Abstract: Provided is a curable composition for inkjet and air cavity formation, the curable composition capable of forming a cured product layer having a high aspect ratio and capable of enhancing adhesiveness and sealability. A curable composition for inkjet and air cavity formation according to the present invention contains a photocurable compound having a (meth)acryloyl group or a vinyl group and having no cyclic ether group, and a thermosetting compound having no (meth)acryloyl group and having a cyclic ether group, in which a content of the thermosetting compound in 100 wt % of the curable composition for inkjet and air cavity formation is 5 wt % or more, and when a B-staged product is obtained by irradiating the curable composition for inkjet and air cavity formation with light having a wavelength of 365 nm at an illuminance of 2000 mW/cm2, a viscosity at 40° C. of the B-staged product is 2.5×102 Pa·s or more and 3.0×10? Pa·s or less.

Abstract: Provided is an ink-jet adhesive that can suppress adhesion of an adhesive component to an unintended region of a transparent member when the transparent member is used as a member to be bonded. The ink-jet adhesive according to the present invention contains a photocurable compound having a (meth) acryloyl group or a vinyl group and having no cyclic ether group, and a photopolymerization initiator, contains or does not contain a thermosetting compound having no (meth) acryloyl group and having a cyclic ether group, and a content of the thermosetting compound is 5 wt % or less when the ink-jet adhesive contains the thermosetting compound.

Abstract: A valve (10) of an embodiment of the present invention has a tapered section (55) on an opening side of a depression (51a) of a body (1). When a projection (4b) of a ball (4) is inserted into the depression (51a), a part of a tip end edge of the projection (4b) is brought into contact with the tapered section (55), and the tapered section (55) guides the projection (4b) so that the entire circumference of the tip end edge of the projection (4b) is located on a bottom side with respect to the tapered section (55).

Abstract: A radiation transmission inspection method includes: when one side surface of the reel is a side end A and another side surface is a side end B, a first foreign body detection process in which radiation emitted from a first radiation source, incident from the side end A of the film reel, transmitted through the reel, and exited from the side end B is detected by a first detector, and information regarding a foreign body is obtained; and a second foreign body detection process in which radiation emitted from a second radiation source, incident from the side end B of the film reel, transmitted through the reel, and exited from the side end A is detected by a second detector, and information regarding a foreign body is obtained.

Abstract: A method of inspecting a foreign body in a film includes a first detecting process that detects a foreign body on a film with an optical imaging unit and obtaining foreign body information including at least positional plane coordinates information A on the film; a process of winding up the film on a core as the film roll after the first detecting process; a converting process of converting a position of the foreign body on the positional plane coordinates information A into positional information on positional space coordinates information B in the wound film roll; and a second detecting process of using a radiation imaging unit to the film roll, focusing the radiation imaging unit to adjust imaging focus on a targeted foreign body based on the positional space coordinates information B for the foreign body, and emitting radiation to detect and characterize the targeted foreign body.

Abstract: The purpose of the present invention is to provide a metallic copper dispersion: capable of maintaining dispersion stability of metallic copper particles for a long period of time; suitable for inkjet printing, spray coating, or the like; and capable of allowing a metallic copper-containing film having an excellent electrical conductivity and metallic color tone to be manufactured in a simple manner by performing low-temperature heating or plasma irradiation after application. The metallic copper dispersion is a dispersion containing at least an organic solvent, a polymer dispersant, and metallic copper particles having gelatin on the particle surface, wherein the metallic copper particles in the dispersion have a cumulative 50% particle size (D50) of 1-130 nm and a cumulative 90% particle size (D90) of 10-300 nm, and the polymer dispersant has an amine number of 10-150 mgKOH/g.

Abstract: An electronic circuit device and a heat sink structure for the electronic circuit device capable of simultaneously achieving improved space efficiency and safeness are provided. The electronic circuit device includes: a substrate with circuit wiring formed thereon; an electronic component requiring heat dissipation, which is mounted on the substrate; and a heat sink structure configured to dissipate heat radiated by the electronic component requiring heat dissipation. The heat sink structure includes: a contact part to be in direct or indirect contact with the electronic component requiring heat dissipation; a generally tabular heat-dissipating part disposed substantially parallel to the substrate; and a connection part configured to connect between the contact part and the heat-dissipating part.

