Abstract: According to the present invention, a protein having an ability to enhance a selenate reduction activity, a gene encoding it, and a method for selenate reduction using them are provided

Abstract: A cream solder obtained by kneading an Sn—Ag—Cu alloy together with a flux, wherein the Sn—Ag—Cu alloy includes a mixture of a first powdery alloy and a second powdery alloy, the first powdery alloy is represented by an Sn—Ag phase diagram having a solid-liquid coexistence region and has a given silver amount which is larger than that in the eutectic composition (3.5 wt. % silver), and the second powdery alloy has a silver amount which is that in the eutectic composition (3.5 wt. % silver) or which is close to that in the eutectic composition and is smaller than that in the first powdery alloy. This cream solder has excellent strength and thermal stability, and satisfactory bonding properties. It is based on an inexpensive Sn—Ag—Cu solder alloy. It is suitable for use as a high-temperature-side lead-free solder material conformable to temperature gradation bonding. Also provided is a method of soldering.

Abstract: A heat processing apparatus includes a heating plate configured to heat the substrate; a cover configured to surround a space above the heating plate; an exhaust gas flow forming mechanism configured to exhaust gas inside the cover to form exhaust gas flows within the space above the heating plate; a downflow forming mechanism configured to form downflows uniformly supplied onto an upper surface of the substrate placed on the heating plate; and a control mechanism configured to execute mode switching control between a mode arranged to heat the substrate while forming the downflows by the downflow forming mechanism and a mode arranged to heat the substrate while forming the exhaust gas flows by the exhaust gas flow forming mechanism.

Abstract: A heat processing apparatus includes a heating plate configured to heat the substrate; a cover configured to surround a space above the heating plate; an exhaust gas flow forming mechanism configured to exhaust gas inside the cover to form exhaust gas flows within the space above the heating plate; a downflow forming mechanism configured to form downflows uniformly supplied onto an upper surface of the substrate placed on the heating plate; and a control mechanism configured to execute mode switching control between a mode arranged to heat the substrate while forming the downflows by the downflow forming mechanism and a mode arranged to heat the substrate while forming the exhaust gas flows by the exhaust gas flow forming mechanism.

Abstract: A stool includes a seat board, a plurality of legs, and a connecting board. The plurality of legs is attached to the seat board so as to protrude from the seat board in a downward direction, and to support the seat board such that the seat board is horizontally held. The connecting board is disposed such that one surface thereof faces a bottom surface of the seat board. The connecting board is surrounded by and secured to the plurality of legs.

Abstract: According to one embodiment of the invention, there is provided a lead-free solder including an alloy rolled into a shape of sheet. The alloy includes: tin; from 10 wt % to less than 25 wt % of silver; and from 3 wt % to 5 wt % of copper. The alloy is free from lead.

Abstract: The present invention is a coating treatment method of applying a water-soluble coating solution onto a substrate, including: a first step of supplying pure water to a central portion of the substrate in a manner that the pure water does not diffuse over an entire surface of the substrate; a second step of subsequently supplying the water-soluble coating solution to a central portion of the pure water on the substrate to form a mixed layer of the coating solution and the pure water, under the coating solution; and a third step of subsequently diffusing the mixed layer over the substrate to diffuse the coating solution over the entire surface of the substrate.

Abstract: A stool includes a seat board, a plurality of legs, and a connecting board. The plurality of legs is attached to the seat board so as to protrude from the seat board in a downward direction, and to support the seat board such that the seat board is horizontally held. The connecting board is disposed such that one surface thereof faces a bottom surface of the seat board. The connecting board is surrounded by and secured to the plurality of legs.

Abstract: A surface electrode (5) is installed on the light receiving surface of a solar cell element, the surface electrode (5) comprises three bus bar electrodes (5a) for extracting light-produced at the solar cell element to the outside and collecting finger electrodes (5b) connected to these bus bar electrodes (5a), and the bus bar electrodes (5a) are not less than 0.5 mm and not more than 2 mm in width and the finger electrodes (5b) are not less than 0.05 mm and not more than 0.1 mm in width. A high-efficient solar cell module can be obtained with substantially lowered resistance by increasing the number of bus bar electrode (5a) and thereby decreasing the lengths of the finger electrodes (5b).

