Abstract: An electronic component includes an electronic element and an interposer board. The electronic element includes a multilayer body and external electrodes at multilayer body end surfaces of the multilayer body and connected to internal electrode layers. The interposer board includes board end surfaces, board side surfaces orthogonal to the board end surfaces, and board main surfaces orthogonal to the board end surfaces and the board side surfaces. One of the board main surfaces is located in a vicinity of the electronic element and joined with one of the multilayer body main surfaces in a vicinity of the interposer board. The interposer board is an alumina board. The board end surfaces include a metal layer including a Pd-containing layer, and an electrolessly-plated layer on an outer periphery of the Pd-containing layer.

Abstract: An external electrode includes a base electrode layer, a Ni plating layer, and a Sn plating layer. The base electrode layer is provided on an element body portion. The Ni plating layer is provided above the base electrode layer. The Sn plating layer is provided on the Ni plating layer. The base electrode layer includes Ni as a primary component and a dielectric material.

Abstract: A multilayer ceramic capacitor includes an element body portion including dielectric layers and internal electrode layers including Ni, and external electrodes. In each internal electrode layer, a width of an opposing portion is larger than a width of a lead-out portion. The element body portion includes side margin portions extending from both end portions of the opposing portion to first and second side surfaces, through a central portion in a length direction, and parallel or substantially parallel to a thickness direction and a width direction. A dielectric layer between adjacent internal electrode layers in the thickness direction includes grains including pores. Each of the side margin portions includes a dielectric including grains that do not include pores.

Abstract: A multilayer ceramic capacitor includes an element body portion including dielectric layers and internal electrode layers laminated in a thickness direction, and external electrodes respectively on first and second end surfaces and electrically connected to the internal electrode layers. Each of the internal electrode layers includes an opposing portion opposed to another internal electrode layer, and a lead-out portion connected to the opposing portion and extending to the first or second end surface, a width of the opposing portion is larger than a width of the lead-out portion in the width direction, and a relationship of C1>C2 is satisfied when a continuity of an end portion of the opposing portion in the width direction is defined as C1 and a continuity of an end portion of the lead-out portion in the width direction is defined as C2.

Abstract: A multilayer ceramic capacitor includes an element body portion including dielectric layers and internal electrode layers, and external electrodes. In a cross section of the element body portion extending through a central portion in a length direction, a deviation amount in a width direction between internal electrode layers adjacent to each other in a thickness direction is smaller than about 3 ?m, each of the internal electrode layers includes an opposing portion opposed to the internal electrode layer, and a lead-out portion, a width of the opposing portion is greater than a width of the lead-out portion, a region of the element body portion where the lead-out portions overlap in the thickness direction includes a thick portion thicker than the central portion in the length direction, and end portions of the lead-out portions in the thickness direction deviate by about 3 ?m or more in the width direction.

Abstract: Dielectric layers include outer dielectric layers and inner dielectric layers. The outer dielectric layers are located between a first principal surface and an internal electrode layer located closest to the first principal surface in a thickness direction and between a second principal surface and an internal electrode layer located closest to the second principal surface in the thickness direction. The inner dielectric layers are located between internal electrode layers adjacent to each other in the thickness direction. In an element body portion, side margin portions, which are located in a width direction between a first side surface and a plurality of internal electrode layers and between a second side surface and a plurality of internal electrode layers, have a higher Mn content than the inner dielectric layers.

Abstract: A multilayer ceramic capacitor includes an element body portion including internal electrode layers, and first and second external electrodes. In the internal electrode layers, a width of an opposing portion is larger than a width of a lead-out portion, each of the first and second external electrodes includes a Cu layer on the element body portion including first and second layer portions. The first layer portion has a higher Cu content than the second layer portion, the second layer portion has a higher glass content than the first layer portion. The Cu in the first layer portion is continuous to connect lead-out portions adjacent to each other. In a cross section of the second layer portion extending through a central portion in the width direction and parallel to the thickness and length directions, the glass occupies about 25% or more of an area of the second layer portion.