Abstract: Provided are: metallic copper particles exhibiting excellent low-temperature sintering properties at temperatures equal to or lower than 300° C.; and a production method therefor. In these metallic copper particles, metallic copper fine particles are adhered to the surfaces of large-diameter metallic copper particles. With regard to the metallic copper particles to be produced, copper oxide and hypophosphoric acid and/or a salt thereof are mixed and reduced, preferably in the presence of 1-500 mass % of gelatin and/or collagen peptide. The reduction reaction temperature is preferably in the range of 20-100° C. The produced metallic copper particles have a volume resistivity value when heated to a temperature of 300° C. under a nitrogen atmosphere of 1×10-2 ?·cm or less.

Abstract: An electronic circuit device and a heat sink structure for the electronic circuit device capable of simultaneously achieving improved space efficiency and safeness are provided. The electronic circuit device includes: a substrate with circuit wiring formed thereon; an electronic component requiring heat dissipation, which is mounted on the substrate; and a heat sink structure configured to dissipate heat radiated by the electronic component requiring heat dissipation. The heat sink structure includes: a contact part to be in direct or indirect contact with the electronic component requiring heat dissipation; a generally tabular heat-dissipating part disposed substantially parallel to the substrate; and a connection part configured to connect between the contact part and the heat-dissipating part.

Abstract: The purpose of the present invention is to provide a metallic copper dispersion: capable of maintaining dispersion stability of metallic copper particles for a long period of time; suitable for inkjet printing, spray coating, or the like; and capable of allowing a metallic copper-containing film having an excellent electrical conductivity and metallic color tone to be manufactured in a simple manner by performing low-temperature heating or plasma irradiation after application. The metallic copper dispersion is a dispersion containing at least an organic solvent, a polymer dispersant, and metallic copper particles having gelatin on the particle surface, wherein the metallic copper particles in the dispersion have a cumulative 50% particle size (D50) of 1-130 nm and a cumulative 90% particle size (D90) of 10-300 nm, and the polymer dispersant has an amine number of 10-150 mgKOH/g.

Abstract: There is provided a liquid crystal display device including a liquid crystal display panel and a backlight. The backlight includes a light guide plate with multiple LEDs arranged on a side surface, and a first optical sheet provided on the light guide plate. The first optical sheet has an upper surface, a lower surface, and a side surface on the side of the LEDs. A light shielding area is formed in the side surface of the first optical sheet. By forming the light shielding area, the light from the LED can be prevented from entering the first optical sheet from the side surface. As a result, it is possible to prevent the uneven brightness due to the first optical sheet from occurring in the end portion of the screen.

Abstract: To provide a low-cost wave plate that does not cause any diffracted light and wavefront aberrations. The challenge is met by providing a wave plate characterized by including a first region, a second region, and a third region which are placed on a glass substrate. The first region and the second region exhibit each uniaxial birefringence at least in their portions. The third region exhibits uniaxial birefringence and is interposed between the first region and the second region. Phase advance axes of birefringence of the first region and the second region are substantially parallel to each other. A phase advance axis of birefringence of the third region is substantially orthogonal to the phase advance axes of birefringence of the first and second regions.

Abstract: To provide a process for producing a glass member provided with a sealing material layer, capable of favorably forming a sealing material layer even in a case where the entire glass substrate cannot be heated. A sealing material paste prepared by mixing a sealing material containing a sealing glass and a laser absorbent with an organic binder is applied to a sealing region of a glass substrate 2 in the form of a frame. The frame-form coating layer 8 of the sealing material paste is selectively heated by irradiation with a laser light 9 along the coating layer 8 to fire the sealing material while the organic binder in the coating layer 8 is burnt out to form a sealing material layer 7. Using such a sealing material layer 7, a space between two glass substrates is sealed.

