Abstract: A cleaning member mounting mechanism has: a cleaning member holding part 200, to which a cleaning member assembly 100 having a cleaning member for cleaning a substrate W can be mounted; a member rotation part 180 for rotating the cleaning member assembly 100 held by the cleaning member holding part 200; and a moving part 150 which moves the cleaning member holding part 200 along an axial direction when the cleaning member assembly 100 is removed, thereby to bring the cleaning member holding part 200 into a rotation fixed position to restrict a rotation of the cleaning member holding part 200.

Abstract: An object of the present invention is to detach a substrate from a table without damaging the substrate by lift pins. One embodiment of the present invention provides a substrate processing apparatus having a vacuum suction table adapted to have a substrate placed thereon, and a plurality of lift pins disposed along the outer periphery of the vacuum suction table. The lift pins each have a distal end portion including a substrate guide surface capable of guiding the outer peripheral end surface of the substrate, and a proximal end portion including a substrate holding surface extending from the substrate guide surface outwardly in a radial direction of the lift pin.

Abstract: In-plane uniformity of buff processing is improved. According to a first form, a buff processing device for executing buff processing of a substrate is provided. Such buff processing device has a rotatable shaft, a buff head body, a torque transmission mechanism for transmitting rotation of the shaft to the buff head body, and an elastic member for elastically supporting the buff head body in a longitudinal direction of the shaft.

Abstract: According to one embodiment, provided is a cleaning liquid supplying system including: a circulation line in which cleaning liquid flows, first end of the circulation line being connected to a supply port of a cleaning liquid supplying apparatus, second end of the circulation line being connected to a collection port of the cleaning liquid supplying apparatus; a branch pipe branched from the circulation line and connected to a substrate cleaning unit; a valve provided on the branch pipe and configured to control supply of cleaning liquid from the circulation line to the substrate cleaning unit; and a flow rate adjuster configured to adjust a flow rate of the cleaning liquid flowing in the circulation line.

Abstract: A cleaning apparatus includes: a cleaning tank that defines a cleaning space for cleaning a wafer; a wafer rotation mechanism that is arranged inside the cleaning tank and holds and rotates the wafer; a cleaning member that contacts and cleans a surface of the wafer, is rotatable around a central axis extending in a lateral direction, and has a length in an axial direction longer than a radius of the wafer; a swing mechanism that swings the cleaning member around a swing axis located inside the cleaning tank to move the cleaning member from a retracted position outside of the wafer to a cleaning position directly above the wafer; a second cleaning means that cleans the surface of the wafer; and a second swing mechanism that swings the second cleaning means around a second swing axis located inside the cleaning tank to pass directly above a center of the wafer.

Abstract: A substrate cleaning apparatus has: a substrate rotating part that rotates a substrate; an edge cleaning member for cleaning an edge part of the substrate; an edge rotating part that rotates the edge cleaning member around an edge rotary shaft that extends in a direction orthogonal to a substrate rotary shaft; a moving part that moves a position of the edge cleaning member with respect to the edge part of the substrate; and a control part that controls the moving part to move the position of the edge cleaning member with respect to the edge part of the substrate, and causes the edge cleaning member to clean a one-side edge area including a face on one side, a side face area including a side face, and an another-side edge area including a face on another side in the edge part of the substrate.

Abstract: Provided is a wet substrate processing apparatus for processing a substrate. The apparatus comprises a table for holding a substrate, and a process liquid feeding mechanism for feeding process liquid to the substrate held on the table. The table includes a support face for supporting the substrate, a first opening formed in the support face, a second opening formed in the support face and arranged at least partially around the first opening, a first fluid path configured to extend to the first opening of the support face via the table and be connectable to a vacuum source, and a second fluid path configured to extend to the second opening of the support face via the table and discharge the process liquid.

Abstract: A polishing apparatus is provided. The polishing apparatus includes: a polishing unit configured to polish a substrate by bringing a polishing tool into contact with the substrate and moving the substrate relatively to the polishing tool; a cleaning unit; and a first transfer robot configured to transfer the substrate before polishing to the polishing unit and/or configured to transfer the substrate after polishing from the polishing unit to the cleaning unit. The cleaning unit includes: at least one cleaning module, a buff processing module configured to perform a buff process to the substrate, and a second transfer robot configured to transfer the substrate between the cleaning module and the buff processing module, the second transfer robot being different from the first robot.

Abstract: A substrate cleaning device 1 includes a substrate holding unit 10 configured to hold a substrate W, a first cleaning unit 11 having a first cleaning member 11a caused to come into contact with a first surface WA of the substrate W held by the substrate holding unit 10 to clean the first surface WA, a second cleaning unit 12 having a second cleaning member 12a caused to come into contact with the first surface WA of the substrate W held by the substrate holding unit 10 to clean the first surface WA, and a controller 50 configured to control the first and second cleaning units 11, 12 so that, when any one of the first cleaning member 11a and the second cleaning member 12a cleans the first surface WA of the substrate W held by the substrate holding unit 10, the other cleaning member is at a position apart from the substrate W held by the substrate holding unit 10.

