Abstract: In an example of a method for three-dimensional (3D) printing, build material layers are patterned to form an intermediate structure. During patterning, a binding agent is selectively applied to define: a build material support structure and a patterned intermediate part. Also during patterning, i) the binding agent and a separate agent including a gas precursor or ii) a combined agent including a binder and the gas precursor are selectively applied to define a patterned breakable connection between at least a portion of the build material support structure and at least a portion patterned intermediate part. The intermediate structure is heated to a temperature that activates the gas precursor to create gas pockets in the patterned breakable connection.

Abstract: A three-dimensional printing kit can include a binder fluid, a gas-precursor fluid, and a particulate build material including metal particles. The binder fluid can include latex particles and an aqueous liquid vehicle. The gas-precursor fluid can include carbon black pigment dispersed in a second aqueous liquid vehicle.

Abstract: In an example of a method for three-dimensional printing, a first amount of a binding agent is selectively applied, based on a 3D object model, to individual build material layers of a particulate build material including metal particles to forming an intermediate structure. The binding agent and/or a void-formation agent is selectively applied, based on the 3D object model, to at least one interior layer of the individual build material layers so that a total amount of the binding agent, the void-formation agent, or both the binding agent and the void-formation agent in the at least one of the individual build material layers is greater than the first amount. This patterns an area that is to contain voids. The intermediate structure is heated to form a 3D structure including a void-containing breakable connection.

Abstract: A three-dimensional printing kit can include a binder fluid and a particulate build material. The particulate build material can include metal particles in an amount from about 95 wt % to about 99.995 wt % and carbon black particles in an amount from about 0.005 wt % to about 2 wt %, wherein weight percentages are based on a total weight of the particulate build material.

Abstract: A three-dimensional printing kit can include a binder fluid and a particulate build material. The particulate build material can include from about 80 wt % to 100 wt % metal particles that can have a D50 particle size distribution from about 1 ?m to about 150 ?m, wherein the metal particles of the particulate build material can include surface-irradiated metal particles, and wherein the particulate build material can exhibit a water contact angle from 0° to about 25°.

Abstract: In a three-dimensional (3D) printing method example, a metallic build material is applied. A binder fluid is selectively applied on at least a portion of the metallic build material. The binder fluid includes a liquid vehicle and polymer particles dispersed in the liquid vehicle. The application of the metallic build material and the selective application of the binder fluid are repeated to create a patterned green part. The patterned green part is heated to at about a melting point of the polymer particles to activate the binder fluid and create a cured green part. The cured green part is heated to a thermal decomposition temperature of the polymer particles to create an at least substantially polymer-free gray part. The at least substantially polymer-free gray part is heated to a sintering temperature to form a metallic part.

Abstract: An example of a method, for three-dimensional (3D) printing, includes applying a build material and patterning at least a portion of the build material. The patterning includes selectively applying a wetting amount of a binder fluid on the at least the portion of the build material and subsequently selectively applying a remaining amount of the binder fluid on the at least the portion of the build material. An area density in grams per meter square meter (gsm) of the wetting amount ranges from about 2 times less to about 30 times less than area density in gsm of the remaining amount.

Abstract: A device for forming spherical particles may include a receiving chamber having a heating portion and a cooling portion. Wire segments may travel in a free fall through the receiving chamber. While falling through the heating portion, wire segments may be heated to form spherical particles in response to exposure to microwave electromagnetic radiation. While falling through the cooling portion, formed spherical particles cool.

Abstract: An apparatus is disclosed to create a breakaway junction for 3D printed parts. Powder is spread along a target zone, such as a build bed. A liquid functional agent is selectively dispensed upon the powder to form a 3D object, a supporting part, and the breakaway junction between them.

Abstract: An example of a kit for three-dimensional (3D) printing includes a host metal and fumed flow additive aggregates to be mixed with the host metal. The fumed flow additive aggregates include flow additive nanoparticles and partially fused necks between at least some of the flow additive nanoparticles. Each of the flow additive nanoparticles consists of a metal containing compound that is reducible to an elemental metal in a reducing environment at a reducing temperature less than or equal to a sintering temperature of the host metal.

