Abstract: An object of the invention is to prevent a human error, greatly reducing man-hours and to securely identify a core. To achieve the object, a request for a serial number is first made via a conductor of a core from a recognition unit that functions as a master to a recognition unit that functions as a slave. Next, the recognition unit as the slave reads a serial number for an IC tag and transmits the serial number via the conductor of the core. The recognition unit as the master receives the serial number transmitted from the recognition unit as the slave and collates the serial number and a serial number stored in an IC tag. It is ascertained by the collation that the conduction of the core is correctly made and it is displayed on a display of the recognition unit as the master and others that no disconnection on the way and no error in selecting an end of wiring are caused.

Abstract: Transmission and reception of the identification number to/from an interrogator includes an interrogator that reads a recognition number from a responder by radio. When a clock pulse is modulated on a high-frequency carrier and transmitted to the responder from the antenna of the interrogator, there are a first case when the clock pulse interval is short and a second case when the clock pulse interval is long. By combining the clock pulse of the first case and the clock pulse of the second case so as to control the read of the recognition number from the interrogator, it is possible to realize reduction of the semiconductor chip size of the responder and suppress the cost of the semiconductor chip.

Abstract: An IC tag inlet (100) is configured by: an upper side antenna (102) and a lower side antenna (103) sandwiching a semiconductor chip (101) that includes an upper electrode (132) and a lower electrode (133) from both upper and lower directions; and a support resin (104) covering the semiconductor chip (101). The semiconductor chip (101) is a micro chip having an outer size of 0.15 mm square or smaller, and a thickness of 10 ?m or smaller. In a manufacturing process of the IC tag inlet (100), in order to make the handling of the semiconductor chip (101) easy, prior to a step of sandwiching the semiconductor chip (101) between the upper side antenna (102) and the lower side antenna (103), the whole surface of the semiconductor chip (101) is covered by the support resin (104), so that an effective volume is made large.

Abstract: An object of the invention is to prevent a human error, greatly reducing man-hours and to securely identify a core. To achieve the object, a request for a serial number is first made via a conductor of a core from a recognition unit that functions as a master to a recognition unit that functions as a slave. Next, the recognition unit as the slave reads a serial number for an IC tag and transmits the serial number via the conductor of the core. The recognition unit as the master receives the serial number transmitted from the recognition unit as the slave and collates the serial number and a serial number stored in an IC tag. It is ascertained by the collation that the conduction of the core is correctly made and it is displayed on a display of the recognition unit as the master and others that no disconnection on the way and no error in selecting an end of wiring are caused.

Abstract: In order to extend the communication distance of an electronic tag chip, it is required to reduce power consumption of the electronic tag chip. After having formed capacitors and diodes on an SOI (Silicon on Insulator), remove a silicon substrate of the SOI. It becomes possible to reduce the capacitors and diodes of the electronic tag chip in parasitic capacitance relative to the ground, which makes it possible to reduce the power consumption of the electronic tag chip, thereby enabling the electronic tag chip to increase in communication distance thereof.

Abstract: A wireless IC tag is provided with a memory circuit including a ROM in which an identification number is written, and a pulse width detection circuit having divided resistors and a capacitor for detecting a signal waveform from a reader. In order to prevent the increase in the number of process steps and photomasks, a resistance value of the pulse width detection circuit is adjusted by an electron beam writing method while utilizing a step of writing an identification number unique to the wireless IC tag into the ROM of the memory circuit.

Abstract: There is a problem related to radio wave interference, e.g. the shade of radio wave of a radio IC tag, when a plurality of radio IC tags are present in a region of electromagnetic wave. When a plurality of antennas each having a large area are present in the vicinity of the radio IC tag, the radio IC tag easily receives the affect of an antenna conductor. In a plurality of radio IC tags present in a radio wave area, width of the antenna conductor of the radio IC tag is set at 1.0 mm or less. Furthermore, in order to realize an antenna conductor having a small width, an IC tag chip of both side electrode structure having electrodes on the front surface and rear surface of a chip is sandwiched between antennas.

Abstract: An electronic device, in which a flat plate semiconductor and dumets connected to surface electrodes on the front and back surfaces of the semiconductor and to lead wires are encapsulated in a glass tube.

Abstract: An issue of reducing a product manufacture unit cost exists in wireless IC chips which are required to be disposable because the wireless IC chips circulate in a massive scale and require a very high collection cost. It is possible to increase the communication distance of a wireless IC chip with an on-chip antenna simply contrived for reduction of the production unit cost by increasing the size of the antenna mounted on a wireless IC chip or by increasing the output power of a reader as in a conventional way. However, because of the circumstances of the applications used and the read accuracy of the reader, the antenna cannot be mounted on a very small chip in an in-chip antenna form. When an AC magnetic field is applied to an on-chip antenna from outside, eddy current is produced in principle because the semiconductor substrate is conductive. It has been fount that the thickness of the substrate can be used as a design parameter because of the eddy current.

