Abstract: A wide-array inkjet printhead assembly includes a carrier having a first side and a second side contiguous with the first side, and a plurality of printhead dies each mounted on the first side of the carrier. An electrical circuit is disposed on the first side and the second side of the carrier. As such, a plurality of electrical connectors are each electrically coupled to the electrical circuit and one of the printhead dies.

Abstract: The described embodiments relate to methods and systems for forming die packages. In one exemplary embodiment, the method for forming die packages contacts interface areas of a die assembly to keep the interface areas free of an insulative material. The method distributes a flowable insulative material around portions of the die assembly.

Abstract: A printhead assembly includes a carrier including a substrate and a substructure, and a plurality of printhead dies each mounted on the substrate of the carrier. The substrate includes a first material and the substructure is formed of a second material. As such, the substrate and the substructure are joined by a lap joint.

Abstract: A method of forming an inkjet printhead assembly includes providing a substrate, disposing a planarization layer on a face of the substrate such that a first surface of the planarization layer contacts the face of the substrate, mechanically planarizing a second surface of the planarization layer opposite the first surface, including reducing a thickness of at least a portion of the first planarization layer, and mounting a plurality of printhead dies on the second surface of the planarization layer.

Abstract: This disclosure describes a method for the solderless electrical connection of two contact elements by using a laser light beam attached to a fiber optic system which directs the light to the spot to be bonded. By using a fiber optic system the laser beam is optimally converted into thermal energy and bad connections due to underheating or destruction of the contacts due to overheating does not occur. The method and apparatus provides rapid, reproducible bonding even for the smallest of contact geometries. For example, the method of the invention results in solderless gold to gold compression bonding of conductive leads contained in a polymer flex circuit tape, such as a polyimide, without damaging the tape. A strong solderless gold to gold bond can be formed between the gold plated copper lead on the flex circuit tape and a gold plated pad on a semiconductor chip without the need for a window in the flex circuit and without any damage to the tape.

Abstract: The disclosure describes a method for predicting and avoiding bad bonds or connections when performing electrical connection of two electrical conductors by using a laser light beam attached to an optical fiber system which directs the light to the spot to be bonded. The method provides for rapid detection of damaged optical fibers before bad bonds or connections occur. Disclosed is a method for predicting and avoiding bad bonds or connections when performing solderless electrical connection of two contact elements by using a laser light beam attached to a optical fiber system which directs the light to the spot to be bonded.

Abstract: An inkjet printhead assembly includes a carrier and a plurality of printhead dies each mounted on the carrier. Each of the printhead dies has a nozzle region including a nominal nozzle region and an alignment nozzle region disposed laterally of the nominal nozzle region such that the nozzle region and, more specifically, the nominal and alignment nozzle regions facilitate alignment between the printhead dies.

Abstract: A wide-array inkjet printhead assembly includes a carrier having a first side and a second side contiguous with the first side, and a plurality of printhead dies each mounted on the first side of the carrier. An electrical circuit is disposed on the first side and the second side of the carrier. As such, a plurality of electrical connectors are each electrically coupled to the electrical circuit and one of the printhead dies.

Abstract: A wide-array inkjet printhead assembly includes a carrier and a plurality of printhead dies each mounted on the carrier. The carrier includes a substructure and a substrate mounted on the substructure. The substrate includes a plurality of layers and has a plurality of conductive paths extending therethrough. As such, each of the printhead dies are mounted on the substrate and electrically coupled to at least one of the conductive paths of the substrate.

Abstract: A carrier adapted to support at least one printhead die includes a substrate having at least one surface and at least one datum attached to the at least one surface of the substrate. The substrate includes a first material and the at least one datum is formed from a blank including a second material. As such, the at least one datum is adapted to position the carrier in at least one dimension.

Abstract: An inkjet printhead assembly includes a substrate having a non-planar surface and a plurality of adhesive quantities each disposed on the non-planar surface of the substrate. As such, a plurality of printhead dies are each adhered to the non-planar surface of the substrate by one of the adhesive quantities. A thickness of at least one of the adhesive quantities varies from the thickness of another of the adhesive quantities such that the thickness of the adhesive quantities compensates for the non-planar surface of the substrate. Thus, the adhesive quantities support the printhead dies and establish a substantially coplanar relationship among the printhead dies.

Abstract: A method is provided for the solderless electrical connection of two contact elements by using a laser light beam attached to a fiber optic system which directs the light to the spot to be bonded. By using a fiber optic system the laser beam is optimally converted into thermal energy and bad connections due to underheating or destruction of the contacts due to overheating does not occur. The method and apparatus provides rapid, reproducible bonding even for the smallest of contact geometries. For example, the method of the invention results in solderless gold to gold compression bonding of conductive leads contained in a polymer flex circuit tape, such as a polyimide, without damaging the tape. A strong solderless gold to gold bond can be formed between the gold plated copper lead on the flex circuit tape and a gold plated pad on a semiconductor chip without the need for a window in the flex circuit and without any damage to the tape.

Abstract: An inkjet printing system includes a mounting assembly and an inkjet printhead assembly. The mounting assembly includes a plurality of datums and the inkjet printhead assembly includes a carrier and a plurality of printhead dies each mounted on the carrier. The inkjet printhead assembly is mounted in the mounting assembly such that the carrier contacts at least one of the datums. Thus, positioning of the carrier relative to the mounting assembly is established.

Abstract: The disclosure describes a method for predicting and avoiding bad bonds or connections when performing electrical connection of two electrical conductors by using a laser light beam attached to an optical fiber system which directs the light to the spot to be bonded. The method provides for rapid detection of damaged optical fibers before bad bonds or connections occur. Disclosed is a method for predicting and avoiding bad bonds or connections when performing solderless electrical connection of two contact elements by using a laser light beam attached to a optical fiber system which directs the light to the spot to be bonded.

Abstract: The disclosure describes a method for predicting and avoiding bad bonds or connections when performing electrical connection of two electrical conductors by using a laser light beam attached to an optical fiber system which directs the light to the spot to be bonded. The method provides for rapid detection of damaged optical fibers before bad bonds or connections occur. Disclosed is a method for predicting and avoiding bad bonds or connections when performing solderless electrical connection of two contact elements by using a laser light beam attached to a optical fiber system which directs the light to the spot to be bonded.

Abstract: An integrated circuit module having microscopic self-alignment features comprises: 1) an integrated circuit chip having a plurality of input/output pads in a pattern on a surface thereof; 2) an interconnect member having a surface which includes input/output pads in a pattern that matches the pattern of pads on the integrated circuit chip; and, 3) one of the surfaces has a predetermined number of holes of one-half to fifty mils deep and the other surface has a predetermined number of protrusions of one-half to fifty mils high which are shaped to fit into the holes and prevent the surfaces from sliding on each other when the input/output pads on both of the surfaces are aligned.