Abstract: A first insulating layer is formed on a suspension body, and a write wiring trace is formed on the first insulating layer. A second insulating layer is formed on the first insulating layer so as to cover the wiring trace. A ground layer is formed on the second insulating layer so as to be positioned above the wiring trace. Moreover, a third insulating layer is formed on the second insulating layer so as to cover the ground layer. A read wiring trace is formed on the third insulating layer. A fourth insulating layer is formed on the third insulating layer so as to cover the wiring trace.

Abstract: A multi-layer structure including a base insulating layer and a thin metal film layer (seed layer) is prepared. A plating resist layer is formed to have a prescribed pattern on the upper surface of the thin metal film layer. A metal plating layer is formed on the thin metal film layer exposed by electroplating. Then, the plating resist layer is removed, and the thin metal film layer in the region having the plating resist layer is removed. In this way, a conductive pattern including the thin metal film layer and the metal plating layer is formed. The upper surface of the base insulating layer in the region without the conductive pattern is subjected to roughening treatment. A cover insulating layer is formed on the upper surfaces of the base insulating layer and the conductive pattern. In this way, a printed circuit board is completed.

Abstract: A multi-layer structure including a base insulating layer and a thin metal film layer (seed layer) is prepared. A plating resist layer is formed to have a prescribed pattern on the upper surface of the thin metal film layer. A metal plating layer is formed on the thin metal film layer exposed by electroplating. Then, the plating resist layer is removed, and the thin metal film layer in the region having the plating resist layer is removed. In this way, a conductive pattern including the thin metal film layer and the metal plating layer is formed. The upper surface of the base insulating layer in the region without the conductive pattern is subjected to roughening treatment. A cover insulating layer is formed on the upper surfaces of the base insulating layer and the conductive pattern. In this way, a printed circuit board is completed.

Abstract: The connection structure between wired circuit boards connects a first wired circuit board and a second wired circuit board. The first wired circuit board includes a metal supporting layer, a first insulating layer formed on the metal supporting layer, and a first conductive pattern formed on the first insulating layer and having a first terminal portion. The metal supporting layer is arranged so as not to be opposed to the first terminal portion in a thickness direction. The first terminal portion and the first insulating layer opposed to the first terminal portion in a thickness direction are folded back into a curved shape. The second wired circuit board includes a second insulating layer, and a second conductive pattern formed on the second insulating layer and having a second terminal portion. The first terminal portion and the second terminal portion are electrically connected to each other.

Abstract: A ground pattern includes a plurality of integrally formed first to third ground lines. A plurality of first ground lines are arranged parallel to one another at equal intervals. A plurality of second ground lines are arranged parallel to one another at equal intervals between adjacent ones of the first ground lines. A plurality of third ground lines are arranged parallel to one another at equal intervals between adjacent ones of the first ground lines at a predetermined angle with respect to the second ground lines. The third ground lines each connect one end of one adjacent second ground line with the other end of another adjacent second ground line. The ground lines form triangular openings.

Abstract: A printed circuit board includes a base insulating layer and a conductor pattern provided on the base insulating layer. The conductor pattern includes a line portion linearly extending along a virtual axis line in a line region, a first bend portion extending along the axis line while being bent in a convex shape toward one side of the base insulating layer in a first bend region, and a second bend portion extending along the axis line while being bent in a convex shape toward the other side of the base insulating layer in a second bend region. The conductor pattern is formed such that the first bend portion and the second bend portion do not overlap with each other in a vertical direction when the printed circuit board is folded along a boundary.

Abstract: A printed circuit board includes a base insulating layer, first to third signal lines, a first cover insulating layer and a conductive layer. Wide parts are formed in the first to third signal lines. The first cover insulating layer is provided on the base insulating layer so as to cover the wide parts. The conductive layer is provided on the first cover insulating layer so as to cover a portion above the wide parts.

Abstract: A plurality of wiring patterns in a stripe form are formed to be parallel to one another on one surface of a base insulating layer. The wiring patterns each have a layered structure including a conductive layer and a wiring layer. A thin metal film is formed on the other surface of the base insulating layer, and a plurality of ground patterns in a stripe form are formed to be parallel to one another on the thin metal film. The wiring patterns and the ground patterns are provided in a staggered manner so that they are not opposed to one another with the base insulating layer interposed therebetween. In other words, the ground patterns are provided to be opposed to regions between the wiring patterns.

Abstract: A first wiring pattern and a second ground layer are formed on one surface of a base insulating layer, and a second wiring pattern and a first ground layer are formed on the other surface of the base insulating layer. A metal plating layer connecting the first and second wiring patterns to each other is formed in a through hole of the base insulating layer. A cover insulating layer is formed on the other surface of the base insulating layer so as to cover the first ground layer and the second wiring pattern and has a through hole on an area opposite to a part of the first wiring pattern. A high dielectric insulator is formed in the through hole of the cover insulating layer.

Abstract: A plurality of wiring patterns are formed on a first surface of a base insulating layer, and a ground layer is formed on a second surface opposite to the first surface. A cover insulating layer is then formed on the first surface of the base insulating layer so as to cover the plurality of wiring patterns. Further, a cover insulating layer is formed on the second surface of the base insulating layer so as to cover the ground layer. A high dielectric insulating layer having a dielectric constant of 10 to 30, for example, is then formed on the cover insulating layer.

