Abstract: Embodiments of the present disclosure provide self-calibrated thermal sensors of an integrated circuit (IC) die and associated techniques and configurations. In one embodiment, a self-calibrating thermal sensing device includes a resonator configured to oscillate at a frequency corresponding with a temperature of circuitry of an integrated circuit (IC) die, wherein the resonator is thermally coupled with the circuitry and configured to operate in a first mode and a second mode and logic operatively coupled with the resonator, and configured to calculate a first temperature corresponding with a first frequency of the resonator in the first mode using a first equation, calculate a second temperature corresponding with a second frequency of the resonator in the second mode using a second equation, and add an offset to the first equation and the second equation based on a result of a comparison of the first temperature and the second temperature. Other embodiments may be described and/or claimed.

Abstract: Described is an integrated circuit (IC) with apparatus for dynamically adapting a clock generator, e.g., phase locked loop (PLL), with respect to changes in power supply. The apparatus comprises: a voltage droop detector coupled to power supply node, the voltage droop detector to generate a digital code word representing voltage droop on the power supply node; and a PLL including a ring oscillator coupled to the power supply node, the ring oscillator to generate an output clock signal, the ring oscillator operable to adjust frequency of the output clock signal according to the digital code word.

Abstract: Methods and apparatuses for Micro-Electro-Mechanical Systems (MEMS) resonator to monitor temperature in an integrated circuit. Fabricating the resonator in an interconnect layer provides a way to implement thermal detection means which is tolerant of manufacturing process variations. Sensor readout and control circuits can be on silicon if desired, for example, a positive feedback amplifier to form an oscillator in conjunction with the resonator and a counter to count oscillator frequency.

Abstract: Methods and apparatuses for Micro-Electro-Mechanical Systems (MEMS) resonator to monitor the platform temperature. Fabricating the resonator on a relatively low cost flexible polymer substrate rather than silicon provides mechanical flexibility as well as design flexibility with respect to sensor placement. Sensor readout and control circuits can be on silicon if desired, for example, a positive feedback amplifier to form an oscillator in conjunction with the resonator and a counter to count oscillator frequency.

Abstract: Methods and systems may provide for a hybrid RF MEMS component design including an electrostatic actuation and a piezoelectric actuation. In one example, the method may include applying a first voltage to generate a first piezoelectric force to reduce a first gap between a cantilever and an actuation electrode, and applying a second voltage to generate an electrostatic force to create contact between the cantilever and a transmission electrode.

Abstract: Described herein is apparatus and system for a digitally controlled oscillator (DCO). The apparatus comprises a voltage regulator to provide an adjustable power supply; and a DCO to generate an output clock signal, the DCO including one or more delay elements, each delay element operable to change its propagation delay via the adjustable power supply, wherein each delay element comprising an inverter with adjustable drive strength, wherein the inverter is powered by the adjustable power supply. The apparatus further comprises a digital controller to generate a first signal for instructing the voltage regulator to adjust a voltage level of the adjustable power supply.

Abstract: Methods and apparatuses for Micro-Electro-Mechanical Systems (MEMS) resonator to monitor the platform temperature. Fabricating the resonator on a relatively low cost flexible polymer substrate rather than silicon provides mechanical flexibility as well as design flexibility with respect to sensor placement. Sensor readout and control circuits can be on silicon if desired, for example, a positive feedback amplifier to form an oscillator in conjunction with the resonator and a counter to count oscillator frequency.

Abstract: Methods and apparatuses for Micro-Electro-Mechanical Systems (MEMS) resonator to monitor temperature in an integrated circuit. Fabricating the resonator in an interconnect layer provides a way to implement thermal detection means which is tolerant of manufacturing process variations. Sensor readout and control circuits can be on silicon if desired, for example, a positive feedback amplifier to form an oscillator in conjunction with the resonator and a counter to count oscillator frequency.

Abstract: Systems and methods associated with automated semiconductor fabrication device yield analysis are described. One embodiment includes a computing system that includes a working file storage system that stores files corresponding to semiconductor fabrication test devices. The working file storage system may include working directories and executable flows corresponding to working directories. The computing system also includes a data controller that may select a working directory, transfer an input file to the selected working directory, and execute a flow to process an input file and to produce an output file. The output file may include a yield analysis based on data provided by a semiconductor fabrication test device.

Abstract: A micromechanical resonator device and a method of making the micromechanical resonator device, as well as other extensional mode devices are provided wherein anchor losses are minimized by anchoring at one or more side nodal points of the resonator device. Lower damping forces are experienced by the resonator device when operated in air.

Abstract: A micromechanical resonator device and a method of making the micromechanical resonator device, as well as other extensional mode devices are provided wherein anchor losses are minimized by anchoring at one or more side nodal points of the resonator device. Lower damping forces are experienced by the resonator device when operated in air.