Patents by Inventor Mitsuo Yamashita

Mitsuo Yamashita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20120048338
    Abstract: It is an object of the invention to provide a terminal box for a solar cell module in which a positive terminal and a negative terminal are electrically isolated from each other, an occurrence of a short circuit is reduced, and reliability is enhanced, and a solar cell module including the same. In order to achieve this object, a terminal box for a solar cell module contains terminals configured to derive an output from a solar cell panel to the outside, and includes a container and a lid body covering an aperture of the container. The container includes a first region in which a first terminal configured to connect a first output conductor of the solar cell panel is disposed, a second region in which a second terminal configured to connect a second output conductor of the solar cell panel is disposed, and a partitioning portion provided so as to partition the first region and the second region and including a groove on an aperture surface of the container.
    Type: Application
    Filed: June 9, 2010
    Publication date: March 1, 2012
    Applicant: KYOCERA CORPORATION
    Inventors: Mitsuo Yamashita, Kouki Uchida
  • Publication number: 20120045813
    Abstract: According to the present invention, a protein having an ability to enhance a selenate reduction activity, a gene encoding it, and a method for selenate reduction using them are provided
    Type: Application
    Filed: October 5, 2009
    Publication date: February 23, 2012
    Inventors: Mitsuo Yamashita, Michihiko Ike
  • Publication number: 20120018048
    Abstract: A cream solder obtained by kneading an Sn—Ag—Cu alloy together with a flux, wherein the Sn—Ag—Cu alloy includes a mixture of a first powdery alloy and a second powdery alloy, the first powdery alloy is represented by an Sn—Ag phase diagram having a solid-liquid coexistence region and has a given silver amount which is larger than that in the eutectic composition (3.5 wt. % silver), and the second powdery alloy has a silver amount which is that in the eutectic composition (3.5 wt. % silver) or which is close to that in the eutectic composition and is smaller than that in the first powdery alloy. This cream solder has excellent strength and thermal stability, and satisfactory bonding properties. It is based on an inexpensive Sn—Ag—Cu solder alloy. It is suitable for use as a high-temperature-side lead-free solder material conformable to temperature gradation bonding. Also provided is a method of soldering.
    Type: Application
    Filed: July 3, 2007
    Publication date: January 26, 2012
    Applicants: Nihon Handa Co., Ltd., Fuji Electric Holdings Co., Ltd.
    Inventors: Mitsuo Yamashita, Tomoaki Goto, Takeshi Asagi
  • Publication number: 20110236845
    Abstract: A heat processing apparatus includes a heating plate configured to heat the substrate; a cover configured to surround a space above the heating plate; an exhaust gas flow forming mechanism configured to exhaust gas inside the cover to form exhaust gas flows within the space above the heating plate; a downflow forming mechanism configured to form downflows uniformly supplied onto an upper surface of the substrate placed on the heating plate; and a control mechanism configured to execute mode switching control between a mode arranged to heat the substrate while forming the downflows by the downflow forming mechanism and a mode arranged to heat the substrate while forming the exhaust gas flows by the exhaust gas flow forming mechanism.
    Type: Application
    Filed: June 7, 2011
    Publication date: September 29, 2011
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: Shigeki AOKI, Yuichi Sakai, Mitsuo Yamashita, Hiroshi Shinya
  • Patent number: 7980003
    Abstract: A heat processing apparatus includes a heating plate configured to heat the substrate; a cover configured to surround a space above the heating plate; an exhaust gas flow forming mechanism configured to exhaust gas inside the cover to form exhaust gas flows within the space above the heating plate; a downflow forming mechanism configured to form downflows uniformly supplied onto an upper surface of the substrate placed on the heating plate; and a control mechanism configured to execute mode switching control between a mode arranged to heat the substrate while forming the downflows by the downflow forming mechanism and a mode arranged to heat the substrate while forming the exhaust gas flows by the exhaust gas flow forming mechanism.
    Type: Grant
    Filed: January 18, 2007
    Date of Patent: July 19, 2011
    Assignee: Tokyo Electron Limited
    Inventors: Shigeki Aoki, Yuichi Sakai, Mitsuo Yamashita, Hiroshi Shinya
  • Patent number: 7891306
    Abstract: A stool includes a seat board, a plurality of legs, and a connecting board. The plurality of legs is attached to the seat board so as to protrude from the seat board in a downward direction, and to support the seat board such that the seat board is horizontally held. The connecting board is disposed such that one surface thereof faces a bottom surface of the seat board. The connecting board is surrounded by and secured to the plurality of legs.
