Patents by Inventor Mohammad Akhavain
Mohammad Akhavain has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7480994Abstract: A fluid ejection head of a fluid ejection device is provided, the fluid ejection head having a substrate, a fluid ejection die coupled with the substrate, an electromagnetic radiation-curable adhesive disposed on the substrate, and a cover coupled with the substrate via the electromagnetic radiation-curable adhesive, wherein the cover includes an opening configured to pass fluids ejected from the fluid ejection die, and wherein the cover is made at least partially of a material transparent to electromagnetic radiation.Type: GrantFiled: February 16, 2007Date of Patent: January 27, 2009Assignee: Hewlett-Packard Development Company, L.P.Inventors: Benjamin H. Wood, III, Joseph E. Scheffelin, Noah Lassar, Mohammad Akhavain
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Patent number: 7338149Abstract: The described embodiments relate to methods and systems for forming and protecting electrical interconnect assemblies. In one embodiment, an electrical interconnect assembly forming method forms an electrical interconnect between one or more conductors of a first support structure and one or more conductors of a second support structure. The method also distributes a generally flowable material over the electrical interconnect and exposes the generally flowable material to conditions sufficient to render the generally flowable material into a generally non-flowable state that provides fluid protection to the electrical interconnect and supports the electrical interconnect to reduce stress concentration at the electrical interconnect.Type: GrantFiled: June 24, 2005Date of Patent: March 4, 2008Assignee: Hewlett-Packard Development Company, L.P.Inventors: Mohammad Akhavain, Joseph E. Scheffelin, Noah Lassar, Conrad Lepe
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Publication number: 20070169342Abstract: In an implementation of connection pad layouts, a connection assembly includes a substrate assembly and connection pads disposed thereon. The connection pads form a configuration such that each connection pad is configured to align with a different terminal of an interconnect that is warped or otherwise has a non-linear alignment of terminals.Type: ApplicationFiled: March 23, 2007Publication date: July 26, 2007Inventors: Noah Lassar, Mohammad Akhavain, Michael Martin
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Publication number: 20070153048Abstract: A fluid ejection head of a fluid ejection device is provided, the fluid ejection head having a substrate, a fluid ejection die coupled with the substrate, an electromagnetic radiation-curable adhesive disposed on the substrate, and a cover coupled with the substrate via the electromagnetic radiation-curable adhesive, wherein the cover includes an opening configured to pass fluids ejected from the fluid ejection die, and wherein the cover is made at least partially of a material transparent to electromagnetic radiation.Type: ApplicationFiled: February 16, 2007Publication date: July 5, 2007Inventors: Benjamin Wood, Joseph Scheffelin, Noah Lassar, Mohammad Akhavain
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Patent number: 7211736Abstract: In an implementation of connection pad layouts, a connection assembly includes a substrate assembly and connection pads disposed thereon. The connection pads form a configuration such that each connection pad is configured to align with a different terminal of an interconnect that is warped or otherwise has a non-linear alignment of terminals.Type: GrantFiled: October 31, 2003Date of Patent: May 1, 2007Assignee: Hewlett-Packard Development Company, L.P.Inventors: Noah Lassar, Mohammad Akhavain, Michael Martin
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Patent number: 7188925Abstract: A fluid ejection head of a fluid ejection device is provided, the fluid ejection head having a substrate, a fluid ejection die coupled with the substrate, an electromagnetic radiation-curable adhesive disposed on the substrate, and a cover coupled with the substrate via the electromagnetic radiation-curable adhesive, wherein the cover includes an opening configured to pass fluids ejected from the fluid ejection die, and wherein the cover is made at least partially of a material transparent to electromagnetic radiation.Type: GrantFiled: January 30, 2004Date of Patent: March 13, 2007Assignee: Hewlett-Packard Development Company, L.P.Inventors: Benjamin H. Wood, III, Joseph E. Scheffelin, Noah Lassar, Mohammad Akhavain
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Patent number: 7103969Abstract: The described embodiments relate to methods and systems for forming die packages. In one exemplary embodiment, the method for forming die packages contacts interface areas of a die assembly to keep the interface areas free of an insulative material. The method distributes a flowable insulative material around portions of the die assembly.Type: GrantFiled: December 19, 2003Date of Patent: September 12, 2006Assignee: Hewlett-Packard Development Company, L.P.Inventors: Frank J. Bretl, Gary Powell, Donald L. Michael, Jefferson P. Ward, Joseph E. Scheffelin, Mohammad Akhavain
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Patent number: 6983539Abstract: In one form of the invention, a laser beam propagates directly through bulk material of a TAB tape or base, to heat and form a bond between electrical leads formed on the base and aligned contact bumps. In another form, a chromium seed-metal layer is formed on a TAB tape or base, and leads are in turn formed on the chromium; the chromium absorbs a laser beam to heat the leads. In both forms, an optical fiber preferably presses copper leads and gold bumps together with over 300 g force, without aid by a gas stream—and then also conducts the beam to the bond site, forming a bond of shear strength over 200 g. Also preferably gold contacts are plated on the leads; and the method makes an inkjet printhead—with the bumps formed on a die or other printhead component, and nozzles formed through the base.Type: GrantFiled: June 3, 2002Date of Patent: January 10, 2006Assignee: Hewlett-Packard Development Company, L.P.Inventors: Mohammad Akhavain, Ghassem Azdasht
