Patents by Inventor Mitsuru Watanabe
Mitsuru Watanabe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7869329Abstract: An optical information recording and reproducing apparatus is provided for recording and/or reproducing information on an optical disc including a recording layer in which information can be recorded at recording positions each located at a different distance from a surface of the optical disc. The optical information recording and reproducing apparatus includes: a light source; and an objective lens which can converge the light flux from the light source onto one of the recording positions at a predetermined depth in the recording layer for recording information on the optical disc. When information to be recorded is recorded on one of the recording positions at a predetermined depth in the recording layer, the optical information recording and reproducing apparatus records information about the predetermined depth on one of the plurality of recording positions at the predetermined depth, with the information to be recorded.Type: GrantFiled: August 8, 2008Date of Patent: January 11, 2011Assignee: Konica Minolta Opto, Inc.Inventors: Mitsuru Watanabe, Akira Kunimoto
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Publication number: 20100315704Abstract: The present invention is to provide a method for smoothing the optical surface having a concave defect of an optical component for EUVL. The present invention relates to a method for smoothing the optical surface of an optical component for EUVL, comprising irradiating, with an excimer laser having a wavelength of 250 nm or less with a fluence of 0.5 to 2.0 J/cm2, the optical surface having a concave defect of an optical component for EUV lithography (EUVL), the optical component being made of a TiO2-containing silica glass material comprising SiO2 as a main component.Type: ApplicationFiled: August 18, 2010Publication date: December 16, 2010Applicant: Asahi Glass Company, LimitedInventors: Motoshi Ono, Mitsuru Watanabe, Masabumi Ito
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Patent number: 7778443Abstract: An illumination unit 6 illuminates a scene object (i.e., mail) 2 moved in a predetermined direction by a transport means (transport conveyor) 1, the imaging distance up to the scene object 2 is detected before imaging, and auto-focusing is made according to distance data detected at the time of the imaging.Type: GrantFiled: March 7, 2003Date of Patent: August 17, 2010Assignee: NEC CorporationInventors: Mitsuru Watanabe, Masato Iwakawa, Satoshi Singu, Hisato Kato
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Patent number: 7763692Abstract: An ultraviolet-curing resin composition of (a) 5 to 35 parts by mass of a chlorinated polyolefin with a chlorine content of 15 to 40 mass %, (b) 15 to 60 parts by mass of an alicyclic hydrocarbon mono(meth)acrylate, and (c) 5 to 80 parts by mass of a polypropylene glycol di(meth)acrylate; and, per 100 parts by mass of the total amount of components (a), (b) and (c), (d) 0 to 1100 parts by mass of an aliphatic hydrocarbon di(meth)acrylate and (e) 0 to 600 parts by mass of a polyfunctional monomer having 3 to 6 (meth)acryloyl groups in its molecule; and, per 100 parts by mass of the total amount of components (b), (c), (d) and (e), (f) 1 to 15 parts by mass of a photoinitiator; and the composition as an active ingredient in paints, inks, adhesives, sealing agents and primers.Type: GrantFiled: November 1, 2004Date of Patent: July 27, 2010Assignees: Toyo Kasei Kogyo Company Limited, Osaka Municipal Technical Research InstituteInventors: Toshiyuki Tamai, Mitsuru Watanabe, Kenji Kashihara, Takafumi Masuda
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Publication number: 20100079913Abstract: A magnetic disk device includes a magnetic head assembly, which includes magnetic heads, support plates, and a flexible wiring substrate that are integrally formed. The magnetic heads include heating elements for making head element parts protrude toward magnetic disks by thermal expansion, the support plate supports the magnetic head, the flexible wiring substrate is provided along the support plate and electrically connects the magnetic heads to a circuit system, and the magnetic head assembly and the magnetic disks are assembled in a case. The magnetic disk device includes a sensor and a floating distance control circuit. The sensor detects at least one of atmospheric pressure, temperature, and humidity in the case. The floating distance control circuit increases or decreases current supplied to the heating element on the basis of the output of the sensor and controls the floating distance of the magnetic head so that the floating distance is constant.Type: ApplicationFiled: September 18, 2009Publication date: April 1, 2010Inventors: Kazuhiro Okamoto, Yuki Ono, Yukihiro Gorai, Mitsuru Watanabe, Akihiro Sato, Keitaro Kikuchi
