different metal atoms; L1 and L2 are each independently a group selected from the group consisting of an allyloxy group, an aryloxy group, and a trialkylsiloxy group; L1 and L2 may be the same or different, and at least one thereof is an allyloxy group or an aryloxy group; R1 and R2 are each independently a hydrogen atom, a C1-12 alkyl group, or a group having a metalloxane bond; m is an integer that represents the valence of the metal atom M1, and a is an integer of 1 to (m?2); and n is an integer that represents the valence of the metal atom M2, and b is an integer of 1 to (n?2).

Abstract: Disclosed is a polymetalloxane including a constituent unit represented by the following general formula (1), which stably exists in a transparent and uniform state in a solution and can form a homogeneous cured film: wherein R1 is an organic group and at least one of R1 is an (R33SiO—) group, R3 is optionally selected from specific groups, R2 is optionally selected from specific groups, when plural R1, R2, and R3 exist, they may be the same or different, M represents a specific metal atom, m is an integer indicating a valence of a metal atom M, and a is an integer of 1 to (m?2).

Abstract: A composition including: (A) a polymetalloxane having a repeating structure of a metal atom selected from the group consisting of Al, Sc, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Ga, Ge, Y, Zr, Nb, Mo, In, Sn, Sb, Hf, Ta, W, and Bi and an oxygen atom; and (B) an aromatic polyfunctional amine compound.

Abstract: The present invention provides a positive photosensitive resin composition having high light transmittance, high heat resistance, and excellent pattern processability. The present invention provides a positive photosensitive resin composition containing polysiloxane (A), a naphthoquinonediazide compound (B), and a solvent (C); in which the polysiloxane (A) has at least one structure selected from the following general formulae (1) to (3), and has at least one structure selected from the following general formulae (4) to (6); in which, in the general formulae (1) to (3), R4 represents a C2-C6 hydrocarbon group having an unsaturated double bond; R1 represents a single bond or a C1-C4 alkylene group; R2 in the general formula (2) represents a hydrogen atom or a C1-C4 alkyl group; and R3 in the general formula (3) represents an organic group; in which R2 in general formula (5) represents a hydrogen atom or a C1-C4 alkyl group; and R3 in the general formula (6) represents an organic group.

Abstract: The present invention provides a resin film that is less likely to suffer peeling or creasing of a layer formed on the resin film in a high temperature process for producing a device and that can be used suitably to produce a product that requires transparency, where the resin film comprises a resin that has a repeating unit as represented by the chemical formula (1) and has a light transmittance of 68% or more at a wavelength of 400 nm, a glass transition temperature of 370° C. or more, and a weight loss starting temperature of 440° C. or more, where in the chemical formula (1), A denotes a tetravalent tetracarboxylic acid residue containing 2 or more carbon atoms and B denotes a divalent diamine residue containing 2 or more carbon atoms.

Abstract: A method of producing an inorganic solid pattern is described that includes: a step of coating an inorganic solid with a composition containing a polymetalloxane and an organic solvent; a step of heating the coating film obtained in the coating step, at a temperature of 100° C. or more and 1000° C. or less to form a heat-treated film; a step of forming a pattern of the heat-treated film; and a step of patterning the inorganic solid by etching using the pattern of the heat-treated film as a mask.

Abstract: A photosensitive resin composition includes a siloxane resin (A), particles (B) having a median diameter of 0.2 to 0.6 ?m, and a naphthoquinone diazide compound (C), wherein the siloxane resin (A) contains at least 20 to 60 mol % in total of a repeating unit represented by general formula (1): wherein R1 represents an aryl group having 6 to 18 carbon atoms or an aryl group having 6 to 18 carbon atoms in which all or part of hydrogen is substituted.

Abstract: A photosensitive resin composition includes electrically conductive particles (A) whose surfaces are coated with a carbon simple substance and/or a carbon compound; an alkali-soluble resin (B) containing an acid-dissociation group; and a metal chelate compound (C) wherein the metal chelate compound (C) includes at least one selected from the group consisting of Au, Ag, Cu, Cr, Fe, Co, Ni, Bi, Pb, Zn, Pd, Pt, Al, Ti, Zr, W and Mo.

Abstract: Provided is a siloxane resin composition having excellent adhesion and fine patterning properties. The siloxane resin composition contains: a siloxane resin (A) including a structure represented by general formula (1), a structure represented by general formula (2), and a structure represented by general formula (3); a compound (B) having an unsaturated double bond; a photopolymerization initiator (C); and a solvent (D).

Abstract: A polymetalloxane is described having a constituent unit represented by the following general formula (1): wherein R1, R2, R3, M a, b and m are as defined.