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Publication number: 20050248617Abstract: The described embodiments relate to methods and systems for forming and protecting electrical interconnect assemblies. In one embodiment, an electrical interconnect assembly forming method forms an electrical interconnect between one or more conductors of a first support structure and one or more conductors of a second support structure. The method also distributes a generally flowable material over the electrical interconnect and exposes the generally flowable material to conditions sufficient to render the generally flowable material into a generally non-flowable state that provides fluid protection to the electrical interconnect and supports the electrical interconnect to reduce stress concentration at the electrical interconnect.Type: ApplicationFiled: June 24, 2005Publication date: November 10, 2005Inventors: Mohammad Akhavain, Joseph Scheffelin, Noah Lassar, Conrad Lepe
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Patent number: 6951778Abstract: Methods and systems of protecting substrates that are intended for use in fluidic devices are described. In accordance with one embodiment, sealant material is applied over one or more edges of at least one multi-chip module substrate that is intended for use in a fluidic device. At least one edge has an exposed electrical interconnect and the sealant material is applied over less than an entirety of the substrate and sufficiently to cover the exposed electrical interconnect. The sealant material is exposed to conditions effective to seal the one or more edges.Type: GrantFiled: October 31, 2002Date of Patent: October 4, 2005Assignee: Hewlett-Packard Development Company, L.P.Inventors: Mohammad Akhavain, Stanley G. Markwell, Janis Horvath, Joseph E. Scheffelin
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Publication number: 20050168513Abstract: A fluid ejection head of a fluid ejection device is provided, the fluid ejection head having a substrate, a fluid ejection die coupled with the substrate, an electromagnetic radiation-curable adhesive disposed on the substrate, and a cover coupled with the substrate via the electromagnetic radiation-curable adhesive, wherein the cover includes an opening configured to pass fluids ejected from the fluid ejection die, and wherein the cover is made at least partially of a material transparent to electromagnetic radiation.Type: ApplicationFiled: January 30, 2004Publication date: August 4, 2005Inventors: Benjamin Wood, Joseph Scheffelin, Noah Lassar, Mohammad Akhavain
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Patent number: 6913343Abstract: The described embodiments relate to methods and systems for forming and protecting electrical interconnect assemblies. In one embodiment, an electrical interconnect assembly forming method forms an electrical interconnect between one or more conductors of a first support structure and one or more conductors of a second support structure. The method also distributes a generally flowable material over the electrical interconnect and exposes the generally flowable material to conditions sufficient to render the generally flowable material into a generally non-flowable state that provides fluid protection to the electrical interconnect and supports the electrical interconnect to reduce stress concentration at the electrical interconnect.Type: GrantFiled: April 30, 2003Date of Patent: July 5, 2005Assignee: Hewlett-Packard Development Company, L.P.Inventors: Mohammad Akhavain, Joseph E. Scheffelin, Noah Lassar, Conrad Lepe
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Publication number: 20050094382Abstract: In an implementation of connection pad layouts, a connection assembly includes a substrate assembly and connection pads disposed thereon. The connection pads form a configuration such that each connection pad is configured to align with a different terminal of an interconnect that is warped or otherwise has a non-linear alignment of terminals.Type: ApplicationFiled: October 31, 2003Publication date: May 5, 2005Inventors: Noah Lassar, Mohammad Akhavain, Michael Martin
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Patent number: 6843552Abstract: A printhead assembly includes a carrier having a first side and a second side contiguous with the first side, a plurality of printhead dies each mounted on the first side of the carrier, an electrical circuit including a first portion disposed on the first side of the carrier and a second portion disposed on the second side of the carrier, and a plurality of electrical connectors each electrically coupled to the first portion of the electrical circuit and one of the printhead dies. The electrical circuit has a plurality of openings defined in the first portion thereof such that each of the openings are sized to accommodate one of the printhead dies, and has a first side facing the carrier and a second side opposite the first side thereof such that each of the electrical connectors are electrically coupled to the second side of the electrical circuit and one of the printhead dies.Type: GrantFiled: May 5, 2003Date of Patent: January 18, 2005Assignee: Hewlett-Packard Development Company, L.P.Inventors: David McElfresh, Noah Carl Lassar, Mohammad Akhavain, Brian J. Keefe, Joseph E. Scheffelin, Janis Horvath, Dale Dean Timm, Jr.
