Abstract: In a composition comprising (A) a reinforcing fiber containing a carbon fiber, (B) a resin particle, and (C) a matrix resin (C), the resin particle (B) comprises a spherical resin particle having an average particle diameter of 12 to 70 ?m. In a composition comprising (A) a reinforcing fiber containing a carbon fiber, (B) a resin particle, and (C) a matrix resin, the resin particle (B) comprises (B1) a spherical small resin particle having a particle diameter less than an average fiber diameter of the reinforcing fiber (A) and (B2) a spherical large resin particle having a particle diameter not less than the average fiber diameter of the reinforcing fiber (A). The reinforcing fiber (A) may particularly comprise a carbon fiber. The resin particle (B) may particularly comprise a polyamide resin particle. The resin particle (B) may have an average particle diameter of 1 to 10 times as large as the average fiber diameter of the reinforcing fiber (A).

Abstract: A thermoplastic resin composition having a high flame retardancy in a thin-wall molded product and a molded article thereof are provided. The thermoplastic resin composition comprises (A) a thermoplastic resin containing a repeating unit having an arylene group, an ether group, and a carbonyl group and (B) a thermoplastic fluorine-containing resin. The weight ratio of the thermoplastic resin (A) and the thermoplastic fluorine-containing resin (B) in the former/the latter is 80/20 to 99/1. The thermoplastic fluorine-containing resin (B) is dispersed in the form of a particle in the thermoplastic resin (A) to form a dispersed phase, and the dispersed phase has an average particle diameter of not more than 3 ?m. The thermoplastic resin composition is suitable for forming a molded article having a thin-wall portion with a thickness of not more than 1.5 mm.

Abstract: A resin powder containing an ultraviolet scattering agent (such as a titanium oxide particle or a zinc oxide particle) is deformed into a plate-like form. The ultraviolet scattering agent may include, for example, a titanium oxide particle or zinc oxide particle having an average particle diameter of not more than 100 nm. A resin contained in the resin powder may particularly be a thermoplastic resin (e.g., a polyamide resin). The plate-like resin powder may be a powder obtainable by deforming resin particles, each containing the ultraviolet scattering agent, into a plate-like form. The resulting resin powder has an excellent ultraviolet scattering function.

Abstract: A resin powder containing an aromatic polyetherketone resin (e.g., a polyetheretherketone) is deformed into a plate-like form, and the resulting powder is used as a resin powder for a coating material. The plate-like resin powder may have an average thickness of, for example, not more than 2 ?m. The coating material may contain a dispersing agent or may be dispersed in a dispersion medium, such as water. The coating material may particularly be used as a coating material for covering a metal substrate. The plate-like resin powder, which comprise an aromatic polyetherketone resin, allows formation of a coating layer which has a high adhesion to a substrate and in which the generation of pinholes is efficiently prevented or reduced.

Abstract: Provided is an additive that increases or improves a light resistance (or whiteness) of a non-fluorinated thermoplastic resin (e.g., a super engineering plastic, such as an aromatic polyamide, a liquid crystal polyester, or an aromatic polyetherketone resin). The additive comprises a fluorine-containing resin and an inorganic white pigment (e.g., titanium oxide). The fluorine-containing resin may be, for example, a fluorine-containing resin comprising a tetrafluoroethylene unit as a monomer unit, in particular, may be a tetrafluoroethylene copolymer (e.g., at least one member selected from the group consisting of a copolymer of tetrafluoroethylene and another fluorinated olefin, a copolymer of tetrafluoroethylene and a fluorinated vinyl ether, and a copolymer of tetrafluoroethylene, another fluorinated olefin and a fluorinated vinyl ether).

Abstract: Provided is an additive that increases or improves a light resistance of anon-fluorinated thermoplastic resin (e.g., a super engineering plastic, such as an aromatic polyamide, a liquid crystal polyester, or an aromatic polyetherketone resin). The additive comprises a fluorine-containing resin. The fluorine-containing resin may be, for example, a fluorine-containing resin comprising a tetrafluoroethylene unit as a monomer unit, in particular, may be a tetrafluoroethylene copolymer (e.g., at least one member selected from the group consisting of a copolymer of tetrafluoroethylene and another fluorinated olefin, a copolymer of tetrafluoroethylene and a fluorinated vinyl ether, and a copolymer of tetrafluoroethylene, another fluorinated olefin and a fluorinated vinyl ether).