Abstract: A printed circuit board has a bending portion and a non-bending portion. A base insulating layer is provided over the bending portion and the non-bending portion. A plurality of conductor patterns are formed on the insulating layer. A cover insulating layer is formed on the insulating layer to cover the plurality of conductor patterns. A surface region of the plurality of conductor patterns in the bending portion is roughened.

Abstract: A wired circuit board prevents a sealing resin filled in an electronic component mounting portion from overflowing and spreading to a different area other than the electronic component mounting portion. An electronic component placing area is provided in the electronic component mounting portion for the electronic component to be placed and terminals are located within the electronic component placing area and formed to extend continuously with the conductive wires. Also, a groove extending around the electronic component mounting portion to intersect with the conductive wires is formed in the insulating cover layer. Further, protrusions protruding in a direction of the conductive wires being extended in the groove are formed at an intersecting portion thereof with the conductive wires. This can reduce a tendency of the overly filled sealing resin to flow over the groove, thus preventing the spread of the sealing resin from the groove to the outside thereof.

Abstract: A plurality of wiring patterns in a stripe form are formed to be parallel to one another on one surface of a base insulating layer. The wiring patterns each have a layered structure including a conductive layer and a wiring layer. A thin metal film is formed on the other surface of the base insulating layer, and a plurality of ground patterns in a stripe form are formed to be parallel to one another on the thin metal film. The wiring patterns and the ground patterns are provided in a staggered manner so that they are not opposed to one another with the base insulating layer interposed therebetween. In other words, the ground patterns are provided to be opposed to regions between the wiring patterns.

Abstract: A wired circuit board prevents a sealing resin filled in an electronic component mounting portion from overflowing and spreading to a different area other than the electronic component mounting portion. An electronic component placing area is provided in the electronic component mounting portion for the electronic component to be placed and terminals are located within the electronic component placing area and formed to extend continuously with the conductive wires. Also, a groove extending around the electronic component mounting portion to intersect with the conductive wires is formed in the insulating cover layer. Further, protrusions protruding in a direction of the conductive wires being extended in the groove are formed at an intersecting portion thereof with the conductive wires. This can reduce a tendency of the overly filled sealing resin to flow over the groove, thus preventing the spread of the sealing resin from the groove to the outside thereof.

Abstract: A ground wiring layer and a signal wiring layer are formed on a base insulating layer. A cover insulating layer is formed on the base insulating layer with an adhesive layer therebetween to cover the ground wiring layer and the signal wiring layer except for a certain region on the ground wiring layer. An electromagnetic shield layer is formed on the certain region of the ground wiring layer and the cover insulating layer. A resin solution is applied on a release sheet and dried, so that a transfer sheet including the resin layer and the release sheet is formed. Then, the surface of the resin layer is placed on the top surface of the electromagnetic shield layer and these layers are heated and pressurized, so that the transfer sheet is laminated on the electromagnetic shield layer. Thereafter, the release sheet is removed.

Abstract: A ground pattern includes a plurality of integrally formed first to third ground lines. A plurality of first ground lines are arranged parallel to one another at equal intervals. A plurality of second ground lines are arranged parallel to one another at equal intervals between adjacent ones of the first ground lines. A plurality of third ground lines are arranged parallel to one another at equal intervals between adjacent ones of the first ground lines at a predetermined angle with respect to the second ground lines. The third ground lines each connect one end of one adjacent second ground line with the other end of another adjacent second ground line. The ground lines form triangular openings.

Abstract: A multi-layer structure including a base insulating layer and a thin metal film layer (seed layer) is prepared. A plating resist layer is formed to have a prescribed pattern on the upper surface of the thin metal film layer. A metal plating layer is formed on the thin metal film layer exposed by electroplating. Then, the plating resist layer is removed, and the thin metal film layer in the region having the plating resist layer is removed. In this way, a conductive pattern including the thin metal film layer and the metal plating layer is formed. The upper surface of the base insulating layer in the region without the conductive pattern is subjected to roughening treatment. A cover insulating layer is formed on the upper surfaces of the base insulating layer and the conductive pattern. In this way, a printed circuit board is completed.

Abstract: A production method of a wired circuit board can prevent corrosion of a first thin metal film inwardly of a conductor layer, due to the forming of an undercut portion caused by a skirt portion of a plating resist. A first thin metal film is formed on an insulating base layer. A plating resist is formed in a reversal pattern to a wiring circuit pattern on the first thin metal film, and a conductor layer is formed in the wiring circuit pattern on the first thin metal film exposed from the plating resist. Thereafter, the plating resist is removed and, then, a second thin metal film is formed on the conductor layer and first thin metal film. Thereafter, the second thin metal film and then all portions of the first thin metal layer, except portions thereof where the conductor layer is formed, are removed.

Abstract: The present invention provides a method of evaluating the risk of possible caries and the device, system, and program of the same, which is useful for the subjects to keep their mouth conditions best by measuring the chemical properties of saliva samples collected from the mouths of subjects to allow for easy and sanitary evaluation of the risk of possible caries in a short time and to help the subjects accurately recognize their risk of possible caries and closely consult their dentist. In the present invention, saliva from the mouth of subject is collected, a given ratio of acid is added to the saliva, and the chemical property of the saliva is measured to evaluate the risk of possible caries base on the measured value.