Abstract: An embodiment includes an ultrasonic sensor system comprising: a backend material stack including a first metal layer between a substrate and a second metal layer with each of the first and second metal layers including a dielectric material; a ultrasonic sensor including a chamber, having a negative air pressure, that is sealed by first and second electrodes coupled to each other with first and second sidewalls; an interconnect, not included in the sensor, in the second metal layer; wherein (a) a first vertical axis intersects the substrate, the chamber, and the first and second electrodes, (b) a second vertical axis intersects the interconnect and the substrate, (c) a first horizontal axis intersects the chamber, the interconnect, and the first and second sidewalls, and (d) the first and second electrodes and the first and second sidewalls each include copper and each are included in the second metal layer.

Abstract: Described is an integrated circuit (IC) with a phase locked loop with capability of fast locking. The IC comprises: a node to provide a reference clock; a digitally controlled oscillator (DCO) to generate an output clock; a divider coupled to the DCO, the divider to divide the output clock and to generate a feedback clock; and control logic operable to reset the DCO and the divider, and operable to release reset in synchronization with the reference clock. An apparatus for zeroing phase error is provided which comprises a first node to provide a reference clock; a second node to provide a feedback clock; a time-to-digital converter, coupled to the first and second nodes, to measure phase error between the reference and feedback clocks; a digital loop filter; and a control unit to adjust the measured phase error, and to provide the adjusted phase error to the digital loop filter.

Abstract: Methods and systems may provide for detecting a location of an adjacent ultrasonic receiver of a battery powered device relative to a charging surface of a contactless charger. The charging surface may include an ultrasonic array of transmitter sub arrays, wherein one or more of the transmitter sub arrays may be selectively activated based on the location to focus an ultrasonic beam on the adjacent ultrasonic receiver. In one example, a movement of the adjacent ultrasonic receiver may be detected and the focus of the ultrasonic beam is adjusted in response to the movement.

Abstract: Embodiments of the present disclosure provide self-calibrated thermal sensors of an integrated circuit (IC) die and associated techniques and configurations. In one embodiment, a self-calibrating thermal sensing device includes a resonator configured to oscillate at a frequency corresponding with a temperature of circuitry of an integrated circuit (IC) die, wherein the resonator is thermally coupled with the circuitry and configured to operate in a first mode and a second mode and logic operatively coupled with the resonator, and configured to calculate a first temperature corresponding with a first frequency of the resonator in the first mode using a first equation, calculate a second temperature corresponding with a second frequency of the resonator in the second mode using a second equation, and add an offset to the first equation and the second equation based on a result of a comparison of the first temperature and the second temperature. Other embodiments may be described and/or claimed.

Abstract: A MEMS device, such as an accelerometer or gyroscope, fabricated in interconnect metallization compatible with a CMOS microelectronic device. In embodiments, a proof mass has a first body region utilizing a thick metal layer that is separated from a thin metal layer. The thick metal layer has a film thickness that is significantly greater than that of the thin metal layer for increased mass. The proof mass further includes a first sensing structure comprising the thin metal layer, but lacking the thick metal layer for small feature sizes and increased capacitive coupling to a surrounding frame that includes a second sensing structure comprising the thin metal layer, but also lacking the thick metal layer. In further embodiments, the frame is released and includes regions with the thick metal layer to better match film stress-induced static deflection of the proof mass.

Abstract: Embodiments of the present disclosure provide self-calibrated thermal sensors of an integrated circuit (IC) die and associated techniques and configurations. In one embodiment, a self-calibrating thermal sensing device includes a resonator configured to oscillate at a frequency corresponding with a temperature of circuitry of an integrated circuit (IC) die, wherein the resonator is thermally coupled with the circuitry and configured to operate in a first mode and a second mode and logic operatively coupled with the resonator, and configured to calculate a first temperature corresponding with a first frequency of the resonator in the first mode using a first equation, calculate a second temperature corresponding with a second frequency of the resonator in the second mode using a second equation, and add an offset to the first equation and the second equation based on a result of a comparison of the first temperature and the second temperature. Other embodiments may be described and/or claimed.

Abstract: Described is an integrated circuit (IC) with a phase locked loop with capability of fast locking. The IC comprises: a node to provide a reference clock; a digitally controlled oscillator (DCO) to generate an output clock; a divider coupled to the DCO, the divider to divide the output clock and to generate a feedback clock; and control logic operable to reset the DCO and the divider, and operable to release reset in synchronization with the reference clock. An apparatus for zeroing phase error is provided which comprises a first node to provide a reference clock; a second node to provide a feedback clock; a time-to-digital converter, coupled to the first and second nodes, to measure phase error between the reference and feedback clocks; a digital loop filter; and a control unit to adjust the measured phase error, and to provide the adjusted phase error to the digital loop filter.

Abstract: Described herein is apparatus and system for a digitally controlled oscillator (DCO). The apparatus comprises a voltage regulator to provide an adjustable power supply; and a DCO to generate an output clock signal, the DCO including one or more delay elements, each delay element operable to change its propagation delay via the adjustable power supply, wherein each delay element comprising an inverter with adjustable drive strength, wherein the inverter is powered by the adjustable power supply. The apparatus further comprises a digital controller to generate a first signal for instructing the voltage regulator to adjust a voltage level of the adjustable power supply.

Abstract: Methods and systems may provide for a hybrid RF MEMS component design including an electrostatic actuation and a piezoelectric actuation. In one example, the method may include applying a first voltage to generate a first piezoelectric force to reduce a first gap between a cantilever and an actuation electrode, and applying a second voltage to generate an electrostatic force to create contact between the cantilever and a transmission electrode.

