Abstract: An electronic component includes a multilayer body including a multilayer main body and side gap portions, the multilayer main body including an inner layer portion including alternatively laminated dielectric layers and internal nickel electrode layers, and including end surfaces in a length direction. The internal nickel electrode layers are exposed at the end surfaces. The side gap portions are on both sides of the multilayer main body in a width direction. External nickel layers are on the end surfaces of the multilayer body. A deviation amount in the width direction between ends of two adjacent internal nickel electrode layers on both side surfaces is within about 0.5 ?m. The external nickel layers are on the end surface of the multilayer body, in a region other than a region including a rounded ridge portion. A thermosetting resin layer including metal filler is outside the external nickel layer.

Abstract: A multilayer ceramic capacitor includes a multilayer body including an inner layer portion including dielectric layers and internal electrodes, and outer layer portions, two external electrodes each including a foundation electrode layer connected to the internal electrodes, and a conductive resin layer in contact with the foundation electrode layer. An end region of each of the internal electrodes is connected to the foundation electrode layer and is thicker than regions of the respective internal electrodes other than the end region. The internal electrodes include first and second internal electrodes. The first internal electrodes each include a first opposing portion, and a first lead-out portion. The second internal electrodes each include a second opposing portion, and a second lead-out portion. Distances between end regions of the first and second lead-out portions adjacent to each other are shorter than distances between the respective first and second opposing portions adjacent to each other.

Abstract: A multilayer ceramic capacitor includes a multilayer body and two external electrodes. The multilayer body includes a multilayer main body including an inner layer portion including dielectric layers and internal electrode layers alternately stacked, and outer layer portions on opposite sides of the inner layer portion in a stacking direction, two side gap portions on opposite sides in a width direction, main surfaces on opposite sides in the stacking direction, side surfaces on opposite sides in the width direction, and end surfaces respectively provided on opposite sides in a length direction. The two external electrodes are provided at the end surfaces, each including a foundation electrode layer in contact with the multilayer body, and a conductive resin layer on the foundation electrode layer. An end region of the internal electrode layers in contact with the foundation electrode layer is thicker than other regions of the internal electrode layers.

Abstract: An electronic component includes a multilayer body including a multilayer main body including end surfaces at which internal nickel electrode layers are exposed, side gap portions, external nickel layers on the end surfaces of the multilayer body, and external copper electrode layers covering the end surfaces on which the external nickel layers are provided. A nickel-based oxide and/or a silicon-based oxide are provided between the external nickel layer and the external copper electrode layer. A nickel layer and a tin layer are provided outside the external copper electrode layer. In a cross section passing through a middle of the electronic component in the width direction and extending in the length direction and the lamination direction, a relationship of about 0.2?Tea/Tem?about 1.1 is satisfied.

Abstract: A multilayer ceramic capacitor includes a multilayer body, and two external electrodes. The multilayer body includes a multilayer body main portion including an inner layer portion including dielectric layers and internal electrode layers that are stacked, and two outer layer portions on opposite sides of the inner layer portion in a stacking direction, two side gap portions on opposite sides of the multilayer main body in a width direction, two main surfaces on opposite sides in the stacking direction, two side surfaces on opposite sides in the width direction, and two end surfaces on opposite sides in a length direction. Each of the two external electrodes are at an end surface of the multilayer body, and extend from the end surface to a portion of the main surface. An end of the side gap portion on a side of the main surface protrudes farther than the multilayer main body.

Abstract: A multilayer ceramic capacitor includes a multilayer body and two external electrodes. The multilayer body includes a multilayer main body including an inner layer portion including dielectric layers and internal electrode layers alternately stacked, and outer layer portions on opposite sides of the inner layer portion in a stacking direction, two side gap portions on opposite sides in a width direction, main surfaces on opposite sides in the stacking direction, side surfaces on opposite sides in the width direction, and end surfaces respectively provided on opposite sides in a length direction. The two external electrodes are provided at the end surfaces, each including a foundation electrode layer in contact with the multilayer body, and a conductive resin layer on the foundation electrode layer. An end region of the internal electrode layers in contact with the foundation electrode layer is thicker than other regions of the internal electrode layers.