Abstract: To provide a process for producing a glass member provided with a sealing material layer, capable of favorably forming a sealing material layer even in a case where the entire glass substrate cannot be heated. A sealing material paste prepared by mixing a sealing material containing a sealing glass and a laser absorbent with an organic binder is applied to a sealing region of a glass substrate 2 in the form of a frame. The frame-form coating layer 8 of the sealing material paste is selectively heated by irradiation with a laser light 9 along the coating layer 8 to fire the sealing material while the organic binder in the coating layer 8 is burnt out to form a sealing material layer 7. Using such a sealing material layer 7, a space between two glass substrates is sealed.

Abstract: The present invention is to provide a method for smoothing the optical surface having a concave defect of an optical component for EUVL. The present invention relates to a method for smoothing the optical surface of an optical component for EUVL, comprising irradiating, with an excimer laser having a wavelength of 250 nm or less with a fluence of 0.5 to 2.0 J/cm2, the optical surface having a concave defect of an optical component for EUV lithography (EUVL), the optical component being made of a TiO2-containing silica glass material comprising SiO2 as a main component.

Abstract: The present invention provides a method for smoothing an optical surface of an optical component for EUVL. Specifically, the present invention provides a method for smoothing an optical surface of an optical component for EUVL made of a silica glass material containing TiO2 and comprising SiO2 as a main component with a laser having an oscillation wavelength, to which the optical component for EUVL has an absorption coefficient of 0.01 ?m?1 or more, at a fluence of 0.3 to 1.5 J/cm2 in an atmosphere having a water vapor partial pressure of 3.6 mmHg or less.

Abstract: It is an object of the present invention to provide a method and apparatus for efficiently remove bubbles present on a surface of molten glass, which can solve a problem that bubbles remaining on a surface of molten glass are get inside at a time of forming the glass to cause inside bubbles, to thereby provide a glass substrate of good quality, and which can improve productivity of glass substrates; and to provide a process for producing glass employing the above method for removing bubbles. The present invention provides a method for removing bubbles from molten glass, which is a method for removing floating bubbles on a surface of molten glass, wherein a floating bubble on the surface of molten glass is irradiated with at least one laser beam.

Abstract: A magnetic disk device includes a magnetic head assembly, which includes magnetic heads, support plates, and a flexible wiring substrate that are integrally formed. The magnetic heads include heating elements for making head element parts protrude toward magnetic disks by thermal expansion, the support plate supports the magnetic head, the flexible wiring substrate is provided along the support plate and electrically connects the magnetic heads to a circuit system, and the magnetic head assembly and the magnetic disks are assembled in a case. The magnetic disk device includes a sensor and a floating distance control circuit. The sensor detects at least one of atmospheric pressure, temperature, and humidity in the case. The floating distance control circuit increases or decreases current supplied to the heating element on the basis of the output of the sensor and controls the floating distance of the magnetic head so that the floating distance is constant.

Abstract: The present invention relates to a method of manufacturing a semiconductor device including (1) forming a laminated structure on a major surface of a semiconductor substrate, the laminated structure comprising at least a first metal layer that forms a Schottky junction with the semiconductor substrate, a second metal layer primarily composed of aluminum, and a third metal layer primarily composed of molybdenum or titanium, (2) patterning the laminated structure into a predetermined configuration, (3) forming a solder bonding metal layer comprising at least nickel, ion or cobalt on the major surface of the semiconductor substrate having the patterned laminated structure formed thereon, (4) patterning the solder bonding metal layer into a pattern configuration identical to that of the laminated structure, (5) cutting the semiconductor substrate on which the laminated structure and the solder bonding metal layer are patterned to form a plurality of semiconductor chips, and (6) bonding the semiconductor chip to a

Abstract: A semiconductor device comprises: a semiconductor chip; a first frame; a solder layer which bonds the solder bonding metal layer of the semiconductor chip and the first frame; and a second frame bonded to the rear face of the semiconductor chip. The semiconductor chip includes: a semiconductor substrate; a first metal layer provided on a major surface of the semiconductor substrate and forming a Schottky junction with the semiconductor substrate; a second metal layer provided on the first metal layer and primarily composed of aluminum; a third metal layer provided on the second metal layer and primarily composed of molybdenum or titanium; and a solder bonding metal layer provided on the third metal layer and including at least a fourth metal layer which is primarily composed of nickel, iron or cobalt.