    Type: Grant
    Filed: August 28, 2007
    Date of Patent: February 22, 2011
    Assignee: Kabushiki Kaisha Kawai Gakki Seisakusho
    Inventor: Mitsuo Yamashita
  • Publication number: 20090286093
    Abstract: According to one embodiment of the invention, there is provided a lead-free solder including an alloy rolled into a shape of sheet. The alloy includes: tin; from 10 wt % to less than 25 wt % of silver; and from 3 wt % to 5 wt % of copper. The alloy is free from lead.
    Type: Application
    Filed: July 2, 2009
    Publication date: November 19, 2009
    Applicant: FUJI ELECTRIC DEVICE TECHNOLOGY CO., LTD.
    Inventors: Kazuyuki MAKITA, Masaki Ichinose, Taketo Watashima, Masayuki Soutome, Mitsuo Yamashita, Takeshi Asagi, Masatoshi Hirai, Toru Murata
  • Publication number: 20090226621
    Abstract: The present invention is a coating treatment method of applying a water-soluble coating solution onto a substrate, including: a first step of supplying pure water to a central portion of the substrate in a manner that the pure water does not diffuse over an entire surface of the substrate; a second step of subsequently supplying the water-soluble coating solution to a central portion of the pure water on the substrate to form a mixed layer of the coating solution and the pure water, under the coating solution; and a third step of subsequently diffusing the mixed layer over the substrate to diffuse the coating solution over the entire surface of the substrate.
    Type: Application
    Filed: March 2, 2009
    Publication date: September 10, 2009
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: Mitsuo YAMASHITA, Tomohiro ISEKI
  • Publication number: 20080277992
    Abstract: A stool includes a seat board, a plurality of legs, and a connecting board. The plurality of legs is attached to the seat board so as to protrude from the seat board in a downward direction, and to support the seat board such that the seat board is horizontally held. The connecting board is disposed such that one surface thereof faces a bottom surface of the seat board. The connecting board is surrounded by and secured to the plurality of legs.
    Type: Application
    Filed: August 28, 2007
    Publication date: November 13, 2008
    Applicant: KABUSHIKI KAISHA KAWAI GAKKI SEISAKUSHO
    Inventor: Mitsuo YAMASHITA
  • Publication number: 20070295381
    Abstract: A surface electrode (5) is installed on the light receiving surface of a solar cell element, the surface electrode (5) comprises three bus bar electrodes (5a) for extracting light-produced at the solar cell element to the outside and collecting finger electrodes (5b) connected to these bus bar electrodes (5a), and the bus bar electrodes (5a) are not less than 0.5 mm and not more than 2 mm in width and the finger electrodes (5b) are not less than 0.05 mm and not more than 0.1 mm in width. A high-efficient solar cell module can be obtained with substantially lowered resistance by increasing the number of bus bar electrode (5a) and thereby decreasing the lengths of the finger electrodes (5b).
    Type: Application
    Filed: March 29, 2005
    Publication date: December 27, 2007
    Applicant: Kyocera Corporation
    Inventors: Shuichi Fujii, Yosuke Inomata, Tomonari Sakamoto, Koichiro Niira, Yuko Fukawa, Hiroshi Morita, Koji Nishi, Tatsuya Yashi, Mitsuo Yamashita, Kenji Fukui
  • Patent number: 7265283
    Abstract: A string-striking device for a piano, where a static loading acting on a fore-end on the playing side of a key can be easily adjusted. A long weight lever (21) is provided on each key (3). The lever (21) is installed along the length direction of the key 3, on an upper part on the side opposite the playing side of the key (3). The installation is made such that one end of the lever (21) is vertically pivotably fixed to a piano body and the vertically displaceable free-end side of the lever is in contact with the upper face of the key (3) by its own weight to apply a load on the key (3). The structure above enables a static load on the key (3) to be adjusted by replacing the lever (21) without disassembling the string-striking device and removing the key (3).
    Type: Grant
    Filed: June 22, 2004
    Date of Patent: September 4, 2007
    Assignee: Kabushiki Kaisha Kawai Gakki Seisakusho
    Inventors: Muneo Ishida, Mitsuo Yamashita
  • Publication number: 20070169373
    Abstract: A heat processing apparatus includes a heating plate configured to heat the substrate; a cover configured to surround a space above the heating plate; an exhaust gas flow forming mechanism configured to exhaust gas inside the cover to form exhaust gas flows within the space above the heating plate; a downflow forming mechanism configured to form downflows uniformly supplied onto an upper surface of the substrate placed on the heating plate; and a control mechanism configured to execute mode switching control between a mode arranged to heat the substrate while forming the downflows by the downflow forming mechanism and a mode arranged to heat the substrate while forming the exhaust gas flows by the exhaust gas flow forming mechanism.