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Publication number: 20100068632Abstract: The present invention provides a method for smoothing an optical surface of an optical component for EUVL. Specifically, the present invention provides a method for smoothing an optical surface of an optical component for EUVL made of a silica glass material containing TiO2 and comprising SiO2 as a main component with a laser having an oscillation wavelength, to which the optical component for EUVL has an absorption coefficient of 0.01 ?m?1 or more, at a fluence of 0.3 to 1.5 J/cm2 in an atmosphere having a water vapor partial pressure of 3.6 mmHg or less.Type: ApplicationFiled: October 21, 2009Publication date: March 18, 2010Applicant: Asahi Glass Company, LimitedInventors: Motoshi ONO, Mitsuru Watanabe, Mika Yokoyama
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Patent number: 7633716Abstract: A magnetic head is provided that is formed by fixedly bonding a slider having a thin-film magnetic element on a flexure formed of metallic material which constitutes a gimbal suspension. The slider includes electrodes conducted to the thin-film magnetic head on an end surface thereof on a trailing side which is orthogonal to the recording-medium-opposed surface. The flexure has independent spacer projections. The slider and the flexure are bonded by an adhesive agent applied to bonding areas on end surfaces of a pair of spacer projections positioned in the vicinity of the end surface of the slider on the trailing side of the spacer projections.Type: GrantFiled: February 13, 2006Date of Patent: December 15, 2009Assignee: TDK CorporationInventor: Mitsuru Watanabe
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Patent number: 7628830Abstract: An electric vacuum cleaner includes a first dust separation device configured to separate sucked dust, a first dust collection section for collecting the separated dust, a second dust separation device configured to separate the dust, a dust removing device configured to remove the dust adhering to the second dust separation device, a second dust collection section for accumulating the removed dust, a partition wall for zoning the first dust collection section and the second dust collection section and an introduction opening for introducing the removed dust into the second dust collection section; the partition wall includes a communication opening for communicating the first dust collection section to the second dust collection section and an opening and closing member for closing either of the introduction opening or the communication opening and switching the closing to the other by rotating, and the opening and closing member closes the introduction opening with a negative pressure by an electric fan andType: GrantFiled: March 29, 2007Date of Patent: December 8, 2009Assignee: Toshiba Tec Kabushiki KaishaInventors: Yasuhiro Ohtsu, Masatoshi Tanaka, Yuji Otsuka, Yukio Machida, Mitsuru Watanabe
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Publication number: 20090193905Abstract: Embodiments of the present disclosure are directed to a package having pressure sensor including a first substrate having a fixed electrode bonded to a second substrate having a movable electrode disposed at a predetermined interval from the fixed electrode, a support substrate with an opening for storing the second substrate, and a resin layer for fixing the pressure sensor and the support substrate. The pressure sensor may be packaged on the support substrate via the first substrate and a bonding member in a state where the second substrate is fit within the opening. The package for the pressure sensor may be sufficiently thin to be employed for the use on a minimum area.Type: ApplicationFiled: October 17, 2007Publication date: August 6, 2009Applicant: Alps Electric Company, Ltd.Inventors: Tetsuya FUKUDA, Katsuya KIKUIRI, Kiyoshi SATO, Mitsuru WATANABE
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Publication number: 20090113938Abstract: It is an object of the present invention to provide a method and apparatus for efficiently remove bubbles present on a surface of molten glass, which can solve a problem that bubbles remaining on a surface of molten glass are get inside at a time of forming the glass to cause inside bubbles, to thereby provide a glass substrate of good quality, and which can improve productivity of glass substrates; and to provide a process for producing glass employing the above method for removing bubbles. The present invention provides a method for removing bubbles from molten glass, which is a method for removing floating bubbles on a surface of molten glass, wherein a floating bubble on the surface of molten glass is irradiated with at least one laser beam.Type: ApplicationFiled: November 6, 2008Publication date: May 7, 2009Applicant: Asahi Glass Company, LimitedInventors: Mitsuru Watanabe, Yutaka Kuroiwa, Motoichi Iga, Setsuro Ito, Yasuji Fukasawa
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Patent number: 7508077Abstract: A semiconductor device comprises: a semiconductor chip; a first frame; a solder layer which bonds the solder bonding metal layer of the semiconductor chip and the first frame; and a second frame bonded to the rear face of the semiconductor chip. The semiconductor chip includes: a semiconductor substrate; a first metal layer provided on a major surface of the semiconductor substrate and forming a Schottky junction with the semiconductor substrate; a second metal layer provided on the first metal layer and primarily composed of aluminum; a third metal layer provided on the second metal layer and primarily composed of molybdenum or titanium; and a solder bonding metal layer provided on the third metal layer and including at least a fourth metal layer which is primarily composed of nickel, ion or cobalt.Type: GrantFiled: July 1, 2005Date of Patent: March 24, 2009Assignee: Kabushiki Kaisha ToshibaInventors: Mitsuru Watanabe, Tetsuya Fukui