Abstract: An electronic component includes a multilayer body including a multilayer main body and side gap portions, the multilayer main body including an inner layer portion including dielectric layers and internal nickel electrode layers laminated alternately therein, and including end surfaces on both sides in a length direction. The internal nickel electrode layers are exposed at the end surfaces. External nickel layers are provided on the end surfaces. External copper electrode layers cover the end surfaces on which the external nickel layers are provided. A deviation amount in the width direction between positions of ends of two adjacent internal nickel electrode layers on both side surfaces is at least about 0.5 ?m. The external nickel layers are provided on the end surface, in a region excluding a rounded ridge portion. Nickel and tin layers are provided outside the external copper electrode layer.

Abstract: An electronic component includes a multilayer body including a multilayer main body including end surfaces at which internal nickel electrode layers are exposed, side gap portions, external nickel layers on the end surfaces of the multilayer body, and external copper electrode layers covering the end surfaces on which the external nickel layers are provided. A nickel-based oxide and/or a silicon-based oxide are provided between the external nickel layer and the external copper electrode layer. A nickel layer and a tin layer are provided outside the external copper electrode layer. In a cross section passing through a middle of the electronic component in the width direction and extending in the length direction and the lamination direction, a relationship of about 0.2?Tea/Tem?about 1.1 is satisfied.

Abstract: A multilayer ceramic capacitor includes a multilayer body, and two external electrodes. The multilayer body includes a multilayer body main portion including an inner layer portion including dielectric layers and internal electrode layers that are stacked, and two outer layer portions on opposite sides of the inner layer portion in a stacking direction, two side gap portions on opposite sides of the multilayer main body in a width direction, two main surfaces on opposite sides in the stacking direction, two side surfaces on opposite sides in the width direction, and two end surfaces on opposite sides in a length direction. Each of the two external electrodes are at an end surface of the multilayer body, and extend from the end surface to a portion of the main surface. An end of the side gap portion on a side of the main surface protrudes farther than the multilayer main body.

Abstract: An electronic component includes a multilayer body including a multilayer main body including internal nickel electrode layers exposed at end surfaces thereof, external nickel layers on the end surfaces of the multilayer body, and external copper electrode layers covering one of the end surfaces. When dimensions of the external nickel layer and the multilayer body are TN and T0, a relationship of TN<T0 is satisfied. When dimensions of the external nickel layer and the multilayer body are WN and W0, a relationship of WN<W0 is satisfied. The internal nickel electrode layers include at least one uncovered region. The internal nickel electrode layers are directly bonded to the external copper electrode layers in the uncovered region. At least one diffusion region is provided in which copper of the external copper electrode layers is diffused.

Abstract: A multilayer ceramic capacitor includes a multilayer body and external electrodes. The multilayer body includes an inner layer portion including dielectric layers and internal electrode layers alternately stacked, and first and second outer layer portions on opposite sides of the inner layer portion in a stacking direction, side gap portions on opposite sides in a width direction, main surfaces on opposite sides in the stacking direction, side surfaces on opposite sides in the width direction, and end surfaces on opposite sides in a length direction. Each external electrode is provided at one end surfaces of the multilayer body, and extends from the end surface to a portion of the main surface. A difference in location between ends at the side surface of two adjacent internal electrode layers is about 0.5 ?m or less. The second outer layer portion is thicker than the first outer layer portion.

Abstract: An electronic component includes an electronic element and an interposer board. The electronic element includes a multilayer body and external electrodes each at a respective one of multilayer body end surfaces of the multilayer body and connected to internal electrode layers. The interposer board includes board end surfaces, board side surfaces orthogonal to the board end surfaces, and board main surfaces orthogonal to the board end surface and the board side surface. One of the board main surfaces is located in a vicinity of the electronic element and joined with one of the pair of multilayer body main surfaces in a vicinity of the interposer board. The interposer board is an alumina board. The pair of board end surfaces include a metal layer including a Cu-containing layer and a Cu plated layer on an outer periphery of the Cu-containing layer.

Abstract: An electronic component includes an electronic element and an interposer board. The electronic element includes a multilayer body and external electrodes at multilayer body end surfaces of the multilayer body and connected to internal electrode layers. The interposer board includes board end surfaces, board side surfaces orthogonal to the board end surfaces, and board main surfaces orthogonal to the board end surfaces and the board side surfaces. One of the board main surfaces is located in a vicinity of the electronic element and joined with one of the multilayer body main surfaces in a vicinity of the interposer board. The interposer board is an alumina board. The board end surfaces include a metal layer including a Pd-containing layer, and an electrolessly-plated layer on an outer periphery of the Pd-containing layer.