Abstract: In one example, a processor readable medium having instructions thereon that when executed cause an additive manufacturing machine to vary operating characteristics of a fusing laser beam at multiple different voxel locations in a layer of build material according to an energy dosage to be applied at each voxel location in an object slice, including multiple different energy dosages for corresponding multiple different voxel locations in the slice.

Abstract: A thin film stack can include a metal substrate having a thickness of from 200 angstroms to 5000 angstroms and a passivation barrier disposed on the metal substrate at a thickness of from 600 angstroms to 1650 angstroms. The passivation barrier can include a dielectric layer and an atomic layer deposition (ALD) layer disposed on the dielectric layer. The dielectric layer can have a thickness of from 550 to 950 angstroms. The ALD layer can have a thickness from 50 to 700 angstroms.

Abstract: An example of a composition includes a host metal present in an amount ranging from about 95.00 weight percent to about 99.99 weight percent, based on a total weight of the composition. A flow additive is present in an amount ranging from about 0.01 weight percent to about 5.00 weight percent, based on the total weight of the composition. The flow additive consists of a metal containing compound that is reducible to an elemental metal in a reducing environment at a reducing temperature less than or equal to a sintering temperature of the host metal. The elemental metal is capable of being incorporated into a bulk metal phase of the host metal in a final metal object. The composition is spreadable, having a Hausner Ratio less than 1.25.

Abstract: In an example of a method for three-dimensional (3D) printing, build material layers are patterned to form an intermediate structure. During patterning, a binding agent is selectively applied to define a patterned intermediate part. Also during patterning, i) the binding agent and a separate agent including a gas precursor are, or ii) a combined agent including a binder and the gas precursor is, selectively applied to define a build material support structure adjacent to at least a portion of the patterned intermediate part. The intermediate structure is heated to a temperature that activates the gas precursor to create gas pockets in the build material support structure.

Abstract: An example of a composition includes a host metal present in an amount ranging from about 95.00 weight percent to about 99.99 weight percent, based on a total weight of the composition. A flow additive is also present in an amount ranging from about 0.01 weight percent to about 5.00 weight percent, based on the total weight of the composition. The flow additive consists of an organic material that is pyrolyzable at a pyrolysis temperature that is less than a sintering temperature of the host metal. The composition is spreadable, having a Hausner Ratio less than 1.25.

Abstract: An example of a method for making a build material composition for three-dimensional (3D) printing includes freezing a dispersion of flow additive nanoparticles in a liquid to form a frozen liquid containing the flow additive nanoparticles. The frozen liquid containing the flow additive nanoparticles is lyophilized to form flow additive agglomerates having a porous, fractal structure. The flow additive agglomerates are mixed with a host metal. The flow additive nanoparticles have an average flow additive particle size ranging from about 1 to about 3 orders of magnitude smaller than an average host metal particle size of the host metal.

Abstract: A system for isolating a failed resistor in a liquid dispensing system including a fusible links described. The system includes drive circuitry to drive a voltage supply to a resistor. The fusible link is disposed between a field effect transistor (FET) and the resistor. The fusible link is to fuse apart upon failure of the resistor.

Abstract: According to an example, a printhead including a thin film passivation layer, an adhesion layer, and a fluidics layer; wherein the thin film passivation layer is an atomic layer deposition thin film layer is disclosed.

Abstract: In some examples, to form a fluid ejection device, a thermal resistor is formed on a substrate, a nitride layer is formed over the thermal resistor, and an oxide layer is formed over the nitride layer using atomic layer deposition (ALD) at a temperature greater than 250° Celsius, where the nitride layer and the oxide layer make up a passivation layer to protect the thermal resistor.

Abstract: A thin film stack can include a metal substrate having a thickness of from 200 angstroms to 5000 angstroms and a passivation barrier disposed on the metal substrate at a thickness of from 600 angstroms to 1650 angstroms. The passivation barrier can include a dielectric layer and an atomic layer deposition (ALD) layer disposed on the dielectric layer. The dielectric layer can have a thickness of from 550 to 950 angstroms. The ALD layer can have a thickness from 50 to 700 angstroms.