Abstract: A multilayer ceramic capacitor includes an element body portion including dielectric layers and internal electrode layers including Ni laminated in a thickness direction. In the internal electrode layers, a width of an opposing portion is larger than a width of a lead-out portion. The element body portion includes first, second, and third regions in order from an inside to an outside in the width direction in each of a region from an end portion on one side of the lead-out portion in the width direction to the first side surface and a region from an end portion on another side of the lead-out portion to the second side surface. When grain sizes of dielectrics included in the first, second, and third regions are respectively defined as gr1, gr2, and gr3, a relationship of gr1<gr2<gr3 is satisfied.

Abstract: A multilayer ceramic capacitor includes a multilayer body including an inner layer portion including dielectric layers and internal electrodes, and outer layer portions, two external electrodes each including a foundation electrode layer connected to the internal electrodes, and a conductive resin layer in contact with the foundation electrode layer. An end region of each of the internal electrodes is connected to the foundation electrode layer and is thicker than regions of the respective internal electrodes other than the end region. The internal electrodes include first and second internal electrodes. The first internal electrodes each include a first opposing portion, and a first lead-out portion. The second internal electrodes each include a second opposing portion, and a second lead-out portion. Distances between end regions of the first and second lead-out portions adjacent to each other are shorter than distances between the respective first and second opposing portions adjacent to each other.

Abstract: A multilayer ceramic capacitor includes a multilayer body, and two external electrodes. The multilayer body includes a multilayer body main portion including an inner layer portion including dielectric layers and internal electrode layers that are stacked, and two outer layer portions on opposite sides of the inner layer portion in a stacking direction, two side gap portions on opposite sides of the multilayer main body in a width direction, two main surfaces on opposite sides in the stacking direction, two side surfaces on opposite sides in the width direction, and two end surfaces on opposite sides in a length direction. Each of the two external electrodes are at an end surface of the multilayer body, and extend from the end surface to a portion of the main surface. An end of the side gap portion on a side of the main surface protrudes farther than the multilayer main body.

Abstract: An electronic component includes an electronic element and an interposer board. The electronic element includes a multilayer body and external electrodes each at a respective one of multilayer body end surfaces of the multilayer body and connected to internal electrode layers. The interposer board includes board end surfaces, board side surfaces orthogonal to the board end surfaces, and board main surfaces orthogonal to the board end surface and the board side surface. One of the board main surfaces is located in a vicinity of the electronic element and joined with one of the pair of multilayer body main surfaces in a vicinity of the interposer board. The interposer board is an alumina board. The pair of board end surfaces include a metal layer including a Cu-containing layer and a Cu plated layer on an outer periphery of the Cu-containing layer.

Abstract: A case includes a case body including an accommodation space to accommodate electronic components and a discharge port to accommodate in and discharge the electronic components from the accommodation space, and a shutter slidable in the case body to open and close the discharge port. The case body includes an inner rear wall portion defining the accommodation space. The inner rear wall portion includes a thin portion defining and functioning as a through-hole formation portion at which a through hole may be provided to allow communication between outside of the case body and the accommodation space.

Abstract: An electronic component includes an electronic element and an interposer board. The electronic element includes a multilayer body and external electrodes at multilayer body end surfaces of the multilayer body and connected to internal electrode layers. The interposer board includes board end surfaces, board side surfaces orthogonal to the board end surfaces, and board main surfaces orthogonal to the board end surface and the board side surface. One of the board main surfaces is located in a vicinity of the electronic element and joined with one of the pair of multilayer body main surfaces in the vicinity of the board. The interposer board is an alumina board. The board end surfaces each include a metal layer including a Zn-containing layer and a Cu layer on an outer periphery of the Zn-containing layer.

Abstract: An electronic component includes an electronic element and an interposer board. The electronic element includes a multilayer body and external electrodes at multilayer body end surfaces of the multilayer body and connected to internal electrode layers. The interposer board includes board end surfaces, board side surfaces orthogonal to the board end surfaces, and board main surfaces orthogonal to the board end surfaces and the board side surfaces. One of the board main surfaces is located in a vicinity of the electronic element and joined with one of the multilayer body main surfaces in a vicinity of the interposer board. The interposer board is an alumina board. The board end surfaces include a metal layer including a Pd-containing layer, and an electrolessly-plated layer on an outer periphery of the Pd-containing layer.

