Abstract: A lower resist (2) is applied on a semiconductor substrate (1). An upper resist (3) is applied on the lower resist (2). A first opening (4) is formed in the upper resist (3) by exposure and development and the lower resist (2) is dissolved with a developer upon the development to form a second opening (5) having a width wider than that of the first opening (4) below the first opening (4) so that a resist pattern (6) in a shape of an eave having an undercut is formed. Baking is performed to thermally shrink the upper resist (3) to bent an eave portion (7) of the upper resist (3) upward. After the baking, a metal film (8) is formed on the resist pattern (6) and on the semiconductor substrate (1) exposed at the second opening (5). The resist pattern (6) and the metal film (8) is removed on the resist pattern (6) and the metal film (8) is left on the semiconductor substrate (1) as an electrode (9).

Abstract: A manufacturing method for semiconductor device comprises the steps of: forming a ridge on the surface of an InP substrate; applying a photoresist to the surface of the InP substrate so as to cover the ridge; exposing through a mask an area of the photoresist covering part of an electrode contact layer at the top of the ridge, to form a resist pattern by development; applying a shrink material so as to cover resist pattern defects occurred when forming the resist pattern; forming a crosslinked portion in the defects to repair them by reacting the shrink material with an acid remaining at the exposed interface of the resist pattern; and removing by etching an electrode contact layer exposed from the resist pattern having the repaired defects after stripping away an unreacted shrink material, thereby to obtain a desired processed shape.

Abstract: A lower resist (2) is applied on a semiconductor substrate (1). An upper resist (3) is applied on the lower resist (2). A first opening (4) is formed in the upper resist (3) by exposure and development and the lower resist (2) is dissolved with a developer upon the development to form a second opening (5) having a width wider than that of the first opening (4) below the first opening (4) so that a resist pattern (6) in a shape of an eave having an undercut is formed. Baking is performed to thermally shrink the upper resist (3) to bent an eave portion (7) of the upper resist (3) upward. After the baking, a metal film (8) is formed on the resist pattern (6) and on the semiconductor substrate (1) exposed at the second opening (5). The resist pattern (6) and the metal film (8) is removed on the resist pattern (6) and the metal film (8) is left on the semiconductor substrate (1) as an electrode (9).

Abstract: A solar battery cell, including semiconductor substrate, an insulating film formed on one face side of the semiconductor substrate, and an electrode electrically connected to the one face side of the semiconductor substrate, the electrode being embedded in a groove that is provided on the insulating film and provided so as to protrude from a surface of the insulating film by a same width as the groove.

Abstract: A method for producing a solar battery cell, includes: a first step of forming an insulating film on one face side of a semiconductor substrate; a second step of forming an electrode forming groove in an electrode forming region on the insulating film; a third step of printing an electrode printing paste including metal particles as a main component to a width that covers the electrode forming groove and a region sandwiching the electrode forming groove on the insulating film and that is wider than a width of the electrode forming groove, and then drying the electrode printing paste; and a fourth step of forming an electrode with the width of the electrode forming groove by firing the electrode paste at a temperature that is equal to or higher than a melting point of the metal particles or that is equal to or higher than a eutectic temperature, and accumulating and solidifying the electrode paste on the electrode forming groove.

Abstract: The method includes: steps of forming an n-type diffusion layer having an n-type impurity diffused thereon at a first surface side of a p-type silicon substrate; forming a reflection prevention film on the n-type diffusion layer; forming a back-surface passivation film made of an SiONH film on a second surface of the silicon substrate; forming a paste material containing silver in a front-surface electrode shape on the reflection prevention film; forming a front surface electrode that is contacted to the n-type diffusion layer by sintering the silicon substrate; forming a paste material containing a metal in a back-surface electrode shape on the back-surface passivation film; and forming a back surface electrode by melting a metal in the paste material by irradiating laser light onto a forming position of the back surface electrode and by solidifying the molten metal.

Abstract: A solar battery cell, including semiconductor substrate, an insulating film formed on one face side of the semiconductor substrate, and an electrode electrically connected to the one face side of the semiconductor substrate, the electrode being embedded in a groove that is provided on the insulating film and provided so as to protrude from a surface of the insulating film by a same width as the groove.

Abstract: A solar cell comprises a substrate that includes a photoelectric conversion function, a first electrode provided on one surface of the substrate, a second electrode provided on other surface of the substrate, and a third electrode provided on the other surface of the substrate with its periphery overlapping the second electrode in the in-plane direction of the substrate for extracting an electric power from the second electrode. The thickness of the second electrode is larger than that of the third electrode, and the difference between the thickness of the second electrode and that of the third electrode is within a range from equal to or more than 10 micrometers to equal to or less than 30 micrometers. Thereby, in the solar cell, an electrode separation (alloy separation) can be effectively prevented.

Abstract: A solar cell includes a photoelectric conversion layer, a first electrode on one surface of the photoelectric conversion layer, a second electrode provided on other surface of the photoelectric conversion layer, and a third electrode on the other surface of the photoelectric conversion layer. The third electrode is substantially rectangular with its corners rounded off in the in-plane direction of the photoelectric conversion layer, and overlaps the second electrode at the periphery thereof.