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Patent number: 7506548Abstract: A package is mainly formed of a package body having a storage area for storing a pressure sensor, a capacity type pressure sensor stored in the storage area of the package body, a lid seals the package body in which the pressure sensor is stored, an adhesive agent for fixing the pressure sensor to the package body, and a bonding wire for electrically coupling a bonding pad of the pressure sensor and a conductive portion of the package body. An adhesive area of the package body and the pressure sensor is set to the area other than a projection area of the diaphragm of the pressure sensor on a mount bottom surface. This makes it possible to provide the package for the pressure sensor capable of detecting the pressure with high sensitivity although the gap between the substrate and the diaphragm has the value with the magnitude of several ?ms.Type: GrantFiled: October 1, 2007Date of Patent: March 24, 2009Assignee: Alps Electric Co., Ltd.Inventors: Tetsuya Fukuda, Katsuya Kikuiri, Kiyoshi Sato, Mitsuru Watanabe, Yoshinobu Nakamura
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Publication number: 20090046563Abstract: An optical information recording and reproducing apparatus is provided for recording and/or reproducing information on an optical disc including a recording layer in which information can be recorded at recording positions each located at a different distance from a surface of the optical disc. The optical information recording and reproducing apparatus includes: a light source; and an objective lens which can converge the light flux from the light source onto one of the recording positions at a predetermined depth in the recording layer for recording information on the optical disc. When information to be recorded is recorded on one of the recording positions at a predetermined depth in the recording layer, the optical information recording and reproducing apparatus records information about the predetermined depth on one of the plurality of recording positions at the predetermined depth, with the information to be recorded.Type: ApplicationFiled: August 8, 2008Publication date: February 19, 2009Inventors: Mitsuru WATANABE, Akira Kunimoto
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Patent number: 7469590Abstract: A pressure-sensor package mainly includes a pressure sensor, a support substrate, and a resin layer. The pressure sensor includes a glass substrate having a fixed electrode, and a silicon substrate having a diaphragm that is disposed apart from the fixed electrode by a predetermined distance. The support substrate is a silicon/glass composite substrate on which the pressure sensor is mounted such that the support substrate and the diaphragm face each other. The resin layer fixes the pressure sensor and the support substrate together. The pressure sensor is mounted on a mounting area of the support substrate with a joint member therebetween. Accordingly, even if a gap between the support substrate and the diaphragm has a size of about several micrometers, the pressure-sensor package is capable of performing pressure detection with high sensitivity.Type: GrantFiled: October 11, 2007Date of Patent: December 30, 2008Assignee: Alps Electric Co., Ltd.Inventors: Tetsuya Fukuda, Mitsuru Watanabe
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Publication number: 20080224281Abstract: A semiconductor device comprises: a semiconductor chip; a first frame; a solder layer which bonds the solder bonding metal layer of the semiconductor chip and the first frame; and a second frame bonded to the rear face of the semiconductor chip. The semiconductor chip includes: a semiconductor substrate; a first metal layer provided on a major surface of the semiconductor substrate and forming a Schottky junction with the semiconductor substrate; a second metal layer provided on the first metal layer and primarily composed of aluminum; a third metal layer provided on the second metal layer and primarily composed of molybdenum or titanium; and a solder bonding metal layer provided on the third metal layer and including at least a forth metal layer which is primarily composed of nickel, ion or cobalt.Type: ApplicationFiled: May 23, 2008Publication date: September 18, 2008Applicant: KABUSHIKI KAISHA TOSHIBAInventors: Mitsuru WATANABE, Tetsuya Fukui