Abstract: A string-striking device for a piano, where a static loading acting on a fore-end on the playing side of a key can be easily adjusted. A long weight lever (21) is provided on each key (3). The lever (21) is installed along the length direction of the key 3, on an upper part on the side opposite the playing side of the key (3). The installation is made such that one end of the lever (21) is vertically pivotably fixed to a piano body and the vertically displaceable free-end side of the lever is in contact with the upper face of the key (3) by its own weight to apply a load on the key (3). The structure above enables a static load on the key (3) to be adjusted by replacing the lever (21) without disassembling the string-striking device and removing the key (3).

Abstract: A heat processing apparatus includes a heating plate configured to heat the substrate; a cover configured to surround a space above the heating plate; an exhaust gas flow forming mechanism configured to exhaust gas inside the cover to form exhaust gas flows within the space above the heating plate; a downflow forming mechanism configured to form downflows uniformly supplied onto an upper surface of the substrate placed on the heating plate; and a control mechanism configured to execute mode switching control between a mode arranged to heat the substrate while forming the downflows by the downflow forming mechanism and a mode arranged to heat the substrate while forming the exhaust gas flows by the exhaust gas flow forming mechanism.

Abstract: According to one embodiment of the invention, there is provided a lead-free solder including an alloy rolled into a shape of sheet. The alloy includes: tin; from 10 wt % to less than 25 wt % of silver; and from 3 wt % to 5 wt % of copper. The alloy is free from lead.

Abstract: A string-striking device for a piano, where a static loading acting on a fore-end on the playing side of a key can be easily adjusted. A long weight lever (21) is provided on each key (3). The lever (21) is installed along the length direction of the key 3, on an upper part on the side opposite the playing side of the key (3). The installation is made such that one end of the lever (21) is vertically pivotably fixed to a piano body and the vertically displaceable free-end side of the lever is in contact with the upper face of the key (3) by its own weight to apply a load on the key (3). The structure above enables a static load on the key (3) to be adjusted by replacing the lever (21) without disassembling the string-striking device and removing the key (3).

Abstract: The imaging device displays an image under imaging at present and also past images picked up before it on the display means, thus at the time of continuous imaging, even when the next imaging is started immediately after end of imaging, an image after the framing process is displayed, for example, as an image picked up just prior, so that the imaging condition, for example, whether closing of eyes is caused in the image picked up already can be checked. Therefore, the next imaging can be started without waiting for the time required for the framing process after imaging, so that the imaging can be speeded up.

Abstract: A key is provided for permitting simple attachment of a weight and easy adjustment of a touch load, while using an alternative material for substitution for lead as a material for the weight, to thereby reduce the manufacturing cost. A swingable key body is formed with an embedding hole. The weight is made of a composite material produced by blending a plurality of kinds of materials except for lead in a predetermined blending proportion to have a predetermined specific gravity, and is removably attached to the embedding hole of the key body.

Abstract: A novel lead-free Sn—Bi based alloy having an improved wettability in comparison to conventional Sn—Bi based alloys, a melting point lower than 221° C., the eutectic point of an Sn—Ag alloy, and proper bonding and heat-resistant properties is provided. This alloy is an Sn—Bi based alloy containing tin as a major component, and 21 wt.% or less bismuth, 4 wt.% or less silver, 2 wt.% or less copper (inclusive of zero), and 0.2 wt.% or less nickel.

Abstract: The imaging device displays an image under imaging at present and also past images picked up before it on the display means, thus at the time of continuous imaging, even when the next imaging is started immediately after end of imaging, an image after the framing process is displayed, for example, as an image picked up just prior, so that the imaging condition, for example, whether closing of eyes is caused in the image picked up already can be checked. Therefore, the next imaging can be started without waiting for the time required for the framing process after imaging, so that the imaging can be speeded up.