Abstract: The method for assembling a component on a board is configured by a transfer pressing step that assembles a target gripping location of a component by gripping the target gripping location using a component transfer device, performing positioning, and applying a pressing force to a board side, and a pressing step that simultaneously assembles each corresponding portion of the component by positioning at least two holding claws of a component gripping device in predetermined positions, and applying a pressing force to the component on the board side using each holding claw.

Abstract: A method of allocating electronic components to be mounted to each of a plurality of nozzle holders provided on a mounting head is provided, in which the electronic component which does not have a usage record or the electronic component which is a test target is allocated to a nozzle holder which does not have operation restrictions. An electronic component mounting system is provided with a mounting head which is provided with a plurality of nozzle holders, each of which holds a suction nozzle, and a control device which allocates electronic components to be mounted to each of the plurality of nozzle holders. The control device includes an electronic component allocation section which allocates an electronic component which does not have a usage record or an electronic component which is a test target to a nozzle holder which does not have operation restrictions.

Abstract: A dedicated correction value related to the mounting position of an upper surface recognition component with a characteristic section on an upper surface thereof is memorized in correction value folder 43a of an HDD, and when performing mounting work of mounting the upper surface recognition component on a board, a position deviation amount of the characteristic section is acquired based on an image of the upper surface of the upper surface recognition component captured by a mark camera, and the component is mounted at the mounting position based on the acquired position deviation amount and the dedicated correction value. Accordingly, it is possible to mount the specific component at a corrected mounting position such that the position of the characteristic section is appropriate, thereby improving mounting accuracy for the upper surface recognition component.

Abstract: In an electronic component mounting system, when a change in a recipe (setting data) for a control computer are input in any one of a plurality of circuit board working machines, such as component mounting machines, the control computer reports changed content to a host computer. The host computer, which receives the report, updates the data, which is stored in the DB server, based on the changed content of the recipe. The control computer, which receives input of the change in the recipe, executes a process in which only the partial data, which is updated by the host computer, is acquired among the data items, which are stored in the DB server.

Abstract: A component mounting apparatus is provided with a controller that controls a mounting head. The mounting head is provided with a nozzle holder, a nozzle that is elastically supported to be movable up and down with respect to the nozzle holder, a flange that is provided at a position that is offset from the central axis of the nozzle, and a second engaging section that is able to move the nozzle downward by engaging with the flange and pressing down the flange against the elastic force of a nozzle spring.

Abstract: A mounting device is provided with a first raising and lowering drive section configured to raise and lower an entire syringe member to which a suction nozzle that picks up a component is attached, and a second raising and lowering drive section 34 that raises and lowers the suction nozzle only of the syringe member to which the suction nozzle is attached. The mounting device controls a raising and lowering operation of the first raising and lowering drive section based on height information that includes at least one of information of the thickness of the component and information of the height of a board. With the mounting device, it is possible to move the entire syringe member to which the suction nozzle 28 is attached to a position closer to the board in accordance with the height of the board and the thickness of the component.

Abstract: A mounting control device including an error detection device which detects an error based on image processing data and a component image taken of the component; and a data creation device which creates image processing data based on a component image, is provided. Processing of creating image processing data is performed automatically at a component mounting machine. Accordingly, because an operator does not need to perform work of creating image processing data, the work load on the operator may be reduced, and it is possible to improve work efficiency and productivity.

Abstract: In an electronic component mounting system, when a change in a recipe (setting data) for a control computer are input in any one of a plurality of circuit board working machines, such as component mounting machines, the control computer reports changed content to a host computer. The host computer, which receives the report, updates the data, which is stored in the DB server, based on the changed content of the recipe. The control computer, which receives input of the change in the recipe, executes a process in which only the partial data, which is updated by the host computer, is acquired among the data items, which are stored in the DB server.

Abstract: The method for assembling a component on a board is configured by a transfer pressing step that assembles a target gripping location of a component by gripping the target gripping location using a component transfer device, performing positioning, and applying a pressing force to a board side, and a pressing step that simultaneously assembles each corresponding portion of the component by positioning at least two holding claws of a component gripping device in predetermined positions, and applying a pressing force to the component on the board side using each holding claw.

Abstract: A method of allocating electronic components to be mounted to each of a plurality of nozzle holders provided on a mounting head is provided, in which the electronic component which does not have a usage record or the electronic component which is a test target is allocated to a nozzle holder which does not have operation restrictions. An electronic component mounting system is provided with a mounting head which is provided with a plurality of nozzle holders, each of which holds a suction nozzle, and a control device which allocates electronic components to be mounted to each of the plurality of nozzle holders. The control device includes an electronic component allocation section which allocates an electronic component which does not have a usage record or an electronic component which is a test target to a nozzle holder which does not have operation restrictions.

Abstract: A mounting control device including an error detection device which detects an error based on image processing data and a component image taken of the component; and a data creation device which creates image processing data based on a component image, is provided. Processing of creating image processing data is performed automatically at a component mounting machine. Accordingly, because an operator does not need to perform work of creating image processing data, the work load on the operator may be reduced, and it is possible to improve work efficiency and productivity.