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Patent number: 7391093Abstract: A semiconductor device has a semiconductor device chip with upper and lower terminal electrodes, and upper and lower frames bonded to the upper and lower terminal electrodes, respectively, with solder material, wherein the semiconductor device chip includes: a semiconductor layer of a first conductivity type; a diffusion layer of a second conductivity type, which is selectively formed in the semiconductor layer; a plurality of guard-ring layers of the second conductivity type, which are formed outside of the diffusion layer in the semiconductor layer; an insulating film formed on the semiconductor layer; and a field plate formed of a poly-crystalline silicon film embedded in the insulating film.Type: GrantFiled: April 6, 2005Date of Patent: June 24, 2008Assignee: Kabushiki Kaisha ToshibaInventors: Mitsuru Watanabe, Tetsuya Fukui
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Publication number: 20080078251Abstract: A package is mainly formed of a package body having a storage area for storing a pressure sensor, a capacity type pressure sensor stored in the storage area of the package body, a lid seals the package body in which the pressure sensor is stored, an adhesive agent for fixing the pressure sensor to the package body, and a bonding wire for electrically coupling a bonding pad of the pressure sensor and a conductive portion of the package body. An adhesive area of the package body and the pressure sensor is set to the area other than a projection area of the diaphragm of the pressure sensor on a mount bottom surface. This makes it possible to provide the package for the pressure sensor capable of detecting the pressure with high sensitivity although the gap between the substrate and the diaphragm has the value with the magnitude of several ?ms.Type: ApplicationFiled: October 1, 2007Publication date: April 3, 2008Inventors: Tetsuya Fukuda, Katsuya Kikuiri, Kiyoshi Sato, Mitsuru Watanabe, Yoshinobu Nakamura
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Patent number: 7320135Abstract: An information serving system includes a broadcasting station module (TV), user module (RV), and advertising agency module (AD). The broadcasting station module (TV) broadcasts pieces of broadcast information including at least video information. The user module (RV) receives the broadcast information, selects an image component composing an image from the received broadcast information, and produces specification information indicative of the selected image component. The user module (RV) transmits the produced specification information, while receiving component information to represent the received component information. The advertising company module (AD) acquires the specification information, and transmits to the user module (RV) the component information indicating an image component specified by the acquired specification information.Type: GrantFiled: December 21, 2001Date of Patent: January 15, 2008Assignee: Pioneer CorporationInventors: Takeshi Nakamura, Michikazu Hashimoto, Hajime Miyasato, Toshio Tabata, Mitsuru Watanabe, Yukitaka Saito
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Publication number: 20070226953Abstract: The vacuum cleaner includes a vacuum cleaner body (20) having a dust collector (60) and an electric blower (33) for producing an intake negative pressure in the dust collector, a filter (100) for separating dust absorbed in the dust collector with air by the negative pressure, and a dust dumping member (304) for dumping the dust attached to the filter by vibrating the filter. Moreover, the vacuum cleaner includes a handle (200) mounted on the vacuum cleaner body for carrying the vacuum cleaner body, the handle being movable in a vertical direction between a storing position and a using position; a storage spring (323) for energizing the handle to the storing position; and a power transmission unit (300A) for driving the dust dumping member by linking with the vertical movement of the handle.Type: ApplicationFiled: March 29, 2007Publication date: October 4, 2007Applicant: Toshiba Tec Kabushiki KaishaInventors: Yasuhiro Ohtsu, Masatoshi Tanaka, Yuji Otsuka, Yukio Machida, Mitsuru Watanabe
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Publication number: 20070226952Abstract: An electric vacuum cleaner includes a first dust separation device configured to separate sucked dust, a first dust collection section for collecting the separated dust, a second dust separation device configured to separate the dust, a dust removing device configured to remove the dust adhering to the second dust separation device, a second dust collection section for accumulating the removed dust, a partition wall for zoning the first dust collection section and the second dust collection section and an introduction opening for introducing the removed dust into the second dust collection section; the partition wall includes a communication opening for communicating the first dust collection section to the second dust collection section and an opening and closing member for closing either of the introduction opening or the communication opening and switching the closing to the other by rotating, and the opening and closing member closes the introduction opening with a negative pressure by an electric fan andType: ApplicationFiled: March 29, 2007Publication date: October 4, 2007Applicant: Toshiba Tec Kabushiki KaishaInventors: Yasuhiro Ohtsu, Masatoshi Tanaka, Yuji Otsuka, Yukio Machida, Mitsuru Watanabe