Abstract: A photosensitive resin composition contains (A) an ethylenically unsaturated group- and carboxyl group-containing photoreactive resin, (B) an epoxy compound, (C) a polyfunctional epoxy compound, and (D) a photopolymerization initiator.

Abstract: The present invention provides a positive photosensitive resin composition having high light transmittance, high heat resistance, and excellent pattern processability. The present invention provides a positive photosensitive resin composition containing polysiloxane (A), a naphthoquinonediazide compound (B), and a solvent (C); in which the polysiloxane (A) has at least one structure selected from the following general formulae (1) to (3), and has at least one structure selected from the following general formulae (4) to (6); in which, in the general formulae (1) to (3), R4 represents a C2-C6 hydrocarbon group having an unsaturated double bond; R1 represents a single bond or a C1-C4 alkylene group; R2 in the general formula (2) represents a hydrogen atom or a C1-C4 alkyl group; and R3 in the general formula (3) represents an organic group; in which R2 in general formula (5) represents a hydrogen atom or a C1-C4 alkyl group; and R3 in the general formula (6) represents an organic group.

Abstract: A method of producing a metal oxide fiber is described, including a spinning step of spinning a composition containing a polymetalloxane and an organic solvent to obtain a thread-like product; and a firing step of firing the thread-like product obtained in the spinning step at a temperature of 200° C. or higher and 2,000° C. or lower to obtain a metal oxide fiber, where the polymetalloxane has a repeating structure composed of a metal atom selected from the group consisting of Al, Sc, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Ga, Ge, Y, Zr, Nb, Mo, Pd, Ag, In, Sn, Sb, Hf, Ta, W and Bi, and an oxygen atom and where the weight average molecular weight of the polymetalloxane is 20,000 or more and 2,000,000 or less.

Abstract: Provided is a siloxane resin composition having excellent adhesion and fine patterning properties. The siloxane resin composition contains: a siloxane resin (A) including a structure represented by general formula (1), a structure represented by general formula (2), and a structure represented by general formula (3); a compound (B) having an unsaturated double bond; a photopolymerization initiator (C); and a solvent (D).

Abstract: The present invention is aimed at providing a laminated base material capable of conveniently attaining the enhancement in lightness of a decorating layer without requiring a thickened film thickness and an increased number of complicated steps. The present invention provides a laminated base material including a substrate (A), and a layer (B) and a layer (C) sequentially laminated on a surface of the substrate (A), wherein a refractive index nA of the substrate (A) and a refractive index nB of the layer (B) satisfy the relationship of 0.6?nA?nB?0.1, and the layer (C) contains a pigment.

Abstract: Provided is a resin composition which contains a UV absorbent having high solubility in solvents, and imparts superior UV-cut performance and transparency, and good weather resistance, even when being formed as a thin film. The resin composition contains a UV absorbent (a) and a resin (b), wherein the UV absorbent (a) contains at least two compounds, i.e., a compound (a-1) having a global absorption maximum at less than 340 nm, and a compound (a-2) having a global absorption maximum at 340-380 nm, and the total content of (a-1) and (a-2) is 10-30 mass % of the total solid content.

Abstract: Provided is a substrate whereby diffusion of light toward a backlight can be suppressed and luminance of an image display device can be enhanced. A substrate having, on a transparent substrate, (a) a color conversion light-emitting layer and (b) a light diffusion prevention layer in this order from the transparent substrate side, the refractive index of the light diffusion prevention layer with respect to a wavelength of 550 nm being 1.20-1.35.

Abstract: An object of the present invention is to provide a transparent photosensitive material that is usable as an interlayer insulating film for metal wires, is excellent in migration resistance and substrate adhesiveness under high temperature and high humidity conditions, and is satisfactory in patternability. The photosensitive resin composition of the present invention contains an acrylic polymer (A1) having, in a side chain thereof, a polymerizable group, a cardo based resin (A2) having a polymerizable group and an alkali-soluble group, and a photopolymerization initiator (B), and contents of the acrylic polymer (A1) and the cardo based resin (A2) satisfy a weight ratio of 1:10 to 10:1.

Abstract: A photosensitive resin composition includes electrically conductive particles (A) whose surfaces are coated with a carbon simple substance and/or a carbon compound; an alkali-soluble resin (B) containing an acid-dissociation group; and a metal chelate compound (C) wherein the metal chelate compound (C) includes at least one selected from the group consisting of Au, Ag, Cu, Cr, Fe, Co, Ni, Bi, Pb, Zn, Pd, Pt, Al, Ti, Zr, W and Mo.