    Type: Application
    Filed: January 18, 2007
    Publication date: July 26, 2007
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: Shigeki Aoki, Yuichi Sakai, Mitsuo Yamashita, Hiroshi Shinya
  • Publication number: 20070029678
    Abstract: According to one embodiment of the invention, there is provided a lead-free solder including an alloy rolled into a shape of sheet. The alloy includes: tin; from 10 wt % to less than 25 wt % of silver; and from 3 wt % to 5 wt % of copper. The alloy is free from lead.
    Type: Application
    Filed: August 4, 2006
    Publication date: February 8, 2007
    Inventors: Kazuyuki Makita, Masaki Ichinose, Taketo Watashima, Masayuki Soutome, Mitsuo Yamashita, Takeshi Asagi, Masatoshi Hirai, Toru Murata
  • Publication number: 20060169123
    Abstract: A string-striking device for a piano, where a static loading acting on a fore-end on the playing side of a key can be easily adjusted. A long weight lever (21) is provided on each key (3). The lever (21) is installed along the length direction of the key 3, on an upper part on the side opposite the playing side of the key (3). The installation is made such that one end of the lever (21) is vertically pivotably fixed to a piano body and the vertically displaceable free-end side of the lever is in contact with the upper face of the key (3) by its own weight to apply a load on the key (3). The structure above enables a static load on the key (3) to be adjusted by replacing the lever (21) without disassembling the string-striking device and removing the key (3).
    Type: Application
    Filed: June 22, 2004
    Publication date: August 3, 2006
    Inventors: Muneo Ishida, Mitsuo Yamashita
  • Patent number: 7034879
    Abstract: The imaging device displays an image under imaging at present and also past images picked up before it on the display means, thus at the time of continuous imaging, even when the next imaging is started immediately after end of imaging, an image after the framing process is displayed, for example, as an image picked up just prior, so that the imaging condition, for example, whether closing of eyes is caused in the image picked up already can be checked. Therefore, the next imaging can be started without waiting for the time required for the framing process after imaging, so that the imaging can be speeded up.
    Type: Grant
    Filed: September 7, 2001
    Date of Patent: April 25, 2006
    Assignee: Kabushiki Kaisha Toshiba
    Inventor: Mitsuo Yamashita
  • Patent number: 6531651
    Abstract: A key is provided for permitting simple attachment of a weight and easy adjustment of a touch load, while using an alternative material for substitution for lead as a material for the weight, to thereby reduce the manufacturing cost. A swingable key body is formed with an embedding hole. The weight is made of a composite material produced by blending a plurality of kinds of materials except for lead in a predetermined blending proportion to have a predetermined specific gravity, and is removably attached to the embedding hole of the key body.
    Type: Grant
    Filed: May 2, 2001
    Date of Patent: March 11, 2003
    Assignee: Kabushiki Kaisha Kawai Gakki Seisakusho
    Inventors: Makoto Kanemitsu, Mitsuo Yamashita, Hiroyuki Kurita, Masahiko Abiko
  • Patent number: 6365097
    Abstract: A novel lead-free Sn—Bi based alloy having an improved wettability in comparison to conventional Sn—Bi based alloys, a melting point lower than 221° C., the eutectic point of an Sn—Ag alloy, and proper bonding and heat-resistant properties is provided. This alloy is an Sn—Bi based alloy containing tin as a major component, and 21 wt.% or less bismuth, 4 wt.% or less silver, 2 wt.% or less copper (inclusive of zero), and 0.2 wt.% or less nickel.
    Type: Grant
    Filed: January 27, 2000
    Date of Patent: April 2, 2002
    Assignee: Fuji Electric Co., Ltd.
    Inventors: Mitsuo Yamashita, Shinji Tada, Kunio Shiokawa
  • Patent number: D524727
    Type: Grant
    Filed: December 30, 2004
    Date of Patent: July 11, 2006
    Assignee: Kyocera Corporation
    Inventors: Mitsuo Yamashita, Hiroshi Morita, Koji Nishi, Tatsuya Yashiki
  • Patent number: D543501
    Type: Grant
    Filed: May 4, 2006
    Date of Patent: May 29, 2007
    Assignee: Kyocera Corporation
    Inventors: Mitsuo Yamashita, Hiroshi Morita, Koji Nishi, Tatsuya Yashiki
  • Patent number: D543502
    Type: Grant
    Filed: May 4, 2006
    Date of Patent: May 29, 2007
    Assignee: Kyocera Corporation
    Inventors: Mitsuo Yamashita, Hiroshi Morita, Koji Nishi, Tatsuya Yashiki