Abstract: An electronic component includes an electronic element and an interposer board. The electronic element includes a multilayer body and external electrodes at multilayer body end surfaces of the multilayer body and connected to internal electrode layers. The interposer board includes board end surfaces, board side surfaces orthogonal to the board end surfaces, and board main surfaces orthogonal to the board end surface and the board side surface. One of the board main surfaces is located in a vicinity of the electronic element and joined with one of the pair of multilayer body main surfaces in the vicinity of the board. The interposer board is an alumina board. The board end surfaces each include a metal layer including a Zn-containing layer and a Cu layer on an outer periphery of the Zn-containing layer.

Abstract: A multilayer ceramic capacitor includes a multilayer main body including an inner layer portion including dielectric layers and internal electrode layers alternately stacked, and outer layer portions on both sides of the inner layer portion in a stacking direction, two external electrodes at two end surfaces of the multilayer body in which side gap portions are provided on both sides of the multilayer main body in the width direction, and an interposer on any of the main surfaces, the side surfaces, and the end surfaces of a capacitor main body including the multilayer and the external electrodes. The difference in location between ends at side surfaces of two adjacent internal electrode layers in the stacking direction is about 0.5 ?m or less. In the two side gap portions, a portion in contact with the multilayer main body has a thickness of about 10 ?m or less.

Abstract: A multilayer ceramic capacitor includes a multilayer body and external electrodes. The multilayer body includes an inner layer portion including dielectric layers and internal electrode layers alternately stacked, and first and second outer layer portions on opposite sides of the inner layer portion in a stacking direction, side gap portions on opposite sides in a width direction, main surfaces on opposite sides in the stacking direction, side surfaces on opposite sides in the width direction, and end surfaces on opposite sides in a length direction. Each external electrode is provided at one end surfaces of the multilayer body, and extends from the end surface to a portion of the main surface. A difference in location between ends at the side surface of two adjacent internal electrode layers is about 0.5 ?m or less. The second outer layer portion is thicker than the first outer layer portion.

Abstract: An electronic component includes external nickel layers each provided on end surfaces of a multilayer body and external copper electrode layers each covering the end surfaces on which the external nickel layers are provided. When a dimension of each of the external nickel layers in the lamination direction is defined as TN, and a dimension of the inner layer portion in the lamination direction is defined as T1, T1<TN is satisfied. When a dimension of each of the external nickel layers in the width direction is defined as WN and a dimension of the inner layer portion in the width direction is defined as W1, a relationship of WN<W1 is satisfied, and a relationship of WN<TN is satisfied. The inner layer portion includes at least one uncovered region. The internal and external nickel electrode layers are directly bonded in the uncovered region.

Abstract: An electronic component includes a multilayer body including a multilayer main body including internal nickel electrode layers exposed at end surfaces thereof, external nickel layers on the end surfaces of the multilayer body, and external copper electrode layers covering one of the end surfaces. When dimensions of the external nickel layer and the multilayer body are TN and T0, a relationship of TN<T0 is satisfied. When dimensions of the external nickel layer and the multilayer body are WN and W0, a relationship of WN<W0 is satisfied. The internal nickel electrode layers include at least one uncovered region. The internal nickel electrode layers are directly bonded to the external copper electrode layers in the uncovered region. At least one diffusion region is provided in which copper of the external copper electrode layers is diffused.

Abstract: An electronic component includes a multilayer body including a multilayer main body including end surfaces at which internal nickel electrode layers are exposed, side gap portions, external nickel layers on the end surfaces of the multilayer body, and external copper electrode layers covering the end surfaces on which the external nickel layers are provided. A nickel-based oxide and/or a silicon-based oxide are provided between the external nickel layer and the external copper electrode layer. A nickel layer and a tin layer are provided outside the external copper electrode layer. In a cross section passing through a middle of the electronic component in the width direction and extending in the length direction and the lamination direction, a relationship of about 0.2?Tea/Tem?about 1.1 is satisfied.

Abstract: An electronic component includes a multilayer body including a multilayer main body and side gap portions, the multilayer main body including an inner layer portion including alternatively laminated dielectric layers and internal nickel electrode layers, and including end surfaces in a length direction. The internal nickel electrode layers are exposed at the end surfaces. The side gap portions are on both sides of the multilayer main body in a width direction. External nickel layers are on the end surfaces of the multilayer body. A deviation amount in the width direction between ends of two adjacent internal nickel electrode layers on both side surfaces is within about 0.5 ?m. The external nickel layers are on the end surface of the multilayer body, in a region other than a region including a rounded ridge portion. A thermosetting resin layer including metal filler is outside the external nickel layer.