Abstract: A magnetic head device according to the present invention comprises a head core formed of a magnetic material. The head core includes a sliding portion having a magnetic gap defined therein and adapted to be in sliding contact with a magnetic record medium, and a pair of leg portions formed integrally with the sliding portion. A coil is wound around one of the leg portions of the head core. The head core is held between a pair of holder shells, which each have one end coupled to the sliding portion of the head core and the other end extending toward the other ends of the two leg portions of the head core to be coupled thereto. At least one of the holder shells is formed integrally with a connecting portion which, formed of a magnetic material, constitutes part of the other end of the holder shell, so that the connecting portion and the head core define a closed magnetic path passing through the magnetic gap.

Abstract: For vacuum deposition plating steel strip, a vacuum deposition plating apparatus is used including an inlet-side vacuum sealing device provided in front of a vacuum deposition plating chamber, with an inlet-side inactive gas replacement chamber provided between the inlet-side vacuum sealing device and an annealing furnace. An outlet-side vacuum sealing device is provided at the rear of the vacuum deposition plating chamber, with an outlet-side inactive gas replacement chamber provided between the outlet-side vacuum sealing device and the atmosphere. An inactive gas circulating/purifying device circulates an inactive gas from vacuum chambers of both the vacuum sealing devices to atmospheric pressure chambers of both the vacuum sealing devices and removes water, oil and oxygen from the inactive gas. Oxygen and hydrogen in the inactive gas are regulated to provide 60 ppm or less of oxygen and 0.2 to 2.0% of hydrogen, and also to regulate the dew point of the inactive gas to -50.degree. C. or less.

Abstract: A vacuum deposition plating apparatus having an inlet-side vacuum sealing device provided in front of a vacuum deposition plating chamber, an inlet-side inactive gas replacement chamber provided between the inlet-side vacuum sealing device and an annealing furnace, an outlet-side vacuum sealing device provided in the rear of the vacuum deposition plating chamber, an outlet-side inactive gas replacement chamber provided between the outlet-side vacuum sealing device and the atmosphere, and an inactive gas circulating/purifying device for circulating an inactive gas from vacuum chambers of both the vacuum sealing devices to atmospheric pressure chambers of both the vacuum sealing devices and for removing water, oil and oxygen from the inactive gas; a pressure gauge provided on the annealing furnace; a pressure gauge, a control valve, an automatic valve, a hydrogen concentration detector and a discharge valve provided on the inlet-side inactive gas replacement chamber; a pressure gauge and an automatic valve prov

Abstract: An anode for copper electrolysis is given improved dissolving activity and enhanced ability to curb the phenomenon of passivation by a cooling treatment which is carried out at a cooling speed of from 20.degree. C./hour to 400.degree. C./hour to at least 400.degree. C., preferably to 200.degree. C.