Abstract: A thermoplastic resin composition having a high flame retardancy in a thin-wall molded product and a molded article thereof are provided. The thermoplastic resin composition comprises (A) a thermoplastic resin containing a repeating unit having an arylene group, an ether group, and a carbonyl group and (B) a thermoplastic fluorine-containing resin. The weight ratio of the thermoplastic resin (A) and the thermoplastic fluorine-containing resin (B) in the former/the latter is 80/20 to 99/1. The thermoplastic fluorine-containing resin (B) is dispersed in the form of a particle in the thermoplastic resin (A) to form a dispersed phase, and the dispersed phase has an average particle diameter of not more than 3 ?m. The thermoplastic resin composition is suitable for forming a molded article having a thin-wall portion with a thickness of not more than 1.5 mm.

Abstract: A sealant capable of tightly sealing an electric device at a low temperature and a sealing method of using the sealant are provided. The sealant for sealing a device comprises a copolyamide-series resin powder having a particle diameter of not more than 1 mm. The copolyamide-series resin powder contains at least a fine particle (e.g., a copolyamide-series resin particle having an average particle diameter of 20 to 400 ?m), or may contain the fine particle in combination with a coarse particle (e.g., a copolyamide-series resin particle having an average particle diameter of 450 to 800 ?m). The copolyamide-series resin may be a crystalline resin. The copolyamide-series resin may have a melting point or softening point of 75 to 160° C. The copolyamide-series resin may be, e.g., a binary or ternary copolymer.

Abstract: A paste sealant capable of shortening sealing and molding cycles in spite of containing an aqueous medium and a sealing method of using the sealant are provided. The paste sealant for molding and sealing a device comprises a copolyamide-series resin and an aqueous medium. The copolyamide-series resin may be a crystalline resin. The copolyamide-series resin may have a melting point or softening point of 75 to 160° C. The copolyamide-series resin may be a multiple copolymer, e.g., a binary or ternary copolymer. Further, the copolyamide-series resin may contain a unit derived from a long-chain component having a C8-16alkylene group (at least one component selected from the group consisting of a C9-17lactam and an aminoC9-17alkanecarboxylic acid). The paste sealant may further contain a thickener [e.g., a (meth)acrylic polymer].

Abstract: Thermoplastic resin composition providing improved molding efficiency due to high flowability and a high crystallization temperature, while ensuring desired physical properties (e.g., strength) in a molded product. Also, molded product of the composition. The thermoplastic resin composition comprises a plurality of thermoplastic resins having a melt viscosity different from each other and containing a unit which comprises an arylene group and an ether group and/or a carbonyl group. The thermoplastic resin composition may comprise a first thermoplastic resin having a melt viscosity of 150 to 1500 Pa·s at a temperature of 400° C. and a shear rate of 1216 s?1 and a second thermoplastic resin, wherein the melt viscosity ratio of the first thermoplastic resin relative to the second thermoplastic resin, at a temperature of 400° C. and a shear rate of 1216 s?1, is 1.5:1 to 10:1.

Abstract: A thermoplastic resin composition of which the molding efficiency can be improved by a high flowability and a high crystallization temperature while ensuring desired physical properties (e.g., strength) in a molded product, and a molded product of the composition are provided. The thermoplastic resin composition comprises a plurality of thermoplastic resins having a melt viscosity different from each other and containing a unit which comprises an arylene group and an ether group and/or a carbonyl group; when the thermoplastic resin composition at least comprises a first thermoplastic resin having a melt viscosity of 150 to 1500 Pa·s at a temperature of 400° C. and a shear rate of 1216 s?1, and a second thermoplastic resin, and the melt viscosity ratio of the first thermoplastic resin relative to the second thermoplastic resin at a temperature of 400° C. and a shear rate of 1216 s?1 [the former/the latter] is 1.5/1 to 10/1.

Abstract: A thermoplastic resin composition of which the molding efficiency can be improved by a high flowability and a high crystallization temperature while ensuring desired physical properties (e.g., strength) in a molded product, and a molded product of the composition are provided. The thermoplastic resin composition comprises a plurality of thermoplastic resins having a melt viscosity different from each other and containing a unit which comprises an arylene group and an ether group and/or a carbonyl group; when the thermoplastic resin composition at least comprises a first thermoplastic resin having a melt viscosity of 150 to 1500 Pa·s at a temperature of 400° C. and a shear rate of 1216 s?1, and a second thermoplastic resin, and the melt viscosity ratio of the first thermoplastic resin relative to the second thermoplastic resin at a temperature of 400° C. and a shear rate of 1216 s?1 [the former/the latter] is 1.5/1 to 10/1.

Abstract: A sheet for forming a shoe sole, useful for efficiently joining a crosslinked rubber layer as a stud and a thermoplastic elastomer layer as a sole, is provided. The sheet comprises a resin component (A) containing a polyamide resin (a) and having an amino group concentration of not less than 10 mmol/kg and a flexural modulus of not less than 300 MPa in accordance with ISO178. The polyamide resin (a) may contain a polyamide resin having a melting point of not less than 165° C. at a predetermined concentration (e.g., not less than 30% by weight) in the total polyamide resin (a).