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Publication number: 20040218009Abstract: The described embodiments relate to methods and systems for forming and protecting electrical interconnect assemblies. In one embodiment, an electrical interconnect assembly forming method forms an electrical interconnect between one or more conductors of a first support structure and one or more conductors of a second support structure. The method also distributes a generally flowable material over the electrical interconnect and exposes the generally flowable material to conditions sufficient to render the generally flowable material into a generally non-flowable state that provides fluid protection to the electrical interconnect and supports the electrical interconnect to reduce stress concentration at the electrical interconnect.Type: ApplicationFiled: April 30, 2003Publication date: November 4, 2004Inventors: Mohammad Akhavain, Joseph E. Scheffelin, Noah Lassar, Conrad Lepe
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Publication number: 20040128831Abstract: The described embodiments relate to methods and systems for forming die packages. In one exemplary embodiment, the method for forming die packages contacts interface areas of a die assembly to keep the interface areas free of an insulative material. The method distributes a flowable insulative material around portions of the die assembly.Type: ApplicationFiled: December 19, 2003Publication date: July 8, 2004Inventors: Frank J. Bretl, Gary Powell, Donald L. Michael, Jefferson P. Ward, Joseph E. Scheffelin, Mohammad Akhavain
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Patent number: 6705705Abstract: A fluid ejection assembly includes a substrate and a plurality of fluid ejection devices each mounted on the substrate. The substrate includes a frame formed of a first material and a body formed of a second material such that the body substantially surrounds the frame and forms a first side and a second side of the substrate with each of the fluid ejection devices being mounted on the first side of the substrate.Type: GrantFiled: August 28, 2002Date of Patent: March 16, 2004Assignee: Hewlett-Packard Development Company, L.P.Inventors: Janis Horvath, Brian J. Keefe, Joseph E. Scheffelin, Mohammad Akhavain, David K. McElfresh, Noah Carl Lassar
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Patent number: 6698092Abstract: The described embodiments relate to methods and systems for forming die packages. In one exemplary embodiment, the method for forming die packages contacts interface areas of a die assembly to keep the interface areas free of an insulative material. The method distributes a flowable insulative material around portions of the die assembly.Type: GrantFiled: October 31, 2001Date of Patent: March 2, 2004Assignee: Hewlett-Packard Development Company, L.P.Inventors: Frank J. Bretl, Gary Powell, Donald L. Michael, Jefferson P. Ward, Joseph E. Scheffelin, Mohammad Akhavain
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Publication number: 20030202047Abstract: A wide-array inkjet printhead assembly includes a carrier having a first side and a second side contiguous with the first side, and a plurality of printhead dies each mounted on the first side of the carrier. An electrical circuit is disposed on the first side and the second side of the carrier. As such, a plurality of electrical connectors are each electrically coupled to the electrical circuit and one of the printhead dies.Type: ApplicationFiled: May 5, 2003Publication date: October 30, 2003Inventors: David McElfresh, Noah Carl Lassar, Mohammad Akhavain, Brian J. Keefe, Joseph E. Scheffelin, Janis Horvath, Dale Dean Timm
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Patent number: 6575559Abstract: A carrier for a plurality of fluid ejection devices includes a substrate and a substructure. The substrate includes a first material and has a first side adapted to receive the fluid ejection devices and a second side opposite the first side, and the substructure is formed of a second material and joined to the second side of the substrate with a lap joint. The lap joint includes a first portion formed by a portion of one of the substrate and the substructure, a second portion formed by a portion of the other of the substrate and the substructure, and a third material interposed between the first portion and the second portion.Type: GrantFiled: October 31, 2001Date of Patent: June 10, 2003Assignee: Hewlett-Packard Development Company, L.P.Inventors: David K McElfresh, Mohammad Akhavain, Joseph E Scheffelin, Gerald V Rapp, Janis Horvath