Abstract: Provided are an opto-electric hybrid board and a manufacturing method therefor. An optical waveguide unit includes protruding portions which are extendingly provided at portions of at least one of an undercladding layer and an overcladding layer, and the protruding portions are located and formed at predetermined locations with respect to a light transmitting surface of a core. An electric circuit unit includes a bent portion having fitting holes into which the protruding portions fit and having an optical element. The fitting holes are located and formed at predetermined locations with respect to the optical element. The optical waveguide unit and the electric circuit unit are coupled to each other in a state in which the protruding portions fit into the fitting holes to form an opto-electric hybrid board.

Abstract: Provided are an opto-electric hybrid board which eliminates the necessity of an aligning operation of a core of an optical waveguide unit and an optical element of an electric circuit unit and which is excellent in mass-productivity, and a manufacturing method therefor. The opto-electric hybrid board includes an optical waveguide unit and an electric circuit unit having an optical element mounted thereon, the electric circuit unit being coupled to the optical waveguide unit. The optical waveguide unit includes fitting holes which are formed in a surface of an overcladding layer and are located and formed at predetermined locations with respect to one end surface of a core. The electric circuit unit includes protruding portions which fit into the fitting holes and are located and formed at predetermined locations with respect to the optical element.

Abstract: Provided are an opto-electric hybrid board which eliminates the necessity of an aligning operation of a core of an optical waveguide unit and an optical element of an electric circuit unit and which is excellent in mass-productivity, and a manufacturing method therefor. The opto-electric hybrid board includes an optical waveguide unit and an electric circuit unit having an optical element mounted thereon, the electric circuit unit being coupled to the optical waveguide unit. The optical waveguide unit includes protruding portions which are extendingly provided at portions of at least one of the undercladding layer and the overcladding layer, and are located and formed at predetermined locations with respect to a light transmitting surface of a core. The electric circuit unit includes fitting holes into which the protruding portions fit, and are located and formed at predetermined locations with respect to the optical element.

Abstract: A printed circuit board includes a base insulating layer, first to third signal lines, a first cover insulating layer and a conductive layer. Wide parts are formed in the first to third signal lines. The first cover insulating layer is provided on the base insulating layer so as to cover the wide parts. The conductive layer is provided on the first cover insulating layer so as to cover a portion above the wide parts.

Abstract: A printed circuit board and method of manufacturing the printed circuit board, including a first and second write wiring patterns, an end of a first line and an end of a second line of the first write wiring pattern are arranged on both sides of a third line of a second write wiring pattern. Circular connection portions are provided at the ends of the first line and the second line. Through holes are formed in portions of a cover insulating layer above the connection portions, respectively. First connecting layers made of copper, for example, are formed to fill the through holes of the cover insulating layer. A substantially rectangular second connecting layer made of copper, for example, is formed to integrally cover upper ends of the connecting layers. This causes the first and second lines to be electrically connected to each other through the first and second connecting layers.

Abstract: A plurality of wiring patterns are formed on a first surface of a base insulating layer, and a ground layer is formed on a second surface opposite to the first surface. A cover insulating layer is then formed on the first surface of the base insulating layer so as to cover the plurality of wiring patterns. Further, a cover insulating layer is formed on the second surface of the base insulating layer so as to cover the ground layer. A high dielectric insulating layer having a dielectric constant of 10 to 30, for example, is then formed on the cover insulating layer.

Abstract: A first insulating layer is formed on a suspension body, and a write wiring trace is formed on the first insulating layer. A second insulating layer is formed on the first insulating layer so as to cover the wiring trace. A ground layer is formed on the second insulating layer so as to be positioned above the wiring trace. Moreover, a third insulating layer is formed on the second insulating layer so as to cover the ground layer. A read wiring trace is formed on the third insulating layer. A fourth insulating layer is formed on the third insulating layer so as to cover the wiring trace.

Abstract: A printed circuit board includes a base insulating layer and a conductor pattern provided on the base insulating layer. The conductor pattern includes a line portion linearly extending along a virtual axis line in a line region, a first bend portion extending along the axis line while being bent in a convex shape toward one side of the base insulating layer in a first bend region, and a second bend portion extending along the axis line while being bent in a convex shape toward the other side of the base insulating layer in a second bend region. The conductor pattern is formed such that the first bend portion and the second bend portion do not overlap with each other in a vertical direction when the printed circuit board is folded along a boundary.

Abstract: A base insulating layer is formed on a suspension body. Read wiring patterns, write wiring patterns and a ground pattern are formed in parallel on the base insulating layer. A first cover insulating layer is formed on the base insulating layer to cover the read wiring patterns, the write wiring patterns and the ground pattern. A ground layer is formed in a region on the first cover insulating layer above the write wiring patterns. A second cover insulating layer is formed on the first cover insulating layer to cover the ground layer.