Abstract: A substrate holding apparatus that can minimize a deflection amount of a substrate due to its own weight and can suppress vibration of the substrate at the time of rotation of the substrate even if a diameter of the substrate becomes large is disclosed. The substrate holding apparatus holds a periphery of a substrate and rotates the substrate. The substrate holding apparatus includes a plurality of support posts supported by a base and vertically movable relative to the base, a plurality of chucks respectively provided on the plurality of support posts and configured to hold the periphery of the substrate, and at least one support pin configured to support a lower surface of the substrate held by the plurality of chucks.

Abstract: Exemplary substrate supporting apparatus and method for attaching and/or detaching substrate are provided. In one aspect, substrate supporting apparatus has a plurality of supporting members 10 that contacts a circumferential part of a substrate W and rotate the substrate W; a pair of driven members 30 on which the plurality of supporting members 10 are provided; a connecting member 20 connecting one driven member 31 and another driven member 32; and a driving device 40 that brings the pair of driven members 30 close to each other or separates the pair of driven members 30 from each other, linearly along a first direction, by moving at least a part of the connecting member 20. Numerous other aspects are provided.

Abstract: A substrate support apparatus 100 has a support part 10 for supporting a substrate W; a moving part 50 which is adapted to abut on the support part 10 and to move the support part 10 along an axis direction; a fluid pipe 60 at least a part of which is provided in the moving part 50, through which fluid flows and an outlet port 61 of which is covered by the support part 10 when the moving part 50 abuts on the support part 10; and a detection part 90 which detects a state of the fluid.

Abstract: Various examples of a substrate cleaning apparatus and a substrate processing apparatus are described in the present disclosure. One example of the present invention is a substrate cleaning apparatus including a roll cleaning member cleaning a substrate, an inclination sensor detecting an inclination of the roll cleaning member, and an output device outputting a detection result of the inclination sensor.

Abstract: The cleaning apparatus includes multiple kinds of cleaning modules each configured to perform a cleaning processing of a substrate, a first accommodating section configured to accommodate the multiple kinds of cleaning modules therein, and a fluid supply section configured to supply a fluid to the cleaning modules accommodated in the first accommodating section through a pipe. Each of the multiple kinds of cleaning modules includes a pipe connection portion having a common connection position to be connected with the pipe.

Abstract: A sensor target cover capable of preventing an optical liquid level detection sensor from erroneously detecting a rise in a liquid level is provided. A sensor target cover is used in combination with an optical liquid level detection sensor. The sensor target cover includes a reflecting plate, an inner wall structure surrounding the reflecting plate, and an outer wall structure surrounding the inner wall structure. A gap is formed between the inner wall structure and the outer wall structure.

Abstract: An apparatus for processing a substrate is disclosed. The apparatus includes a polishing section configured to polish a substrate, a transfer mechanism configured to transfer the substrate, and a cleaning section configured to clean and dry the polished substrate. The cleaning section has plural cleaning lines for cleaning plural substrates. The plural cleaning lines have plural cleaning modules and plural transfer robots for transferring the substrates.

Abstract: A substrate cleaning apparatus comprises: a cleaning member 11,21 that comes into contact with a substrate W and cleans the substrate W; a member rotating unit 15, 25 that rotates the cleaning member 11, 21; a pressing drive unit 19, 29 that presses the cleaning member 11, 21 against the substrate W; a torque detecting unit 16, 26 for detecting torque applied to the member rotating unit 15, 25; and a control unit 50 that controls pressing force on the basis of a result of detection by the torque detecting unit 16, 26.

Abstract: A vacuum hole for suction holding a processing target object through vacuum is formed on a stage surface of a vacuum suction holding stage, and a hole corresponding to the vacuum hole is formed on an elastic pad. A jig includes a first projecting portion configured to be insertable into the vacuum hole on the vacuum suction holding stage, a support portion configured to come into contact with the stage surface with the first projecting portion inserted in the vacuum hole, and a second projecting portion projecting toward an opposite side to the first projecting portion with respect to the support portion and configured to be insertable into the hole on the elastic pad.

Abstract: A substrate processing apparatus includes a polisher configured to polish a substrate using a polishing liquid, a first cleaner configured to clean the substrate polished by the polisher using sulfuric acid and hydrogen peroxide water, a second cleaner configured to clean the substrate cleaned by the first cleaner using a basic chemical liquid and hydrogen peroxide water, and a drier configured to dry the substrate cleaned by the second cleaner.

Abstract: An apparatus for processing a substrate is disclosed. The apparatus includes a polishing section configured to polish a substrate, a transfer mechanism configured to transfer the substrate, and a cleaning section configured to clean and dry the polished substrate. The cleaning section has plural cleaning lines for cleaning plural substrates. The plural cleaning lines have plural cleaning modules and plural transfer robots for transferring the substrates.