Abstract: An apparatus, touch controller, and system for adaptive touch scanning is described herein. The apparatus includes logic to calculate a distance traveled between two consecutive touch samples, and logic to compare the distance traveled with a target distance to find an actual error. The apparatus also includes logic to update the scan rate based on the actual error.

Abstract: Described herein is apparatus and system for a digitally controlled oscillator (DCO). The apparatus comprises a voltage regulator to provide an adjustable power supply; and a DCO to generate an output clock signal, the DCO including one or more delay elements, each delay element operable to change its propagation delay via the adjustable power supply, wherein each delay element comprising an inverter with adjustable drive strength, wherein the inverter is powered by the adjustable power supply. The apparatus further comprises a digital controller to generate a first signal for instructing the voltage regulator to adjust a voltage level of the adjustable power supply.

Abstract: A MEMS device, such as an accelerometer or gyroscope, fabricated in interconnect metallization compatible with a CMOS microelectronic device. In embodiments, a proof mass has a first body region utilizing a thick metal layer that is separated from a thin metal layer. The thick metal layer has a film thickness that is significantly greater than that of the thin metal layer for increased mass. The proof mass further includes a first sensing structure comprising the thin metal layer, but lacking the thick metal layer for small feature sizes and increased capacitive coupling to a surrounding frame that includes a second sensing structure comprising the thin metal layer, but also lacking the thick metal layer. In further embodiments, the frame is released and includes regions with the thick metal layer to better match film stress-induced static deflection of the proof mass.

Abstract: A Micro-Electro-Mechanical System (MEMS) accelerometer employing a rotor and stator that are both released from a substrate. In embodiments, the rotor and stator are each of continuous a metal thin film. A stress gradient in the film is manifested in capacitive members of the rotor and stator as a substantially equal deflection such that a relative displacement between the rotor and stator associated with an acceleration in the z-axis is substantially independent of the stress gradient. In embodiments, the stator comprises comb fingers cantilevered from a first anchor point while the rotor comprises comb fingers coupled to a proof mass by torsion springs affixed to the substrate at second anchor points proximate to the first anchor point.

Abstract: A MEMS device, such as an accelerometer or gyroscope, fabricated in interconnect metallization compatible with a CMOS microelectronic device. In embodiments, a proof mass has a first body region utilizing a thick metal layer that is separated from a thin metal layer. The thick metal layer has a film thickness that is significantly greater than that of the thin metal layer for increased mass. The proof mass further includes a first sensing structure comprising the thin metal layer, but lacking the thick metal layer for small feature sizes and increased capacitive coupling to a surrounding fame that includes a second sensing structure comprising the thin metal layer, but also lacking the thick metal layer. In further embodiments, the frame is released and includes regions with the thick metal layer to better match film stress-induced static deflection of the proof mass.

Abstract: A MEMS device, such as an accelerometer or gyroscope, fabricated in interconnect metallization compatible with a CMOS microelectronic device. In embodiments, a proof mass has a first body region utilizing a thick metal layer that is separated from a thin metal layer. The thick metal layer has a film thickness that is significantly greater than that of the thin metal layer for increased mass. The proof mass further includes a first sensing structure comprising the thin metal layer, but lacking the thick metal layer for small feature sizes and increased capacitive coupling to a surrounding fame that includes a second sensing structure comprising the thin metal layer, but also lacking the thick metal layer. In further embodiments, the frame is released and includes regions with the thick metal layer to better match film stress-induced static deflection of the proof mass.

Abstract: An electronic device may include a display, and a laser reception device to receive a laser beam and to provide power based on the received laser beam.

Abstract: Methods and systems may provide for detecting a location of an adjacent ultrasonic receiver of a battery powered device relative to a charging surface of a contactless charger. The charging surface may include an ultrasonic array of transmitter sub arrays, wherein one or more of the transmitter sub arrays may be selectively activated based on the location to focus an ultrasonic beam on the adjacent ultrasonic receiver. In one example, a movement of the adjacent ultrasonic receiver may be detected and the focus of the ultrasonic beam is adjusted in response to the movement.

Abstract: Methods and systems may provide for a system having a flexible substrate, an ultrasonic transducer array coupled to the flexible substrate and a processor coupled to the ultrasonic transducer array. The processor may identify a fingerprint based on a signal from the ultrasonic transducer array. The system may also include an external component having a curved profile, wherein the ultrasonic transducer array is embedded in the external component and includes a read surface that conforms to the curved profile. In one example, the external component includes a button having a function that is separate from identification of the fingerprint.

Abstract: An apparatus, touch controller, and system for adaptive touch scanning is described herein. The apparatus includes logic to calculate a distance traveled between two consecutive touch samples, and logic to compare the distance traveled with a target distance to find an actual error. The apparatus also includes logic to update the scan rate based on the actual error.

Abstract: A Micro-Electro-Mechanical System (MEMS) accelerometer employing a rotor and stator that are both released from a substrate. In embodiments, the rotor and stator are each of continuous a metal thin film. A stress gradient in the film is manifested in capacitive members of the rotor and stator as a substantially equal deflection such that a relative displacement between the rotor and stator associated with an acceleration in the z-axis is substantially independent of the stress gradient. In embodiments, the stator comprises comb fingers cantilevered from a first anchor point while the rotor comprises comb fingers coupled to a proof mass by torsion springs affixed to the substrate at second anchor points proximate to the first anchor point.