Abstract: A first insulating layer is formed on a suspension body, and a write wiring trace is formed on the first insulating layer. A second insulating layer is formed on the first insulating layer so as to cover the wiring trace. A write wiring trace is formed, above the write wiring trace, on the second insulating layer. A ground trace is formed on one side of the write wiring trace at a distance on the second insulating layer. A third insulating layer is formed on the second insulating layer so as to cover the wiring trace and the ground trace. An opening is formed in a region, below the write wiring trace, of the suspension body.

Abstract: A printed circuit board and method of manufacturing the printed circuit board, including a first and a second write wiring patterns, an end of a first line and an end of a second line of the first write wiring pattern are arranged on both sides of a third line of the second write wiring pattern. Circular connection portions are provided at the ends of the first line and the second line. In addition, through holes are formed in respective portions of a base insulating layer below the connection portions. Each connection portion comes in contact with a connecting region of a suspension body within the through hole.

Abstract: A plurality of wiring traces and a plurality of lead wires for plating are formed on a base insulating layer. Each wiring trace and each lead wire for plating are integrally formed with each other. An electrode pad is provided at an end of each wiring trace, and the lead wire for plating is provided to extend from each electrode pad toward the opposite side to the wiring trace. A width of each lead wire for plating is set larger than a width of each wiring trace.

Abstract: A base insulating layer is formed on a suspension body. A lead wire for plating and a wiring trace are integrally formed on the base insulating layer. A cover insulating layer is formed on the base insulating layer to cover the lead wire for plating and the wiring trace. A thickness of a portion of the cover insulating layer above a region of the base insulating layer in which the lead wire for plating is formed is set smaller than the thickness of a portion of the cover insulating layer above other regions of the base insulating layer.

Abstract: An FPC board includes a base insulating layer. A plurality of wiring traces are formed on the base insulating layer. The adjacent wiring traces are arranged at a distance d from each other, and each wiring trace has a predetermined width and a thickness t1. Each transmission line pair is constituted by the two adjacent wiring traces of the plurality of wring traces. A ratio of the thickness t1 of the wiring trace to the distance d between the adjacent wiring traces is set to 0.8 or more. A cover insulating layer may be formed on the base insulating layer to cover the wiring traces. A metal layer having a predetermined thickness may be provided on a back surface of the base insulating layer. Furthermore, a differential impedance of each transmission line pair may be set to 100 ?.

Abstract: A plurality of wiring traces are formed on a base insulating layer, and a metal layer is formed on the opposite surface of the base insulating layer. Two adjacent wiring traces constitute a transmission line pair. The width of the wiring trace is set to not more than 250 ?m, and the distance between the adjacent wiring traces is set to not less than 8 ?m. The thickness of the base insulating layer is selected to cause differential impedance of the transmission line pair to be not less than 10? and not more than 50?.

Abstract: A base insulating layer is formed on a suspension body, and write wiring traces and read wiring traces are formed on the base insulating layer. The write wiring trace and the read wiring traces are formed on a body region of the base insulating layer, and the write wiring trace is formed on an auxiliary region of the base insulating layer. The base insulating layer is bent along a bend portion. This causes the write wiring trace to be positioned above the write wiring trace.

Abstract: An end of a first line and an end of a second line of a first write wiring pattern are arranged on both sides of a third line of a second write wiring pattern. Circular connection portions are provided at the ends of the first line and the second line. In addition, through holes are formed in respective portions of a base insulating layer below the connection portions. Each connection portion comes in contact with a connecting region of a suspension body within the through hole.

Abstract: An end of a first line and an end of a second line of a first write wiring pattern are arranged on both sides of a third line of a second write wiring pattern. Circular connection portions are provided at the ends of the first line and the second line. Through holes are formed in portions of a cover insulating layer above the connection portions, respectively. First connecting layers made of copper, for example, are formed to fill the through holes of the cover insulating layer. A substantially rectangular second connecting layer made of copper, for example, is formed to integrally cover upper ends of the connecting layers. This causes the first and second lines to be electrically connected to each other through the first and second connecting layers.

Abstract: The connection structure between wired circuit boards connects a first wired circuit board and a second wired circuit board. The first wired circuit board includes a metal supporting layer, a first insulating layer formed on the metal supporting layer, and a first conductive pattern formed on the first insulating layer and having a first terminal portion. The metal supporting layer is arranged so as not to be opposed to the first terminal portion in a thickness direction. The first terminal portion and the first insulating layer opposed to the first terminal portion in a thickness direction are folded back into a curved shape. The second wired circuit board includes a second insulating layer, and a second conductive pattern formed on the second insulating layer and having a second terminal portion. The first terminal portion and the second terminal portion are electrically connected to each other.

Abstract: A first insulating layer is formed on a suspension body, and a write wiring trace is formed on the first insulating layer. A second insulating layer is formed on the first insulating layer so as to cover the wiring trace. A write wiring trace is formed, above the write wiring trace, on the second insulating layer. A ground trace is formed on one side of the write wiring trace at a distance on the second insulating layer. A third insulating layer is formed on the second insulating layer so as to cover the wiring trace and the ground trace. An opening is formed in a region, below the write wiring trace, of the suspension body.