Abstract: A method for producing a solar battery cell, includes: a first step of forming an insulating film on one face side of a semiconductor substrate; a second step of forming an electrode forming groove in an electrode forming region on the insulating film; a third step of printing an electrode printing paste including metal particles as a main component to a width that covers the electrode forming groove and a region sandwiching the electrode forming groove on the insulating film and that is wider than a width of the electrode forming groove, and then drying the electrode printing paste; and a fourth step of forming an electrode with the width of the electrode forming groove by firing the electrode paste at a temperature that is equal to or higher than a melting point of the metal particles or that is equal to or higher than a eutectic temperature, and accumulating and solidifying the electrode paste on the electrode forming groove.

Abstract: The method includes: steps of forming an n-type diffusion layer having an n-type impurity diffused thereon at a first surface side of a p-type silicon substrate; forming a reflection prevention film on the n-type diffusion layer; forming a back-surface passivation film made of an SiONH film on a second surface of the silicon substrate; forming a paste material containing silver in a front-surface electrode shape on the reflection prevention film; forming a front surface electrode that is contacted to the n-type diffusion layer by sintering the silicon substrate; forming a paste material containing a metal in a back-surface electrode shape on the back-surface passivation film; and forming a back surface electrode by melting a metal in the paste material by irradiating laser light onto a forming position of the back surface electrode and by solidifying the molten metal.

Abstract: A solar cell comprises a substrate that includes a photoelectric conversion function, a first electrode provided on one surface of the substrate, a second electrode provided on other surface of the substrate, and a third electrode provided on the other surface of the substrate with its periphery overlapping the second electrode in the in-plane direction of the substrate for extracting an electric power from the second electrode. The thickness of the second electrode is larger than that of the third electrode, and the difference between the thickness of the second electrode and that of the third electrode is within a range from equal to or more than 10 micrometers to equal to or less than 30 micrometers. Thereby, in the solar cell, an electrode separation (alloy separation) can be effectively prevented.

Abstract: A printing stage includes a stage surface having a plurality of suction holes, and fixes an object to be printed on the stage surface by vacuum contact. A printing mask is employed for forming a predetermined electrode pattern on the object to be printed fixed to the printing stage. A squeegee applies a predetermined amount of pressure to a metal paste spread on the printing mask, to print the electrode pattern on the object to be printed. A porous body is provided between the object to be printed and the printing stage.

Abstract: A solar cell includes a photoelectric conversion substrate, a first electrode on one surface of the substrate, a second electrode on the other surface of the substrate, and a third electrode on the other surface of the substrate. The third electrode extracts electric power from the second electrode, and overlaps the second electrode at the periphery in the in-plane direction of the photoelectric conversion substrate. The thickness of the second electrode is larger than that of the third electrode, and the difference between the thickness of the second electrode and that of the third electrode is not less than 10 micrometers and not more than 30 micrometers.

Abstract: A printing mask includes a mask frame and a mesh extended on the mask frame, in which a mask portion is formed by filling the mesh with resin to leave a pattern forming portion in a region corresponding to an electrode pattern to be formed on a printing object. The mask portion has a raised part on a surface of the mesh to be opposed to the printing object. The thickness of the raised part is such that a difference in average film thickness between the end and other parts of the electrode pattern formed with the printing mask is equal to or less than 5 micrometers.

Abstract: A solar cell includes a photoelectric conversion layer, a first electrode on one surface of the photoelectric conversion layer, a second electrode provided on other surface of the photoelectric conversion layer, and a third electrode on the other surface of the photoelectric conversion layer. The third electrode is substantially rectangular with its corners rounded off in the in-plane direction of the photoelectric conversion layer, and overlaps the second electrode at the periphery thereof.

Abstract: A printing stage includes a stage surface having a plurality of suction holes, and fixes an object to be printed on the stage surface by vacuum contact. A printing mask is employed for forming a predetermined electrode pattern on the object to be printed fixed to the printing stage. A squeegee applies a predetermined amount of pressure to a metal paste spread on the printing mask, to print the electrode pattern on the object to be printed. A porous body is provided between the object to be printed and the printing stage.

Abstract: A printing mask includes a mask frame and a mesh extended on the mask frame, in which a mask portion is formed by filling the mesh with resin to leave a pattern forming portion in a region corresponding to an electrode pattern to be formed on a printing object. The mask portion has a raised part on a surface of the mesh to be opposed to the printing object. The thickness of the raised part is such that a difference in average film thickness between the end and other parts of the electrode pattern formed with the printing mask is equal to or less than 5 micrometers.

Abstract: A solar cell includes a photoelectric conversion layer, a first electrode on one surface of the photoelectric conversion layer, a second electrode on other surface of the photoelectric conversion layer, and a third electrode on the other surface of the photoelectric conversion layer. The third electrode is substantially rectangular with its corners rounded off in the in-plane direction of the photoelectric conversion layer, and overlaps the second electrode at the periphery thereof.

Abstract: A solar cell includes a photoelectric conversion substrate, a first electrode on one surface of the substrate, a second electrode on the other surface of the substrate, and a third electrode on the other surface of the substrate. The third electrode extracts electric power from the second electrode, and overlaps the second electrode at the periphery in the in-plane direction of the photoelectric conversion substrate. The thickness of the second electrode is larger than that of the third electrode, and the difference between the thickness of the second electrode and that of the third electrode is not less than 10 micrometers and not more than 30 micrometers.