Abstract: A reflected electromagnetic wave received, for example, from a wireless identification IC tag through an antenna (105) is processed not by a complicated circuit, but by capacitors (107, 100) and diodes (108, 109). By the combination of the capacitors (107, 100) and the diodes (108, 109), a voltage of the reflected electromagnetic wave is integrated. The reflected electromagnetic wave becomes different in voltage depending on a signal “0” and a signal “1” from the wireless identification IC tag. As a result, since an integrated value outputted to a reception signal line (113) becomes also different, it is possible to discriminate the signal “0” and the signal “1” in the reader for wireless identification IC tag. Since integration is utilized, even a week signal can be discriminated.

Abstract: An IC tag inlet (100) is configured by: an upper side antenna (102) and a lower side antenna (103) sandwiching a semiconductor chip (101) that includes an upper electrode (132) and a lower electrode (133) from both upper and lower directions; and a support resin (104) covering the semiconductor chip (101). The semiconductor chip (101) is a micro chip having an outer size of 0.15 mm square or smaller, and a thickness of 10 ?m or smaller. In a manufacturing process of the IC tag inlet (100), in order to make the handling of the semiconductor chip (101) easy, prior to a step of sandwiching the semiconductor chip (101) between the upper side antenna (102) and the lower side antenna (103), the whole surface of the semiconductor chip (101) is covered by the support resin (104), so that an effective volume is made large.

Abstract: In a method of mounting a planar electronic circuit chip onto a flexible sheet together with another planar electronic element, the electronic circuit part and the another electric element are selected so that the planar surface of the another electric element is greater than the planar surface of the electronic circuit chip, and the another electric element and the electronic circuit chip are mounted on the sheet so that the planar surface of the another electric element and the planar surface of the electronic circuit chip are in parallel with the sheet surface, and the planer surface of the electronic circuit chip is accommodated within the planar surface of the another electric element as viewed in a direction perpendicular to the sheet surface.

Abstract: Transmission and reception of the identification number to/from an interrogator includes an interrogator that reads a recognition number from a responder by radio. When a clock pulse is modulated on a high-frequency carrier and transmitted to the responder from the antenna of the interrogator, there are a first case when the clock pulse interval is short and a second case when the clock pulse interval is long.

Abstract: In order to extend the communication distance of an electronic tag chip, it is required to reduce power consumption of the electronic tag chip. After having formed capacitors and diodes on an SOI (Silicon on Insulator), remove a silicon substrate of the SOI. It becomes possible to reduce the capacitors and diodes of the electronic tag chip in parasitic capacitance relative to the ground, which makes it possible to reduce the power consumption of the electronic tag chip, thereby enabling the electronic tag chip to increase in communication distance thereof.

Abstract: Transmission and reception of the identification number to/from an interrogator includes an interrogator that reads a recognition number from a responder by radio. When a clock pulse is modulated on a high-frequency carrier and transmitted to the responder from the antenna of the interrogator, there are a first case when the clock pulse interval is short and a second case when the clock pulse interval is long. By combining the clock pulse of the first case and the clock pulse of the second case so as to control the read of the recognition number from the interrogator, it is possible to realize reduction of the semiconductor chip size of the responder and suppress the cost of the semiconductor chip.

Abstract: A compact wireless IC tag incorporating a pressure sensor in an IC chip. The IC chip of the wireless IC tag has SOI structure comprising a silicon sheet layer, a silicon device layer which is formed on the upper side of the silicon sheet layer, and a thin silicon oxide layer having about 0.01 ?m to 5 ?m thickness sandwiched between the silicon sheet layer and silicon device layer. In the silicon device layer, a capacitive element of a pressure sensor comprising of a gap, and a first metal wiring and a second metal wiring respectively disposed on the upper and lower sides of the gap, is formed. In the silicon sheet layer on the lower side of the capacitive element, an aperture filled with rubber-like elastic material is formed.

Abstract: The existing IC cards have a disadvantage of difficulty of mass production because an IC chip is supplied on a substrate one at a time. The present invention provides a method of manufacturing by placing a positioning jig having a plurality of openings each of which has a size fit with a semiconductor device, providing a plurality of semiconductor devices on said jig to house the devices into the openings, and fixing on a substrate then cutting the substrate to provide independent electronic devices. When the semiconductor device is in a form of chip, a support member attached to the chip will facilitate the handling of chips.

Abstract: An electronic device includes a semiconductor chip storing an identification number of N-bits and an antenna coupled to the semiconductor chip that sends out the identification number of N-bits. In order to provide a secure and efficient data storage arrangement, the identification number of N-bits is stored in accordance with the presence or absence of through holes that connect wirings to transistors included in the semiconductor chip through an insulating film formed over the transistors.

Abstract: A reader reads electronic tag data and a CRC code from an electronic tag and detects whether the electronic tag data has been received correctly, by using the CRC code. The CRC code is generated from reader data and electronic tag data stored in the reader and an error detection is performed by using the reader data, so that the error detection is performed simultaneously, and it is possible to selectively read out only the electronic tag data from the electronic tag correlated with the reader data.

Abstract: A non-contact identification semiconductor device is provided with a semiconductor chip including a receiving circuit that receives an inquiry to the non-contact identification semiconductor device, a memory that stores identification information of multiple bits and a sending circuit that sends the identification information. An antenna coupled to said semiconductor chip receives the identification information from said semiconductor chip and transmits the identification information outside of said non-contact semiconductor. The long side length of the semiconductor chip is not greater than 0.5 mm in plane dimension, and the identification information is stored by a pattern printed by an electron beam.