Abstract: A multilayer ceramic capacitor includes a multilayer body, two external electrodes, and two wall portions. The multilayer body includes a multilayer main body including an inner layer portion in which dielectric layers and internal electrode layers are stacked, and two outer layer portions on opposite sides of the inner layer portion in a stacking direction, two side gap portions on opposite sides of the multilayer main body in a width direction, two main surfaces on opposite sides in the stacking direction, two side surfaces on opposite sides in the width direction, and two end surfaces on opposite sides in a length direction. The two external electrodes each are provided at one of the two end surfaces of the multilayer body, and each extend from the one of the two end surfaces to a portion of the main surface. The wall portions cover portions of the external electrodes at the two end surfaces, and each include a protruding portion that protrudes from the main surface.

Abstract: A multilayer ceramic capacitor includes a multilayer body including an inner layer portion including dielectric layers and internal electrode layers, and external electrodes on end surfaces of the multilayer body. The internal electrode layers each include a counter electrode portion and an extension electrode portion extending from the counter electrode portion toward the end surface and, when viewing the multilayer body in a cross section parallel to the width direction and the lamination direction, and when a maximum length in the width direction of a range in which one end in the width direction of the counter electrode portions is provided is defined as R1, and a maximum length in the width direction of a range in which one end in the width direction of the extension electrode portions is provided is defined as R2, a relationship between R1 and R2 is R2>R1.

Abstract: An electronic component includes an electronic element and an interposer board. The electronic element includes a multilayer body and external electrodes at multilayer body end surfaces of the multilayer body and connected to internal electrode layers. The interposer board includes board end surfaces, board side surfaces orthogonal to the board end surfaces, and board main surfaces orthogonal to the board end surfaces and the board side surfaces. One of the board main surfaces is located in a vicinity of the electronic element and joined with one of the multilayer body main surfaces in a vicinity of the interposer board. The interposer board is an alumina board. The board end surfaces include a metal layer including a Pd-containing layer, and an electrolessly-plated layer on an outer periphery of the Pd-containing layer.

Abstract: A multilayer ceramic capacitor includes a multilayer body and external electrodes. The multilayer body includes an inner layer portion including dielectric layers and internal electrode layers alternately stacked, and first and second outer layer portions on opposite sides of the inner layer portion in a stacking direction, side gap portions on opposite sides in a width direction, main surfaces on opposite sides in the stacking direction, side surfaces on opposite sides in the width direction, and end surfaces on opposite sides in a length direction. Each external electrode is provided at one end surfaces of the multilayer body, and extends from the end surface to a portion of the main surface. A difference in location between ends at the side surface of two adjacent internal electrode layers is about 0.5 ?m or less. The second outer layer portion is thicker than the first outer layer portion.

Abstract: An electronic component includes a multilayer body including a multilayer main body and side gap portions, the multilayer main body including an inner layer portion including alternatively laminated dielectric layers and internal nickel electrode layers, and including end surfaces in a length direction. The internal nickel electrode layers are exposed at the end surfaces. The side gap portions are on both sides of the multilayer main body in a width direction. External nickel layers are on the end surfaces of the multilayer body. A deviation amount in the width direction between ends of two adjacent internal nickel electrode layers on both side surfaces is within about 0.5 ?m. The external nickel layers are on the end surface of the multilayer body, in a region other than a region including a rounded ridge portion. A thermosetting resin layer including metal filler is outside the external nickel layer.

Abstract: A multilayer ceramic capacitor includes a multilayer body and external electrodes. The multilayer body includes an inner layer portion including dielectric layers and internal electrode layers alternately stacked, and first and second outer layer portions on opposite sides of the inner layer portion in a stacking direction, side gap portions on opposite sides in a width direction, main surfaces on opposite sides in the stacking direction, side surfaces on opposite sides in the width direction, and end surfaces on opposite sides in a length direction. Each external electrode is provided at one end surfaces of the multilayer body, and extends from the end surface to a portion of the main surface. A difference in location between ends at the side surface of two adjacent internal electrode layers is about 0.5 ?m or less. The second outer layer portion is thicker than the first outer layer portion.