Abstract: A sealant capable of tightly sealing an electric device at a low temperature and a sealing method of using the sealant are provided. The sealant for molding and sealing a device comprises a copolyamide-series resin powder. The copolyamide-series resin may be a crystalline resin. The copolyamide-series resin may have a melting point or softening point of 75 to 160° C. The copolyamide-series resin may be a multiple copolymer, e.g., a binary or ternary copolymer. Further, the copolyamide-series resin may contain a unit derived from a long-chain component having a C8-16alkylene group (at least one component selected from the group consisting of a C9-17lactam and an aminoC9-17alkanecarboxylic acid).

Abstract: In a molded composite article, a resin member comprising a non-urethane thermoplastic resin and a resin member comprising a thermoplastic polyurethane resin are directly joined with each other. The non-urethane thermoplastic resin comprises at least one member selected from the group consisting of a polyamide component having an alicyclic ring and an amino group-containing compound, or each of the non-urethane thermoplastic resins and the thermoplastic polyurethane has a polyether segment. Even if the base resin is a non-urethane thermoplastic resin, the present invention provides a direct and firm bonding between the non-urethane thermoplastic resin member and the thermoplastic polyurethane resin member.

Abstract: A thermoplastic resin composition of which the molding efficiency can be improved by a high flowability and a high crystallization temperature while ensuring desired physical properties (e.g., strength) in a molded product, and a molded product of the composition are provided. The thermoplastic resin composition comprises a plurality of thermoplastic resins having a melt viscosity different from each other and containing a unit which comprises an arylene group and an ether group and/or a carbonyl group; when the thermoplastic resin composition at least comprises a first thermoplastic resin having a melt viscosity of 150 to 1500 Pa·s at a temperature of 400° C. and a shear rate of 1216 s?1, and a second thermoplastic resin, and the melt viscosity ratio of the first thermoplastic resin relative to the second thermoplastic resin at a temperature of 400° C. and a shear rate of 1216 s?1 [the former/the latter] is 1.5/1 to 10/1.

Abstract: The present invention is directed to a composite comprising a resin element comprising a resin composition and a vulcanized rubber element formed by vulcanizing an unvulcanized rubber, wherein the resin composition comprises a resin, a vulcanization-activating agent for improving adhesiveness of the resin to a rubber, and a stabilizer, and the resin composition and the vulcanized rubber are directly joined together.

Abstract: A resin composition comprises a resin, a vulcanization-activating agent, and a stabilizer. The vulcanization-activating agent may be a compound having a plurality of polymerizable unsaturated bonds (e.g., a compound having a plurality of (meth)acryloyl groups). The stabilizer may be an antioxidant, or a light stabilizer (particularly, a stabilizer is capable of capturing a radical). Use of the resin composition as a resin material ensures to directly join between a resin and a rubber certainly and firmly. The proportion of the vulcanization-activating agent may be about 0.1 to 10 parts by weight relative to 100 parts by weight of the resin. The proportion of the stabilizer may be about 0.01 to 5 parts by weight relative to 100 parts by weight of the resin. The present invention provides a resin composition excellent in adhesiveness to a rubber.

Abstract: A resin composition comprises a resin, a vulcanization-activating agent, and a stabilizer. The vulcanization-activating agent may be a compound having a plurality of polymerizable unsaturated bonds (e.g., a compound having a plurality of (meth)acryloyl groups). The stabilizer may be an antioxidant, or a light stabilizer (particularly, a stabilizer is capable of capturing a radical). Use of the resin composition as a resin material ensures to directly join between a resin and a rubber certainly and firmly. The proportion of the vulcanization-activating agent may be about 0.1 to 10 parts by weight relative to 100 parts by weight of the resin. The proportion of the stabilizer may be about 0.01 to 5 parts by weight relative to 100 parts by weight of the resin. The present invention provides a resin composition excellent in adhesiveness to a rubber.

Abstract: In a molded composite article formed by directly bonding a resin member comprising a polyamide-series resin to a resin member comprising a thermoplastic polyurethane-series resin, the polyamide-series resin comprises a polyamide block copolymer containing (A) a polyether segment having at least one terminal imino group. The polyamide-series resin may comprise a polyamide-series resin having a free amino group in a concentration of not less than about 10 mmol/kg. The molded composite article is producible, for example, by heating at least one of the polyamide-series resin and the thermoplastic polyurethane-series resin to bond the former to the latter. Thus obtained molded composite article is suitable for a member of a shoe and an industrial roll. In such a process, the polyamide-series resin member and the thermoplastic polyurethane-series resin member both of which are different in nature from each other can be directly and firmly bonded together.